JPH02125340U - - Google Patents

Info

Publication number
JPH02125340U
JPH02125340U JP1989033117U JP3311789U JPH02125340U JP H02125340 U JPH02125340 U JP H02125340U JP 1989033117 U JP1989033117 U JP 1989033117U JP 3311789 U JP3311789 U JP 3311789U JP H02125340 U JPH02125340 U JP H02125340U
Authority
JP
Japan
Prior art keywords
insulating tape
semiconductor device
square holes
semiconductor
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989033117U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989033117U priority Critical patent/JPH02125340U/ja
Publication of JPH02125340U publication Critical patent/JPH02125340U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/701Tape-automated bond [TAB] connectors

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Wire Bonding (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)
  • Tests Of Electronic Circuits (AREA)

Description

【図面の簡単な説明】
第1図は本考案の一実施例を示すTABテープ
及び枠体の平面図、第2図及び第3図は枠体の上
面斜視図、第4図は、樹脂モールド用金型内に位
置決め固定されたTABテープ及び枠体の正断面
図である。第5図及び第6図はTABリード型半
導体装置の従来構造を示し、第5図は平面図、第
6図は断面図である。第7図は構体の一部拡大図
、第8図はロール巻きされた構体の側面図、第9
図は構体の切断位置を示す平面図、第10図は切
断後、BTボードに収納された構体の斜視図であ
る。 1……TABリード型半導体装置、6a……T
ABテープ、6……絶縁性テープ、7……角孔、
10,10a,10b,10c……枠体。

Claims (1)

  1. 【実用新案登録請求の範囲】 絶縁性テープの角孔に半導体ペレツトを収納配
    置し、絶縁性テープ上の金属箔リードに半導体ペ
    レツトのバンプ電極を圧着した半導体装置に於い
    て、 上記絶縁性テープを所定数の角孔を含む長さに
    切断してこの短冊状絶縁性テープの周縁部に枠体
    を固着したことを特徴とする半導体装置。
JP1989033117U 1989-03-22 1989-03-22 Pending JPH02125340U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989033117U JPH02125340U (ja) 1989-03-22 1989-03-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989033117U JPH02125340U (ja) 1989-03-22 1989-03-22

Publications (1)

Publication Number Publication Date
JPH02125340U true JPH02125340U (ja) 1990-10-16

Family

ID=31536512

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989033117U Pending JPH02125340U (ja) 1989-03-22 1989-03-22

Country Status (1)

Country Link
JP (1) JPH02125340U (ja)

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