JPH02197155A - Cooling structure for integrated circuit - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a cooling structure for an integrated circuit, and particularly to a cooling structure for an integrated circuit that can efficiently discharge heat generated from a semiconductor chip to the outside of a device.

[Prior Art] Conventionally, this type of cooling structure consists of a cold plate fixed at a minute distance from the integrated circuit, and a cooling container provided with a refrigerant wave path, and the two are separated. (For example, Japanese Patent Application No. 183889/1989).

[Problems to be Solved by the Invention] The conventional cooling structure described above has a drawback in that the flow rate of the coolant must be changed to accommodate the increase in heat generated from the semiconductor chip.

Furthermore, since the cold plate and the cooling container, which serves as a flow path for the refrigerant, are divided into two parts, there is a drawback that the thermal resistance between the integrated circuit and the refrigerant becomes high.

[Means for Solving the Problems] The present invention has been made in view of the above problems, and even if the heat generated from the semiconductor chip increases, the heat between the integrated circuit and the refrigerant is reduced without changing the flow rate of the refrigerant. The purpose is to keep the resistance low.

Specifically, the present invention includes a substrate frame that holds a substrate on which an integrated circuit is mounted, and a substrate frame that faces the top surface of the integrated circuit with a small distance therebetween, and that has an integrated circuit on a surface opposite to the surface facing the integrated circuit. A cold plate having a corresponding recessed hole, a suction chamber that is in close contact with the cold plate and serves as a refrigerant tank chamber with a refrigerant intake port, and a discharge chamber equipped with a refrigerant outlet; It has a cooling container equipped with a pipe that conveys refrigerant from the chamber to the search holes and a pipe that connects each search hole, and a narrow nozzle is installed on the spout side of each of the pipes, and is installed toward the bottom of the search hole. The structure is as follows.

[Example] Next, the unreleased part 11 will be explained with reference to the drawings.

FIG. 1 is a sectional view of an embodiment of the present invention. Referring to FIG. 1, 1 is a substrate, and 2 is an integrated circuit mounted on the substrate. The outer peripheral edge of the substrate l is firmly fixed to the substrate frame 3. Opposed to the top surface of the integrated circuit 2 while maintaining a small distance,
A cold plate 6 having a recessed hole 5 is provided on the opposite side of the integrated circuit. A comparand 4 with excellent thermal conductivity is placed between the integrated circuit 2 and the cold plate 6.
is coated. In addition, pipes 12 and 13 are arranged in the search hole 5, with the nozzles 12a, 13a, and 13b directed toward the bottom thereof, and serving as a wave path for the refrigerant 7. The pipe 12 is
The refrigerant is sent from the suction chamber 15 to the boreholes 5, and the pipe 13 connects the boreholes 5.5.

The nozzles 12a and 13a of the pipes 12 and 13 are narrowed to eject the refrigerant strongly.

Above the cold plate 6 is a cooling container 11 which is provided with a suction chamber 15 and a discharge chamber 16 which serve as refrigerant tank chambers, and a partition 10 is provided to define a boundary between the two.

The suction chamber 15 is provided with a refrigerant intake port 8, and the discharge chamber 16 is provided with a refrigerant exit port 9.

When the refrigerant 7 now flows in through the intake port 8 of the cooling container 11, it fills the suction chamber 15 partitioned by the partition wall 10, and the pipe 1
2 to the search hole 5 of the cold plate 6, and collides with the bottom surface of the search hole 5 through the nozzle 12a. Since the refrigerant is narrowed through the nozzle 12a, its flow velocity is increased and the jet Ii collides with force. The collided refrigerant passes through the pipe 13 from the nozzle 13b and is sent from the nozzle 13a to the adjacent recessed hole 5. Note that, like the nozzle 12a, the nozzle 13a is also narrowly constricted, so that the refrigerant jets collide with each other vigorously. In this way, the refrigerant is sent to the bored holes 5 one after another, collects in the last discharge chamber 16, and is discharged to the outside from the outlet 9. Note that the arrows in the figure indicate the flow of refrigerant.

[Effects of IJ] As explained above, the present invention has a tapered nozzle that faces directly to the bore hole provided on the cold plate, and accelerates the flow velocity of the refrigerant to cause the jets to collide. 1i, the thermal resistance between the integrated circuit and the refrigerant can be kept low without changing the amount, and the refrigerant can be efficiently discharged to the outside of the device.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of one embodiment of the present invention, and FIG. 2 is an enlarged detailed view of the main part of FIG. 1 2 boards 2 2 caps Circuit 3: Board frame 4: Comparison land 5: Drill hole
6: Cold plate 7: Refrigerant 8:
Intake port 9: Outlet port lO2 wall ll: Cooling container 12, 13: Pipes 12a, 13
a, 13b: Nozzle 15: Suction chamber 16: Discharge chamber

Claims (1)

[Scope of Claims] A substrate frame that holds a substrate on which an integrated circuit is mounted, and a substrate frame that faces the top surface of the integrated circuit with a small distance therebetween, and that corresponds to the integrated circuit on a surface opposite to the facing surface of the integrated circuit. a cold plate having a refrigerant hole; a suction chamber that is in close contact with the cold plate and serves as a refrigerant tank chamber equipped with a refrigerant intake; and a discharge chamber equipped with a refrigerant outlet; It has a cooling container equipped with a pipe that sends refrigerant to the search holes and a pipe that connects each search hole, and a narrow nozzle is provided on the spout side of each of the pipes, and the nozzle is installed facing the bottom of the search hole. A cooling structure for integrated circuits featuring: