JPH02106856U - - Google Patents
Info
- Publication number
- JPH02106856U JPH02106856U JP1363089U JP1363089U JPH02106856U JP H02106856 U JPH02106856 U JP H02106856U JP 1363089 U JP1363089 U JP 1363089U JP 1363089 U JP1363089 U JP 1363089U JP H02106856 U JPH02106856 U JP H02106856U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- board
- heat dissipating
- dissipating material
- good thermal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 3
- 239000002470 thermal conductor Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図は、本考案の実施態様を示すＩＣチツプ
搭載多層配線基板の断面図である。 １，１′，１″，１……基板、２……貫通孔
、３……ＩＣチツプ、４……放熱材、５……熱良
導体、６……配線。
搭載多層配線基板の断面図である。 １，１′，１″，１……基板、２……貫通孔
、３……ＩＣチツプ、４……放熱材、５……熱良
導体、６……配線。
Claims (1)
- 基板の上面にＩＣチツプを搭載し、基板の裏面
には放熱材を被覆した配線基板において、該基板
を貫通した熱良導体を介して、ＩＣチツプと放熱
材とが連結されてなるＩＣチツプ搭載配線基板。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1363089U JPH02106856U (ja) | 1989-02-09 | 1989-02-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1363089U JPH02106856U (ja) | 1989-02-09 | 1989-02-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02106856U true JPH02106856U (ja) | 1990-08-24 |
Family
ID=31224101
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1363089U Pending JPH02106856U (ja) | 1989-02-09 | 1989-02-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02106856U (ja) |
-
1989
- 1989-02-09 JP JP1363089U patent/JPH02106856U/ja active Pending