JPH02115478U - - Google Patents
Info
- Publication number
- JPH02115478U JPH02115478U JP2316189U JP2316189U JPH02115478U JP H02115478 U JPH02115478 U JP H02115478U JP 2316189 U JP2316189 U JP 2316189U JP 2316189 U JP2316189 U JP 2316189U JP H02115478 U JPH02115478 U JP H02115478U
- Authority
- JP
- Japan
- Prior art keywords
- card
- base
- molding material
- semiconductor device
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 9
- 239000012778 molding material Substances 0.000 claims 4
- 239000000463 material Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2316189U JPH02115478U (2) | 1989-03-01 | 1989-03-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2316189U JPH02115478U (2) | 1989-03-01 | 1989-03-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02115478U true JPH02115478U (2) | 1990-09-14 |
Family
ID=31241924
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2316189U Pending JPH02115478U (2) | 1989-03-01 | 1989-03-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02115478U (2) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012119558A (ja) * | 2010-12-02 | 2012-06-21 | Sony Corp | 半導体装置及びその製造方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59224151A (ja) * | 1983-06-03 | 1984-12-17 | Nec Corp | 半導体装置 |
| JPS63185689A (ja) * | 1987-01-28 | 1988-08-01 | 三菱電機株式会社 | 薄型半導体カ−ド |
| JPH01253494A (ja) * | 1988-04-02 | 1989-10-09 | Hitachi Ltd | 半導体装置およびその製造方法 |
-
1989
- 1989-03-01 JP JP2316189U patent/JPH02115478U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59224151A (ja) * | 1983-06-03 | 1984-12-17 | Nec Corp | 半導体装置 |
| JPS63185689A (ja) * | 1987-01-28 | 1988-08-01 | 三菱電機株式会社 | 薄型半導体カ−ド |
| JPH01253494A (ja) * | 1988-04-02 | 1989-10-09 | Hitachi Ltd | 半導体装置およびその製造方法 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012119558A (ja) * | 2010-12-02 | 2012-06-21 | Sony Corp | 半導体装置及びその製造方法 |
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