JPH02308560A - Cooling structure of integrated circuit - Google Patents

Abstract

PURPOSE:To effectively discharge heat produced on an integrated circuit to the outside of an instrument without increasing the flow rate of a refrigerant by effectively directing the refrigerant to a cooling plate with the aid of a protrusion provided on the cooling plate. CONSTITUTION:A refrigerant 7 is introduced from an inlet 8 of a container 11, and filled in a suction chamber 15 defined by an partition 10 and hits a protrusion 4 on a probe hole 5 in a cooling plate 6 from a nozzle 12. The refrigerant flows to a nozzle 14 after passing a nozzle 13, and is finally accumulated in a discharge chamber 16 and is discharged from an outlet 9 to the outside. Each nozzle is partly located in the suction chamber 15 and dipped in a refrigerant at all times. Therefore, a refrigerant heated with heat from integrated circuit elements is also cooled in the nozzle upon its being injected into the container 11. Thus, a substantially constant temperature refrigerant is circulated at all times.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a cooling structure for an integrated circuit, and in particular, to a cooling structure for an integrated circuit, in particular, a plurality of integrated circuit elements mounted on a substrate to form an integrated circuit. The present invention relates to a cooling structure for integrated circuits that efficiently propagates a coolant flowing in the vicinity of the integrated circuit.

[Conventional technology]

Conventionally, this type of cooling structure for integrated circuits has been fixed to the integrated circuit elements at a small distance and cooled through a filled thermally conductive compound, as shown in Patent Application No. 60-183889, for example. It has a heat exchanger plate designed for conduction, and a cooling container that is provided in close contact with the heat exchanger plate and allows a refrigerant to flow inside.

[Problem to be solved by the invention]

In the conventional integrated circuit cooling structure described above, as the amount of heat generated from the integrated circuit element increases, the flow rate of the refrigerant must be increased to cope with the increase, so the refrigerant supply device becomes larger and the heat transfer plate and Since the cooling container through which the refrigerant flows is separate, there is a drawback that it is difficult to reduce the thermal resistance between the integrated circuit element and the refrigerant.

[Means to solve the problem]

The integrated circuit cooling structure of the present invention includes an integrated circuit in which a plurality of integrated circuit elements are mounted on a substrate, a substrate frame that holds the substrate, and an outer surface that faces the upper surface of the plurality of integrated circuit elements with a small distance therebetween. a cooling plate having counterbore holes with a plurality of protrusions provided on the inner surface of the bottom in a direction opposite to the integrated circuit element and closely contacting the substrate frame; a refrigerant intake port and an output port; a suction chamber connected to the intake port and serving as a refrigerant tank chamber; a discharge chamber connected to the intake port; and a first counterbore facing directly from the suction chamber to the first counterbore. The refrigerant container has a nozzle and a refrigerant container having a nozzle that is continuous from the first counterbore hole to an adjacent counterbore hole and is directed directly to each counterbore hole.

〔Example〕

Next, implementation of the present invention will be described with reference to the drawings.

FIG. 1 is a sectional view of one embodiment of the present invention.

In FIG. 1, a plurality of integrated circuit elements 2 are mounted on a substrate 1 to form an integrated circuit. The outer peripheral edge of the board 1 is firmly fixed to the board frame. A cooling plate 6 is provided on the top surface of the integrated circuit element 2 with a minute interval maintained therein, and a counterbore hole 5 in which a plurality of columnar protrusions 4 are provided is provided on the inner surface of the cooling plate 6, that is, on the bottom surface in the direction opposite to the integrated circuit. It is being A refrigerant container 11 having a refrigerant intake port 8 and a refrigerant exit port and a partition wall 10 separating the two is tightly attached to the top of the cooling plate 6 . A first nozzle 12 that discharges the refrigerant 7 toward the protrusion 4 is provided directly facing the protrusion 4 . Furthermore, the refrigerant container 11 has a first counterbore hole 5.
A second nozzle 13 is provided facing the adjacent second nozzle 13.
It is connected to a third nozzle 14 that discharges the refrigerant 7 toward the protrusion 4 of the counterbore. Furthermore, the adjacent third
．． The fourth counterbore hole is also provided with a connected nozzle similar to that for the first and second counterbore six, and the nozzle is connected to the counterbore hole 5 facing the outlet 9. It has a structure with holes for refrigerant discharge.

When the refrigerant 7 now flows in through the intake port 8 of the refrigerant container 11, it fills the suction chamber 15 partitioned by the partition wall 10, and collides with the protrusion 4 of the counterbore of the cooling plate 6 from the first nozzle 12. . The collided refrigerant passes through the second nozzle 13, flows through the nozzles to the third nozzle 14, and finally collects in the discharge chamber 16 and is discharged to the outside from the outlet 9. Since each nozzle is partially located within the suction chamber 15, it is constantly immersed in refrigerant. Therefore, the refrigerant heated by the heat from the integrated circuit element is also cooled by the refrigerant in the suction chamber 15 within the nozzle during the next jet flow, and the refrigerant can be constantly circulated at a constant temperature. Further, the protrusion 4 provided on the bottom of the counterbore serves as a heat sink, effectively transmitting heat. Note that the arrows in the figure indicate the flow of refrigerant.

Note that even if a conventionally used thermally conductive compound is filled in minute intervals on the upper surface of the integrated circuit element 2, it will not be scooped out.

〔Effect of the invention〕

As explained above, by adopting the above-described structure, the present invention expands the heat transfer area by using the protrusions provided on the cooling plate to transfer the heat generated from the integrated circuit element, and allows the coolant to efficiently flow through the cooling plate. This has the effect of efficiently discharging the heat of the integrated circuit to the outside of the device without increasing the flow rate of the refrigerant.

Brief description of the drawing FIG. 1 is a sectional view of one embodiment of the present invention.

DESCRIPTION OF SYMBOLS 1... Board, 2... Integrated circuit element, 3... Board frame, 4... Protrusion, 5... Counterbore hole, 6... Cooling plate, 7... Refrigerant, 8... ...Intake port, 9...Outlet port, 1
0...Partition wall, 11...Refrigerant container, 12...2 first
13... second nozzle, 14... third nozzle, 15... suction chamber, 16... discharge chamber.

Claims (1)

[Claims] An integrated circuit having a plurality of integrated circuit elements mounted on a substrate, a substrate frame for holding the substrate, and an outer surface facing the upper surface of the plurality of integrated circuit elements with a small distance therebetween, the integrated circuit having an outer surface opposite to the integrated circuit elements. A cooling plate that has counterbore holes with a plurality of protrusions on the inner surface of the bottom in the direction and is in close contact with the substrate frame, and a cooling plate that is provided in close contact with the cooling plate and has a refrigerant intake and an outlet, and a refrigerant intake and an outlet. A suction chamber connected to the inlet and serving as a refrigerant tank chamber, a discharge chamber connected to the outlet, a first nozzle facing directly from the suction chamber to the first counterbore, and sequentially from the first counterbore. 1. A cooling structure for an integrated circuit, comprising: a refrigerant container having a nozzle continuous with adjacent counterbore holes and facing directly to each counterbore.