JPH0415841U - - Google Patents

Info

Publication number
JPH0415841U
JPH0415841U JP1990058399U JP5839990U JPH0415841U JP H0415841 U JPH0415841 U JP H0415841U JP 1990058399 U JP1990058399 U JP 1990058399U JP 5839990 U JP5839990 U JP 5839990U JP H0415841 U JPH0415841 U JP H0415841U
Authority
JP
Japan
Prior art keywords
semiconductor device
type semiconductor
tab type
manufacturing apparatus
inner lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1990058399U
Other languages
English (en)
Other versions
JPH087635Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990058399U priority Critical patent/JPH087635Y2/ja
Publication of JPH0415841U publication Critical patent/JPH0415841U/ja
Application granted granted Critical
Publication of JPH087635Y2 publication Critical patent/JPH087635Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例に係るＴＡＢ式半導
体装置の製造装置を示す一部破断斜視図、第２図
イ〜ハはいずれも、本考案の製造装置によるイン
ナーリードの加工状態を示す要部断面図、第３図
は従来のインナーリードの加工状態を示す一部破
断斜視図、第４図は従来のインナーリードの加工
状態を示す要部断面図である。 １……半導体ペレツト、２……電極、３……Ｔ
ＡＢテープ、４ａ……透孔、５……銅箔、６……
インナーリード、１０……パンチ、１１……凹部
。

Claims (1)

  1. 【実用新案登録請求の範囲】 透孔を所定間隔で穿設してなるフイルム上の積
    層した銅箔をエツチングして透孔内に延びるイン
    ナーリードを形成したＴＡＢテープの透孔内に半
    導体ペレツトを配置し、半導体ペレツト上の電極
    とインナーリードとを弾性したＴＡＢ式半導体装
    置のインナーリードを弾性を有するパンチにて圧
    押し整形するＴＡＢ式半導体装置の製造装置にお
    いて、 上記パンチの押圧面に凹部を形成したことを特
    徴とするＴＡＢ式半導体装置の製造装置。
JP1990058399U 1990-05-31 1990-05-31 Ｔａｂ式半導体装置の製造装置 Expired - Fee Related JPH087635Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990058399U JPH087635Y2 (ja) 1990-05-31 1990-05-31 Ｔａｂ式半導体装置の製造装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990058399U JPH087635Y2 (ja) 1990-05-31 1990-05-31 Ｔａｂ式半導体装置の製造装置

Publications (2)

Publication Number Publication Date
JPH0415841U true JPH0415841U (ja) 1992-02-07
JPH087635Y2 JPH087635Y2 (ja) 1996-03-04

Family

ID=31583974

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990058399U Expired - Fee Related JPH087635Y2 (ja) 1990-05-31 1990-05-31 Ｔａｂ式半導体装置の製造装置

Country Status (1)

Country Link
JP (1) JPH087635Y2 (ja)

Also Published As

Publication number Publication date
JPH087635Y2 (ja) 1996-03-04

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees