JPH02215182A - Prepreg and wiring board using thereof - Google Patents

Abstract

PURPOSE:To improve a wiring board in flame retardance and high frequency characteristic by a method wherein the wiring board is impregnated with resin varnish formed of aromatic polycyanate, bromic bisphenol A carbonate oligomer, bromic bisphenol A, and catalyst. CONSTITUTION:A base material is impregnated with resin varnish formed of aromatic polycyanate, bromic bisphenol A carbonate oligomer, bromic bisphenol A, and catalyst, which is dried up to obtain a prepreg. Required pieces of the prepreg are stacked up, interposing an inner circuit member between the prepregs at a required position if necessary, an outer circuit member is provided to the outermost sides of the stacked prepreg respectively to form a laminated body, which is formed into an integral structure for the formation of a wiring board. It is preferable that an outer circuit member is formed of metal foil. By this constitution, a prepreg and a wiring board thereof can be improved in flame retardance and high frequency characteristic.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a high frequency wiring board used in electronic equipment, electrical equipment, computer communication equipment, etc., and a prepreg used therein.

[Conventional technology]

Conventionally, wiring boards and prepregs used in electronic devices, electrical equipment, etc. are prepregs made by impregnating paper or cloth base materials with phenol resin or epoxy resin and drying them, and wiring boards using them, but they have large dielectric heights and dielectric loss tangents. There were problems with high frequencies. For this reason, prepregs and wiring boards using resin varnishes made of polyaromatic cyanate and catalysts have been tried, but they have had the problem of poor flame retardancy.

[Problem that the invention seeks to solve]

As mentioned in the conventional technology, prepregs and wiring boards using phenol resins and epoxy resins have poor high frequency properties, and those made of aromatic cyanates and catalysts have poor flame retardancy.
The present invention has been made in view of the above-mentioned problems in the conventional technology, and its purpose is to provide a prepreg and a wiring board that are excellent in flame retardancy and high frequency properties.

[Means for solving problems]

The present invention provides polyaromatic cyanate, brominated bisphenol A carbonate oligomer, brominated bisphenol A,
A prepreg made by impregnating a base material with a resin varnish consisting of a catalyst and drying it, stacking the required number of prepregs, interposing an inner layer circuit material at a required position between the prepregs as necessary, and then applying an outer layer circuit material to the outermost layer. The above object can be achieved because of the wiring board, which is characterized in that it is formed by integrally laminating a laminate body in which a laminate body is arranged.The present invention will be described in detail below.

The polyaromatic cyanate used in the present invention is preferably one represented by the following general formula [1] in order to improve high frequency properties.

However, Ar is aromatic, B is a polycyclic aliphatic substituent of 07 to 20, each independently a substituent containing no active hydrogen, q*ra8 is independently Q, 1, 2, . Or, the integer X of 3 is 0 to 5. The bromine-containing bisphenol A carbonate oligomer is preferably one represented by the following general formula [2] in order to improve flame retardancy.

Formula [2] R1 is a substituent that does not contain active hydrogen, m = an integer of Q to 3, such as CH*, C-Hs, etc. n = 10 to 20 Brominated bisphenol A is represented by the following general formula [3] This is desirable for improving flame retardancy.

Formula [3] provided that n"0slo or an integer of 2) The ratio of the polyaromatic cyanate, bromine-containing bisphenol A carbonate oligomer, and bromine-containing bisphenol A is the ratio of the bromine-containing bisphenol A carbonate oligomer to the polyaromatic cyanate and the odor-containing X Bisphenol A
In terms of flame retardancy and compatibility, it is preferable that the total amount of brominated bisphenol A is 20 to 35 parts by weight based on 65 to 80 parts by weight of the polyaromatic cyanate (hereinafter simply referred to as parts).
The ratio of bromine-containing bisphenol A to carbonate oligomer is 1 part to 20 parts of bromine-containing bisphenol A carbonate) ribomer 2A-2, which is clever from the point of view of compatibility. As catalysts, organic metal salts such as cobalt naphthenate and cobalt octylate, imidazoles, and
It is possible to use grade amines, etc. The base materials include woven fabrics made of inorganic fibers such as glass and asbestos, organic synthetic fibers such as polyester, polyacrylic, polyvinyl alcohol, polyacrylic, and polyaramid, and natural fibers such as cotton.
The base material is nonwoven fabric, magenta, paper, or a combination thereof.

