JPH0214751U - - Google Patents

Info

Publication number
JPH0214751U
JPH0214751U JP9308688U JP9308688U JPH0214751U JP H0214751 U JPH0214751 U JP H0214751U JP 9308688 U JP9308688 U JP 9308688U JP 9308688 U JP9308688 U JP 9308688U JP H0214751 U JPH0214751 U JP H0214751U
Authority
JP
Japan
Prior art keywords
metal wire
semiconductor device
lead
temperature
molded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9308688U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0433631Y2 (cs
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988093086U priority Critical patent/JPH0433631Y2/ja
Publication of JPH0214751U publication Critical patent/JPH0214751U/ja
Application granted granted Critical
Publication of JPH0433631Y2 publication Critical patent/JPH0433631Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Fuses (AREA)
  • Emergency Protection Circuit Devices (AREA)
JP1988093086U 1988-07-15 1988-07-15 Expired JPH0433631Y2 (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988093086U JPH0433631Y2 (cs) 1988-07-15 1988-07-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988093086U JPH0433631Y2 (cs) 1988-07-15 1988-07-15

Publications (2)

Publication Number Publication Date
JPH0214751U true JPH0214751U (cs) 1990-01-30
JPH0433631Y2 JPH0433631Y2 (cs) 1992-08-12

Family

ID=31317536

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988093086U Expired JPH0433631Y2 (cs) 1988-07-15 1988-07-15

Country Status (1)

Country Link
JP (1) JPH0433631Y2 (cs)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01257533A (ja) * 1988-04-05 1989-10-13 Honda Motor Co Ltd 組付装置
JPH04192237A (ja) * 1990-11-26 1992-07-10 Rohm Co Ltd チップ型ヒューズ
JP2014212098A (ja) * 2013-04-17 2014-11-13 三星エスディアイ株式会社Ｓａｍｓｕｎｇ ＳＤＩ Ｃｏ．，Ｌｔｄ． 二次電池
JP2018503235A (ja) * 2015-01-22 2018-02-01 リテルヒューズ・インク 内蔵式アーク・クエンチャーを備えたエア・スプリット・ヒューズにおけるワイヤ

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5981828A (ja) * 1982-11-01 1984-05-11 松下電器産業株式会社 角型チツプ状ヒユ−ズ部品
JPS59119546U (ja) * 1983-02-02 1984-08-11 日本電信電話株式会社 チツプ状ヒユ−ズ

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5981828A (ja) * 1982-11-01 1984-05-11 松下電器産業株式会社 角型チツプ状ヒユ−ズ部品
JPS59119546U (ja) * 1983-02-02 1984-08-11 日本電信電話株式会社 チツプ状ヒユ−ズ

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01257533A (ja) * 1988-04-05 1989-10-13 Honda Motor Co Ltd 組付装置
JPH04192237A (ja) * 1990-11-26 1992-07-10 Rohm Co Ltd チップ型ヒューズ
JP2014212098A (ja) * 2013-04-17 2014-11-13 三星エスディアイ株式会社Ｓａｍｓｕｎｇ ＳＤＩ Ｃｏ．，Ｌｔｄ． 二次電池
JP2018503235A (ja) * 2015-01-22 2018-02-01 リテルヒューズ・インク 内蔵式アーク・クエンチャーを備えたエア・スプリット・ヒューズにおけるワイヤ

Also Published As

Publication number Publication date
JPH0433631Y2 (cs) 1992-08-12

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