JPH02127068U - - Google Patents

Info

Publication number
JPH02127068U
JPH02127068U JP1989037197U JP3719789U JPH02127068U JP H02127068 U JPH02127068 U JP H02127068U JP 1989037197 U JP1989037197 U JP 1989037197U JP 3719789 U JP3719789 U JP 3719789U JP H02127068 U JPH02127068 U JP H02127068U
Authority
JP
Japan
Prior art keywords
semiconductor component
multilayer ceramic
ceramic substrate
heat dissipating
shape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989037197U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989037197U priority Critical patent/JPH02127068U/ja
Publication of JPH02127068U publication Critical patent/JPH02127068U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Description

【図面の簡単な説明】
第１図は本考案の実施例の断面図、第２図は従
来例の断面図である。 図において、１，１０は多層セラミツクス基板
、１−１，１１−１は最上絶縁層、１−２，１１
−２は第２絶縁層、１−３，１１−３は第３絶縁
層、２−１，１２−１は回路パターン、２−２，
１２−２は第２導体層、２−３，１２−３は第３
導体層、４，７は熱伝導性接着剤、５は半導体部
品、６は回路部品、８は放熱体、８ａは放熱板、
８ｂ，２２は放熱フイン、１５は凹部、２０は塔
状放熱体、２１は放熱基台をそれぞれ示す。

Claims (1)

  1. 【実用新案登録請求の範囲】 多層セラミツクス基板１０の最上絶縁層１１−
    １に、半導体部品５を表面実装した回路基板装置
    であつて、 該多層セラミツクス基板１０の裏面側に、該半
    導体部品５に対応して底面が該最上絶縁層１１−
    １の下面に一致し、且つ底面形状が該半導体部品
    ５の底面形状にほぼ等しい凹部１５を設け、 熱伝導性接着剤７を用いて放熱基台２１の底面
    を、該凹部１５の底面に密着させて、該放熱基台
    ２１上に多数の放熱フイン２２が塔状に形成され
    て成る塔状放熱体２０が、該多層セラミツクス基
    板１０に搭載されたことを特徴とする回路基板装
    置。
JP1989037197U 1989-03-30 1989-03-30 Pending JPH02127068U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989037197U JPH02127068U (ja) 1989-03-30 1989-03-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989037197U JPH02127068U (ja) 1989-03-30 1989-03-30

Publications (1)

Publication Number Publication Date
JPH02127068U true JPH02127068U (ja) 1990-10-19

Family

ID=31544091

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989037197U Pending JPH02127068U (ja) 1989-03-30 1989-03-30

Country Status (1)

Country Link
JP (1) JPH02127068U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008210593A (ja) * 2007-02-23 2008-09-11 Matsushita Electric Works Ltd 照明装置
WO2016080393A1 (ja) * 2014-11-20 2016-05-26 日本精工株式会社 放熱基板

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008210593A (ja) * 2007-02-23 2008-09-11 Matsushita Electric Works Ltd 照明装置
WO2016080393A1 (ja) * 2014-11-20 2016-05-26 日本精工株式会社 放熱基板
JPWO2016080393A1 (ja) * 2014-11-20 2017-04-27 日本精工株式会社 放熱基板

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