The inner layer circuit material to be used as required is one in which an electric circuit is formed on the metal surface of a double-sided or single-sided metal-clad laminate, and a required number of inner layer circuit materials are inserted between prepregs as necessary to form a multilayer wiring board. As the outer layer circuit material, single-sided metal-clad laminates, metal foils made of copper, aluminum, double kelp, zinc, etc. alone, alloys, or stacks are used, preferably with a thickness of 18 to 1
The layer is preferably a copper foil, more preferably a steel foil with an aluminum carrier, with a roughening of 0.05 microns on both sides.

In this way, the required number of prepregs obtained by impregnating the base material with the above resin varnish and drying them are stacked, one circuit material is interposed between the prepregs at a required position as necessary, and then the outer circuit material is placed on the outermost layer. The obtained laminate is processed by multi-stage press method, double belt method, multi-roll method, V-ram method, etc. to 170 to 230
The layers are laminated and integrated at a temperature of 0.degree. C., but if necessary, an after-cue may be performed for an additional 60 to 120 minutes after the FF layers are integrated.

For resin varnish, methyl ethyl ketone,
Dimethylformamide or the like can be used as a viscosity adjuster.

The present invention will be explained below based on Examples.

Example 70 parts of polyaromatic cyanate (manufactured by Dow Chemical Company), 25 parts of dipheno+siterminate-radotetrabromobisphenol A carbonate oligomer (manufactured by Great Lake Company), part of tetrabromobisphenol AS, 1 part of cobalt naphthenate, 35 parts of methyl ethyl ketone. After drying, impregnate a glass cloth with a thickness of 0.15 U into a resin varnish consisting of 50% of the resin varnish to a weight of 50% (hereinafter simply referred to as 壬).
A prepreg was obtained by drying. Next, a laminate in which 9 micron thick aluminum carrier-attached steel foils were arranged on the upper and lower surfaces of 8 nuclear prepreg sheets was molded under a molding pressure of 50 Kq/d, 17
After heating and pressure molding at 0°C for 90 minutes, it was further cured at 220°C for 60 minutes without pressure to a thickness of 1, 6 ff1l.
A wiring board was obtained.

Comparative Example 1 Comparative Example 1 was a 1.6 flO paper-based phenolic resin double-sided copper-clad laminate.

Comparative Example 2 Comparative Example 2 was a glass-based epoxy resin double-sided steel-clad laminate having a thickness of 1.6 mm.

The performance of the wiring boards of Examples and Comparative Examples 1 and 2 is shown in Table 1.

〔Effect of the invention〕

The present invention is constructed as described above. The prepreg having the structure described in the claims and the wiring board using the same have the effect of improving flame retardancy and high frequency properties.

Claims (3)

[Claims] (1) Polyaromatic cyanate, brominated bisphenol A
A prepreg characterized by being made by impregnating a base material with a resin varnish consisting of carbonate oligomer, brominated bisphenol A, and a catalyst and drying it. (2) Polyaromatic cyanate, brominated bisphenol A
A required number of prepregs made by impregnating a base material with a resin varnish consisting of carbonate oligomer, brominated bisphenol A, and a catalyst and drying them are stacked, and if necessary, an inner layer circuit material is interposed at a required position between the prepregs. A wiring board characterized in that it is formed by integrating a laminated body in which an outer layer circuit material is arranged on the outer layer. (3) The wiring board according to claim 2, wherein the outer layer circuit material is a metal foil.