JPH0219973Y2 - - Google Patents

Description

[Detailed description of the invention] This invention provides an excellent electrical component assembly that can improve the packaging density of components by consolidating the integrated circuit components and other electrical components placed around them as compactly as possible. The purpose is to

Generally, other electrical components placed around the integrated circuit component are mounted on the same plane as the integrated circuit component on the printed wiring board on which the integrated circuit component is mounted. many. Therefore, this type of device has a problem in that the mounting density on the printed wiring board is not necessarily high and a relatively large occupied area is required.

The present invention eliminates the above-mentioned drawbacks of the conventional technology by dividing each of the lead legs drawn out from the mutually opposing sides of the main body of the integrated circuit component into two parts in the longitudinal direction, and dividing each lead leg part into upper and lower parts. another electrical component is arranged overlappingly on at least the upper surface of the integrated circuit component main body, and the electrical component and the integrated circuit component are directly electrically and mechanically coupled by the split and folded lead leg portions. It is composed of

DESCRIPTION OF THE PREFERRED EMBODIMENTS The electrical component assembly of the present invention will be described below with reference to drawings of one embodiment. In the figure, reference numeral 1 denotes a semiconductor integrated circuit component, and a plurality of lead legs 2 are drawn out from mutually opposing sides of the component body. Each of these lead legs 2 is divided into two parts in the longitudinal direction, and one lead leg portion is folded back to the top side of the semiconductor integrated circuit component 1 and the other lead leg portion is folded back to the bottom side of the semiconductor integrated circuit component 1. ing. Reference numerals 3 and 4 denote other electrical components stacked on the upper and lower surfaces of the semiconductor integrated circuit component 1, respectively, and electrodes 5 and 6 are formed on the opposing side surfaces, respectively. These electrodes 5 and 6 are respectively joined to the divided and folded lead legs 2 and 2 of the integrated circuit component 1 with solder 7,
They are electrically and mechanically connected to each other. 8 is a printed wiring board, and a conductor layer 9 constituting a circuit pattern is formed on the upper or lower surface. Conductor layer 9 on the bottom surface
Mounting holes 10 are formed in each printed wiring board 8 in which the divided and folded lead legs 2 of the integrated circuit component 1 are inserted. Therefore, when using such a printed wiring board 8, the lead legs 2 folded back to the bottom side of the integrated circuit component 1 are inserted into the mounting holes 10, and soldered to the conductive layer on the bottom surface of the printed wiring board 8. It is sufficient to join at step 7. When using a printed wiring board 8 with a conductor layer 9 formed on the upper surface, solder the lead legs 2 folded back to the lower surface directly to the conductor layer 9 or the electrodes of other electrical components stacked on the lower surface of the integrated circuit component 1. It can be joined at 7. Therefore, in this case, it is not necessarily necessary to form the mounting holes 10 in the printed wiring board 8.

Different embodiments are shown in FIGS. 1 to 5, respectively.

In Fig. 1, other electrical components 3 are stacked only on the top surface of an integrated circuit component 1, and the integrated circuit component 1 is pulled out from the mutually opposing sides, divided into two parts, and folded upward inside the lead legs that are folded back up and down. The lead leg 2 is bonded to the electrode 5 of another electrical component 3 with solder 7, the lead leg 2 folded downward is inserted into the mounting hole 10 of the printed wiring board 8, and bonded to the conductor layer 9 with the solder 7. It shows what was done.

FIG. 2 shows other electrical components 4 stacked on the bottom surface of the integrated circuit component 1, and lead legs 2 folded downward.
is bonded to the electrode 6 of the other electrical component 4 with solder 7, and the lead leg 2 is further inserted into the mounting hole 10 formed in the printed wiring board 8, and bonded to the conductor layer 9 with solder 7. It shows.

The one shown in FIG. 3 is one in which other electrical components 4 are stacked on the lower surface side of the integrated circuit component 1 via a printed wiring board 8, and in this case, the electrical components 4 are stacked on the lower side of the integrated circuit component 1 via a printed wiring board 8. An electrode 6 of an electrical component 4 is soldered to a lead leg 2 protruding from the top.

The printed wiring board 8 shown in FIGS. 4 and 5 has a conductor layer 9 on its upper surface, and in this case, other electrical components 4 are stacked on the lower surface of the integrated circuit component 1. The electrode 6 or the lead leg 2 drawn out from the side surface of the integrated circuit component 1 is directly bonded to the conductor layer 9 with solder 7.

As is clear from the above embodiments, the electrical component assembly of the present invention has lead legs drawn out from mutually opposing sides of the integrated circuit component main body, each of which has two longitudinal directions.
and folding each of these divided lead leg portions up and down, and making an electromechanical connection with another electrical component stacked on at least the upper surface of the integrated circuit component. Integrated circuit components and other electrical components can be easily stacked vertically to form a single unit, and therefore, even when mounted on a printed wiring board, The occupied area can be made significantly smaller than that of the conventional method, which is extremely advantageous in practice. Moreover, since the lead legs for connecting other electrical components are divided into two parts and folded back upward and downward, the connection reliability between the upper and lower terminals is high.

[Brief explanation of the drawing]

1 to 5 are sectional side views of different embodiments of the electrical component assembly of the present invention, and FIG. 6 is a perspective view of essential parts of integrated circuit components used in the same assembly. 1... Integrated circuit component, 2... Lead leg, 3, 4
...Other electrical parts, 5, 6... Electrode, 7... Solder, 8... Printed wiring board, 9... Conductor layer, 10...
Mounting hole.

Claims (1)

[Scope of utility model registration request] Each of the plurality of lead legs pulled out from the mutually opposing side surfaces of the integrated circuit component body is divided into two in the longitudinal direction, and each of these divided lead leg portions is attached to the upper and lower surfaces of the integrated circuit component body. The integrated circuit components folded back to the sides and the electrodes stacked on at least the upper surface of the integrated circuit component main body and formed on mutually opposing sides are electrically and mechanically connected to the split and folded lead leg parts. An electrical component assembly comprising other electrical components.