JPH0472651U - - Google Patents

Info

Publication number
JPH0472651U
JPH0472651U JP1990116188U JP11618890U JPH0472651U JP H0472651 U JPH0472651 U JP H0472651U JP 1990116188 U JP1990116188 U JP 1990116188U JP 11618890 U JP11618890 U JP 11618890U JP H0472651 U JPH0472651 U JP H0472651U
Authority
JP
Japan
Prior art keywords
semiconductor device
view
chip
circuit board
wiring pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990116188U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990116188U priority Critical patent/JPH0472651U/ja
Publication of JPH0472651U publication Critical patent/JPH0472651U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5475—Dispositions of multiple bond wires multiple bond wires connected to common bond pads at both ends of the wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/926—Multiple bond pads having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図は本考案の第１実施例を示す半導体装置
の平面図、第２図はその正面図、第３図は本考案
の第２実施例を示す半導体装置の平面図、第４図
はその正面図、第５図は本考案の第３実施例を示
す半導体装置の平面図、第６図はその正面図、第
７図は本考案の第４実施例を示す半導体装置の平
面図、第８図は本考案の第５実施例を示す半導体
装置の平面図、第９図は従来の半導体装置の平面
図、第１０図はその正面図である。 １１……回路基板、１２……配線パターン、１
３……ＩＣチツプ、１４……パツド、１５……ボ
ンデイングワイヤ。

Claims (1)

    【実用新案登録請求の範囲】
  1. ＩＣチツプのパツド位置を集積回路基板上に形
    成された配線パターンに応じて変更したことを特
    徴とする半導体装置。
JP1990116188U 1990-11-07 1990-11-07 Pending JPH0472651U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990116188U JPH0472651U (ja) 1990-11-07 1990-11-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990116188U JPH0472651U (ja) 1990-11-07 1990-11-07

Publications (1)

Publication Number Publication Date
JPH0472651U true JPH0472651U (ja) 1992-06-26

Family

ID=31864006

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990116188U Pending JPH0472651U (ja) 1990-11-07 1990-11-07

Country Status (1)

Country Link
JP (1) JPH0472651U (ja)

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