JPH01146534U - - Google Patents
Info
- Publication number
- JPH01146534U JPH01146534U JP4426088U JP4426088U JPH01146534U JP H01146534 U JPH01146534 U JP H01146534U JP 4426088 U JP4426088 U JP 4426088U JP 4426088 U JP4426088 U JP 4426088U JP H01146534 U JPH01146534 U JP H01146534U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- probe
- probe head
- attached
- pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000523 sample Substances 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
Description
第１図は、この考案の一実施例を示すプローブ
ヘツド先端部拡大図、第２図はウエーハの拡大模
式断面図、第３図は本考案プローブヘツドの制御
ブロツク図、第４図は、従来のウエーハ検査方法
の真空吸着ステージの要部断面図、第５図は従来
のプローブヘツド先端部拡大図である。
３……ウエーハ、５……電流駆動触子、６……
電圧駆動触子、１９……プローブヘツド本体、２
０……アクチユエータ、２１……圧電素子、２５
……圧力センサ、２６……検針。
FIG. 1 is an enlarged view of the tip of a probe head showing an embodiment of the invention, FIG. 2 is an enlarged schematic sectional view of a wafer, FIG. 3 is a control block diagram of the probe head of the invention, and FIG. 4 is a conventional one. FIG. 5 is an enlarged view of the tip of a conventional probe head. 3...Wafer, 5...Current drive contactor, 6...
Voltage-driven contactor, 19...probe head body, 2
0... Actuator, 21... Piezoelectric element, 25
...Pressure sensor, 26...Meter reading.
Claims (1)
真空吸着して固定しウエーハへプローブヘツドに
取り付けられた検針を接触させて通電し特性検査
を行う装置において、 前記検針を取り付けるプローブヘツドに圧力を
印加する圧電アクチユエータとその圧力を検出す
る圧力センサを設けることを特徴とする半導体素
子特性検査用プローブヘツド。[Scope of Claim for Utility Model Registration] A device in which a wafer on which semiconductor elements have been formed is fixed by vacuum suction on a stage, and a probe attached to a probe head is brought into contact with the wafer to conduct a characteristic test by energizing the wafer, wherein the probe is attached. A probe head for testing characteristics of semiconductor devices, characterized in that it is provided with a piezoelectric actuator that applies pressure to the probe head and a pressure sensor that detects the pressure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4426088U JPH01146534U (en) | 1988-03-31 | 1988-03-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4426088U JPH01146534U (en) | 1988-03-31 | 1988-03-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01146534U true JPH01146534U (en) | 1989-10-09 |
Family
ID=31270628
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4426088U Pending JPH01146534U (en) | 1988-03-31 | 1988-03-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01146534U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07240444A (en) * | 1994-02-25 | 1995-09-12 | Aging Tesuta Kaihatsu Kyodo Kumiai | Semiconductor chip test equipment |
| JP2011226833A (en) * | 2010-04-16 | 2011-11-10 | Micronics Japan Co Ltd | Pressure sensor and probe card inspection apparatus using the same |
-
1988
- 1988-03-31 JP JP4426088U patent/JPH01146534U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07240444A (en) * | 1994-02-25 | 1995-09-12 | Aging Tesuta Kaihatsu Kyodo Kumiai | Semiconductor chip test equipment |
| JP2011226833A (en) * | 2010-04-16 | 2011-11-10 | Micronics Japan Co Ltd | Pressure sensor and probe card inspection apparatus using the same |
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