JPH0223590A - Method for mounting magnetic bubble memory element - Google Patents

Abstract

PURPOSE:To simplify a magnetic bubble memory element mounting process by mounting plural magnetic bubble memory elements on a belt-like tape carrier in an arranged state and piling up the elements in numerous stages by forming the carrier, and then, connecting the wiring pattern at both ends of the carrier to outside connecting terminals on a base plate. CONSTITUTION:A belt-like tape carrier 55 is formed of a wiring pattern 51 and insulating film 52 and magnetic bubble memory elements 1 are mounted on the carrier 5. Then the magnetic bubble memory elements 5 are piled up in numerous stages by folding the carrier 5 in the form of S and the wiring pattern 51 provided at both ends of the carrier 5 are connected with outside connecting terminals 41 provided on the upper surface of a base plate 4. When such constitution is used, the magnetic bubble memory elements can be mounted by an extremely simplified process.

Description

[Detailed Description of the Invention] [Summary] Regarding a magnetic bubble memory device in which a plurality of magnetic bubble memory elements are mounted in multiple stages on a substrate via a tape carrier, a magnetic bubble that can greatly simplify the process of mounting in multiple stages is disclosed. The purpose of the present invention is to provide a method for mounting memory elements in a magnetic bubble memory device in which a plurality of magnetic bubble memory elements are mounted in multiple stages on a substrate via a tape carrier having a wiring pattern formed on an insulating film. Multiple magnetic bubble memory elements are mounted side by side on a tape carrier, the magnetic bubble memory elements are stacked in multiple stages by folding back the tape carrier, and the wiring patterns provided at both ends of the tape carrier are connected to external connection terminals on the board. do.

[Industrial application field]

The present invention relates to a magnetic bubble memory device in which a plurality of magnetic bubble memory elements are mounted on a substrate in multiple stages via a tape carrier, and in particular, a method for mounting magnetic bubble memory elements that greatly simplifies the process of mounting in multiple stages. Regarding.

In a magnetic bubble memory device with a relatively small storage capacity, one or two magnetic bubble memory elements are usually mounted flatly on a substrate, but as the storage capacity of the magnetic bubble memory device increases, It has become impossible to achieve this with one or two magnetic bubble memory elements, so a magnetic bubble memory device is used in which multiple magnetic bubble memory elements are mounted in multiple stages on the same substrate via a tape carrier. ing.

However, magnetic bubble memory devices have a large number of external connection terminals formed in a limited area, and it is extremely difficult to connect each external connection terminal of a multi-stage magnetic bubble memory device to an external connection terminal on the board. Have difficulty. Therefore, various mounting methods have been developed that greatly simplify the work of multi-stage mounting.

[Conventional technology]

Figure 2 is a schematic diagram for explaining the conventional mounting method.In the conventional mounting method, the magnetic bubble memory element 1 is mounted on the upper stage.
As shown in FIG. 2(a), the magnetic bubble memory element 1 is mounted on a tape carrier 2 having a wiring pattern 22 formed on an insulating film 21, and the magnetic bubble memory element 1 mounted on the lower stage is shown in FIG. As shown in (b), a tape carrier 3 having a wiring pattern 32 formed on an insulating film 31
has been implemented.

FIG. 2 (C1
As shown in , first, the tape carrier 2 on which the magnetic bubble memory element 1 is mounted is stacked on the tape carrier 3 on which the magnetic bubble memory element 1 is mounted, and the wiring pattern 22 of the tape carrier 2 is replaced with the wiring pattern of the tape carrier 3. 32, the wiring pattern 32 of the tape carrier 3 is connected to an external connection terminal 41 formed on the substrate 4.

[Problem to be solved by the invention]

However, since a large number of wiring patterns on a tape carrier are formed in a limited area, each wiring pattern has a narrow conductor width and narrow gaps between conductors.Therefore, in the conventional mounting method, the tape carrier 3 There is a problem in that the process of aligning and connecting the wiring pattern 22 of the tape carrier 2 to the wiring pattern 32 is extremely complicated and requires a lot of work time and skill of the operator.

