JPH0221578U - - Google Patents

Info

Publication number
JPH0221578U
JPH0221578U JP10021088U JP10021088U JPH0221578U JP H0221578 U JPH0221578 U JP H0221578U JP 10021088 U JP10021088 U JP 10021088U JP 10021088 U JP10021088 U JP 10021088U JP H0221578 U JPH0221578 U JP H0221578U
Authority
JP
Japan
Prior art keywords
wafer
probe
probe head
electromagnet
attached
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10021088U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10021088U priority Critical patent/JPH0221578U/ja
Publication of JPH0221578U publication Critical patent/JPH0221578U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Description

【図面の簡単な説明】
第１図は、この考案の一実施例を示すプローブ
ヘツド先端部拡大図、第２図はウエーハの拡大模
式断面図、第３図は従来のウエーハ検査方法の真
空吸着ステージの要部断面図、第４図は従来のプ
ローブヘツド先端部拡大図である。 ３……ウエーハ、５……電流駆動触子、６……
電圧駆動触子、１９……プローブヘツド本体、２
０……定電流源、２１……制御回路、２２……電
磁石、２３……プリント板、２４……磁石、２５
……おもり、２６……検針。

Claims (1)

  1. 【実用新案登録請求の範囲】 半導体素子形成済みのウエーハをステージ上に
    真空吸着して固定しウエーハへプローブヘツドに
    取り付けられた検針を接触させて通電し特性検査
    を行う装置において、 前記検針を取り付けるプローブヘツドに圧力を
    印加する電磁石と、電磁石から発生する極性と同
    極性の磁石と、その磁石圧力を平衡させるおもり
    を設けることを特徴とする半導体素子検査用プロ
    ーブヘツド。
JP10021088U 1988-07-28 1988-07-28 Pending JPH0221578U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10021088U JPH0221578U (ja) 1988-07-28 1988-07-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10021088U JPH0221578U (ja) 1988-07-28 1988-07-28

Publications (1)

Publication Number Publication Date
JPH0221578U true JPH0221578U (ja) 1990-02-13

Family

ID=31328083

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10021088U Pending JPH0221578U (ja) 1988-07-28 1988-07-28

Country Status (1)

Country Link
JP (1) JPH0221578U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07240444A (ja) * 1994-02-25 1995-09-12 Aging Tesuta Kaihatsu Kyodo Kumiai 半導体チップ試験装置
JP2001249167A (ja) * 2000-03-06 2001-09-14 Tokyo Weld Co Ltd 測定プローブ駆動装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07240444A (ja) * 1994-02-25 1995-09-12 Aging Tesuta Kaihatsu Kyodo Kumiai 半導体チップ試験装置
JP2001249167A (ja) * 2000-03-06 2001-09-14 Tokyo Weld Co Ltd 測定プローブ駆動装置

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