JPH0216009B2 - - Google Patents

Info

Publication number
JPH0216009B2
JPH0216009B2 JP58194894A JP19489483A JPH0216009B2 JP H0216009 B2 JPH0216009 B2 JP H0216009B2 JP 58194894 A JP58194894 A JP 58194894A JP 19489483 A JP19489483 A JP 19489483A JP H0216009 B2 JPH0216009 B2 JP H0216009B2
Authority
JP
Japan
Prior art keywords
semiconductor device
tape carrier
tape
punching
punched
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58194894A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6086839A (ja
Inventor
Hiroshi Aoyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP58194894A priority Critical patent/JPS6086839A/ja
Publication of JPS6086839A publication Critical patent/JPS6086839A/ja
Publication of JPH0216009B2 publication Critical patent/JPH0216009B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/077—Connecting of TAB connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors

Landscapes

  • Wire Bonding (AREA)
JP58194894A 1983-10-18 1983-10-18 テ−プキヤリア方式を用いた半導体装置の製造方法 Granted JPS6086839A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58194894A JPS6086839A (ja) 1983-10-18 1983-10-18 テ−プキヤリア方式を用いた半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58194894A JPS6086839A (ja) 1983-10-18 1983-10-18 テ−プキヤリア方式を用いた半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS6086839A JPS6086839A (ja) 1985-05-16
JPH0216009B2 true JPH0216009B2 (2) 1990-04-13

Family

ID=16332093

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58194894A Granted JPS6086839A (ja) 1983-10-18 1983-10-18 テ−プキヤリア方式を用いた半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS6086839A (2)

Also Published As

Publication number Publication date
JPS6086839A (ja) 1985-05-16

Similar Documents

Publication Publication Date Title
JP3024457B2 (ja) 電子部品実装装置および電子部品実装方法
US4551912A (en) Highly integrated universal tape bonding
JP2019054209A (ja) 半導体製造装置、半導体装置の製造方法およびコレット
JP2015076410A (ja) ボンディング方法及びダイボンダ
US5231756A (en) Process for manufacturing a multi-layer lead frame
JPH0216009B2 (2)
JP4369298B2 (ja) ダイピックアップ装置及びダイピックアップ方法
JPH02273944A (ja) リード付き半導体素子の製造方法
JP2000091403A (ja) ダイピックアップ方法およびそれを用いた半導体製造装置ならびに半導体装置の製造方法
JP3767847B2 (ja) リングフレームへの接着テープ貼着方法及び装置
JP2767277B2 (ja) インナーリードボンダ
JP2841761B2 (ja) フイルムキヤリアテープの打抜方法
JPS6144431Y2 (2)
JPS60189228A (ja) チツプテ−ピング装置
JPS61101034A (ja) 半導体装置製造システム
JPS5933975B2 (ja) 半導体搭載装置
JP2639953B2 (ja) 半導体製造装置
JP2911365B2 (ja) 半導体部品製造用リードフレームにおけるモールド部の成形装置
JPH04345043A (ja) フィルムキャリアテープ
JPS60189297A (ja) テ−プからチツプを取り出す方法
JPS6364900B2 (2)
JPH0521443U (ja) Ｔａｂ型半導体装置の組立装置
JP2000188367A (ja) 半導体パッケージの製造方法
JP3481889B2 (ja) リード切断装置及びリード切断方法
JPH04359554A (ja) 半導体装置の実装方法