SUMMARY OF THE INVENTION An object of the present invention is to provide a method for mounting a magnetic bubble memory element that can greatly simplify the multi-stage mounting process.

[Means to solve the problem]

FIG. 1 is a schematic diagram for explaining the mounting method according to the present invention. The same objects are represented by the same symbols throughout the figures.

The above problem is solved in a magnetic bubble memory device in which a plurality of magnetic bubble memory elements are mounted in multiple stages on a substrate via a tape carrier having a wiring pattern formed on an insulating film. The magnetic bubble memory elements 1 are mounted side by side, the tape carrier 5 is folded back and the magnetic bubble memory elements 1 are stacked in multiple stages, and the wiring patterns 51 provided at both ends of the tape carrier 5 are connected to the external connection terminals 41 on the substrate 4. This is achieved by the magnetic bubble memory element mounting method according to the present invention.

[Effect]

In Figure 1, a plurality of magnetic bubble memory elements are mounted side by side on a strip-shaped tape carrier, the tape carrier is folded back and the magnetic bubble memory elements are stacked in multiple tiers, and the wiring patterns provided at both ends of the tape carrier are connected externally on the board. To realize a mounting method for a magnetic bubble memory element, which eliminates alignment and connection of wiring patterns that require a lot of work time and operator skill by connecting to terminals, and greatly simplifies the multi-stage mounting process. I can do it.

〔Example〕

Embodiments of the present invention will be described in detail below with reference to FIG.

In FIG. 1(a), the mounting method of the magnetic bubble memory element according to the present invention is as follows: a wiring pattern 51 and an insulating film 52
A strip-shaped tape carrier 5 is formed, and a plurality of magnetic bubble memory elements 1 (four in the figure) are mounted on the tape carrier 5.

As shown in FIG. 1 [b], the tape carrier 5 on which the magnetic bubble memory elements 1 are mounted is folded back in an S-shape, and the magnetic bubble memory elements 5 are stacked in multiple stages.
Wiring patterns 51 provided at both ends of the substrate 4 are connected to external connection terminals 41 provided on the upper surface of the substrate 4 .

In this way, multiple magnetic bubble memory elements are mounted side by side on a strip-shaped tape carrier, the tape carrier is folded back and the magnetic bubble memory elements are stacked in multiple tiers, and the wiring patterns provided at both ends of the tape carrier are connected to external connections on the board'. By connecting to terminals, we have realized a mounting method for magnetic bubble memory elements that eliminates the need for alignment and connection between wiring patterns, which requires multiple work hours and operator skill, and greatly simplifies the multi-stage mounting process. be able to.

[Effects of the Invention] As described above, according to the present invention, it is possible to provide a method for mounting a magnetic bubble memory element, which greatly simplifies the multi-stage mounting process.

[Brief explanation of the drawing]

FIG. 1 is a schematic diagram for explaining the mounting method according to the present invention, and FIG. 2 is a schematic diagram for explaining the conventional mounting method. In the figure, 1 is a magnetic bubble memory element, 4 is a substrate, 5 is a tape carrier, 41 is an external connection terminal, 51 is a wiring pattern, and 52 is an insulating film. It’s going to be sun and moon today□! How to install ΣΣ The cause of γ-0 in the month 1 Concave Conventional method

Claims (1)

[Claims] A magnetic bubble memory device in which a plurality of magnetic bubble memory elements are mounted in multiple stages on a substrate via a tape carrier having a wiring pattern formed in the shape of an insulating film, comprising: a strip-shaped tape carrier (5 ), a plurality of magnetic bubble memory elements (1) are mounted side by side on a tape carrier (5), and the magnetic bubble memory elements (1) are stacked in multiple stages by folding back the tape carrier (5). Connect the wiring pattern (51) to the external connection terminal (4) on the board (4).
1) A method for mounting a magnetic bubble memory element characterized by connecting to.