JPH0221578U - - Google Patents
Info
- Publication number
- JPH0221578U JPH0221578U JP10021088U JP10021088U JPH0221578U JP H0221578 U JPH0221578 U JP H0221578U JP 10021088 U JP10021088 U JP 10021088U JP 10021088 U JP10021088 U JP 10021088U JP H0221578 U JPH0221578 U JP H0221578U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- probe
- probe head
- electromagnet
- attached
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000523 sample Substances 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims 2
- 238000007689 inspection Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
第１図は、この考案の一実施例を示すプローブ
ヘツド先端部拡大図、第２図はウエーハの拡大模
式断面図、第３図は従来のウエーハ検査方法の真
空吸着ステージの要部断面図、第４図は従来のプ
ローブヘツド先端部拡大図である。
３……ウエーハ、５……電流駆動触子、６……
電圧駆動触子、１９……プローブヘツド本体、２
０……定電流源、２１……制御回路、２２……電
磁石、２３……プリント板、２４……磁石、２５
……おもり、２６……検針。
FIG. 1 is an enlarged view of the tip of a probe head showing an embodiment of this invention, FIG. 2 is an enlarged schematic sectional view of a wafer, and FIG. 3 is a sectional view of essential parts of a vacuum suction stage in a conventional wafer inspection method. FIG. 4 is an enlarged view of the tip of a conventional probe head. 3...Wafer, 5...Current drive contactor, 6...
Voltage-driven contactor, 19...probe head body, 2
0... Constant current source, 21... Control circuit, 22... Electromagnet, 23... Printed board, 24... Magnet, 25
...Weight, 26...Meter reading.
Claims (1)
真空吸着して固定しウエーハへプローブヘツドに
取り付けられた検針を接触させて通電し特性検査
を行う装置において、 前記検針を取り付けるプローブヘツドに圧力を
印加する電磁石と、電磁石から発生する極性と同
極性の磁石と、その磁石圧力を平衡させるおもり
を設けることを特徴とする半導体素子検査用プロ
ーブヘツド。[Scope of Claim for Utility Model Registration] A wafer on which semiconductor elements have been formed is fixed by vacuum suction on a stage, and a probe attached to a probe head is brought into contact with the wafer to conduct a characteristic test by energizing the wafer, wherein the probe is attached. A probe head for testing semiconductor devices, comprising an electromagnet that applies pressure to the probe head, a magnet with the same polarity as that generated by the electromagnet, and a weight that balances the magnetic pressure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10021088U JPH0221578U (en) | 1988-07-28 | 1988-07-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10021088U JPH0221578U (en) | 1988-07-28 | 1988-07-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0221578U true JPH0221578U (en) | 1990-02-13 |
Family
ID=31328083
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10021088U Pending JPH0221578U (en) | 1988-07-28 | 1988-07-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0221578U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07240444A (en) * | 1994-02-25 | 1995-09-12 | Aging Tesuta Kaihatsu Kyodo Kumiai | Semiconductor chip test equipment |
| JP2001249167A (en) * | 2000-03-06 | 2001-09-14 | Tokyo Weld Co Ltd | Measuring probe driving device |
-
1988
- 1988-07-28 JP JP10021088U patent/JPH0221578U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07240444A (en) * | 1994-02-25 | 1995-09-12 | Aging Tesuta Kaihatsu Kyodo Kumiai | Semiconductor chip test equipment |
| JP2001249167A (en) * | 2000-03-06 | 2001-09-14 | Tokyo Weld Co Ltd | Measuring probe driving device |
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