JPH02215181A - Prepreg and wiring board using thereof - Google Patents

Abstract

PURPOSE:To obtain a wiring board excellent in reliability of through-hole and high frequency characteristic by a method wherein a wiring board is impregnated with resin vanish obtained by reacting amine compound, which is formed by reacting aromatic polycyanate with dicyandiamide, with bisimide. CONSTITUTION:A base material is impregnated with resin vanish obtained by reacting amine compound, which is formed by reacting aromatic polycyanate with dicyandiamide, with bisimide, which is dried up to obtain a prepreg. The required pieces of the prepreg obtained as mentioned above are stacked, interposing an inner circuit member between the prepregs at a required position if necessary, an outer circuit member is provided to the outermost sides of the stacked prepreg respectively to obtain a laminated body, and the laminated body is formed into an integral structure for the formation of a wiring board. The prepreg and the wiring board thereof are improved in reliability of through- hole and high frequency characteristic.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention is applicable to electronic equipment, electrical equipment, computer communication aS
The present invention relates to a high-frequency wiring board used in S, etc., and a prepreg used therein.

[Conventional technology]

Conventionally, wiring boards and prepregs used in electronic equipment, electrical equipment, etc. are made of paper, cloth base materials (impregnated and dried prepregs, and wiring boards using them) with phenol/%/resin or Evokin resin. However, wiring boards using fluororesin and polyphenylene oxide resin, which have excellent high frequency properties, have been tried, but the glass transition temperature of these resins is 180°C.
Since the temperature is as low as ~200°C, smear occurs during through-hole processing, resulting in a problem of lowering the reliability of the wiring board.

[Problem that the invention seeks to solve]

As mentioned in the conventional technology, phenolic resin, epoxy VW
The high frequency properties of prepreg and wiring boards using fat are g<, fluorine S! Products using oil or polyphenylene oxide resin have low through-hole reliability.The present invention was made in view of the above-mentioned problems in the conventional technology, and its purpose is to improve through-hole reliability and high frequency performance. We provide prepregs and wiring boards.

[Means for solving problems]

The present invention provides a prepreg obtained by impregnating a base material with a resin varnish made by reacting an amine compound made by reacting a polyaromatic V anate with a dianediamide and a bisimide and drying it, and stacking a required number of sheets of the prepreg, After interposing the inner layer circuit material at the required position between the prepregs as necessary, the outermost layer! The wiring board is characterized in that it is formed by laminating and integrating a laminate in which 1g1 circuit materials are arranged on the outside, and the above object can be achieved.The present invention will be described in detail below.

The polyaromatic ananate used in the present invention is preferably one represented by the following general formula (1) in order to improve high frequency properties.However, Ar is aromatic, B is C? -3° polycyclic aliphatic substituent is each independently a substituent containing no active hydrogen q, r, s is an integer of 0.1.2 or 3 X is a number of 0 to 5 polyaromatic In the reaction between ananate and dicyandiamide, an alkali, amine, or Lewis mis is used as a catalyst, and the amine represented by the following general formula [2] is synthesized at 50 to 200°C in a solvent such as dimethylformamide, dimethylacetamide, or N-methylpyrrolidone. A compound is obtained.

Formula (1) The bisimide is preferably one represented by the following general formula [3].

The reaction between the above amine compound and bisimide is carried out in a solvent such as dimethylformamide or dimethylacetamide.
Michael addition is carried out at 30°C to obtain bisaminomaleimide resin, to which dimethylacetamide, N-methylpyrrolidone, dioxane, dimethylformamide, methyl cellosolve, etc. can be added as necessary to adjust the viscosity. It is used as a varnish. The base material may be woven fabric, non-woven fabric, mat or paper made of inorganic fibers such as glass and asbestos, organic synthetic fibers such as polyester, polyacrylic, polyvinyl alcohol, polyacrylic, polyacrylic, and natural fibers such as cotton. This is a combination base material. The inner layer circuit material to be used as necessary is a double-sided or single-sided metal-clad laminate with a metal surface K [ff circuit formed thereon, and the required number of circuit materials are inserted between prepregs as necessary to form a multilayer wiring board. As the outer MJ circuit material, single-sided metal-clad laminates and metal foils made of steel, aluminum, nickel, zinc, etc. alone, alloys, or composites are used, but preferably double-sided roughened steel foils with a thickness of ~105 microns, and Preferably, it is a copper foil with an aluminum carrier. A required number of prepregs made by impregnating and drying the above resin varnish into a base material are stacked, inner layer circuit materials are interposed at required positions between the prepregs as necessary, and then an outer layer circuit material is arranged as the outermost layer. 170 to 230 using the multi-stage press method, double belt method, multi-roll method, drum method, etc.
The layers are laminated and integrated at a temperature of .degree. C., but if necessary, an after-cure may be performed for .omega.~120 minutes after the layering and integration.

The present invention will be explained below based on examples.

Example: For 1 mole of an amine compound obtained by adding 2 moles of dinoandiamide to 1 mole of polyaromatic V anate (Dakchemica Co., Ltd.! 1) and reacting for ω minutes at 150°C in a dimethylformamide solution under alkalinity. , 2 moles of bismaleimide were added and ω was heated at 100°C in a dimethylformamide solution.
After reacting for minutes, a bisaminomaleimide resin was obtained. Then f
The f resin is omethiacetamide omega heavy JIX (hereinafter simply referred to as %) varnish, and after drying, a cloth with a thickness of o and 1 sHI is impregnated with the resin so that the resin amount becomes 50%, and dried to form a prepreg. Next, a laminate in which 9 micron-thick steel foils with aluminum carriers were placed on the upper and lower surfaces of the 8 sheets of prepreg was formed at a molding pressure of 50 #/ci and 170'.
After pressure molding for 90 minutes at 220° C., after-curing was carried out under no pressure for ω minutes at 220° C. to obtain a wiring board with a thickness of 1.6 #.

Comparative Example 1 Comparative Example 1 was a steel-clad laminate with a double-sided steel-clad epoxy resin base having a thickness of 1.6 ff.

Comparative Example 2 Comparative Example 2 was a glass-based fluororesin double-sided steel-clad laminate having a thickness of 1,6111 mm.

Table 1 shows the performance of the IS3 wire substrates of Examples and Comparative Examples 1 and 2.

Table 1 [Effects of the Invention] The present invention is constructed in a confusing manner. The prepreg having the structure described in the claims and the wiring board using the prepreg have the effect of improving reliability and high frequency performance.

Claims (3)

[Claims] (1) A prepreg characterized by impregnating a base material with a resin varnish made by reacting an amine compound made by reacting polyaromatic cyanate and dicyandiamide with bisimides and drying it. (2) Layer the required number of prepregs made by impregnating a base material with a resin varnish made by reacting an amine compound made by reacting a polyaromatic cyanate and dicyandiamide with a bisimide, and drying the prepreg, if necessary. A wiring board characterized in that it is formed by laminating and integrating a laminate in which an inner layer circuit material is interposed at a predetermined position between the layers, and an outer layer circuit material is disposed on the outermost layer. (3) The wiring board according to claim 2, wherein the outer layer circuit material is a metal foil.