JPH02177352A - Cooling structure of integrated circuit - Google Patents

Abstract

PURPOSE:To discharge heat build-up of a semiconductor chip to the outside effectively by forming a refrigerant flow path, providing a spot facing hole between cold plates hitting against an IC and jetting out the refrigerant within an intake room toward the bottom surface of the spot facing hole. CONSTITUTION:A cold plate 5 with a spot facing hole 4 is mounted to a substrate frame 3 at a position hitting against the upper surface of an IC2 and corresponding to the IC2 of that surface. An intake port 8 and a takeout port 9 of a refrigerant are provided on the plate 5, a cooling container 11 screened by a barrier 10 is adhered to, a nozzle 7 opposing to the bottom surface of the hole 4 at right angle is formed at the container 11. When the refrigerant 6 is allowed to flow from the takeout port 8, it fills an intake room 12 and is jetted out from the nozzle 7 toward the hole 4. Then, the refrigerant 6 is collected at a discharge room 13 through a hole of the container 11 and is discharged from the takeout port 9.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a cooling structure for integrated circuits, and in particular to a cooling structure for integrated circuits, in particular, a cooling structure for an integrated circuit that can efficiently discharge heat generated from a semiconductor chip to the outside of the device.
This invention relates to a cooling structure for an SI package.

[Conventional technology]

Conventionally, this type of cooling structure for an integrated circuit has been provided with a cold plate 1~ located on the integrated circuit and a cooling container serving as a coolant flow path, and these have been divided into two parts. 183889).

[Problem to be solved by the invention]

The conventional cooling structure described above has a drawback in that the higher the heat generated from the semiconductor chip, the more the flow rate of the coolant must be changed to accommodate the increase.

Furthermore, since the cold plate, which the integrated circuit contacts, and the cooling container, which serves as a coolant flow path, are divided into two parts, there is a drawback that the thermal resistance between the integrated circuit and the integrated circuit becomes high.

[Means to solve the problem]

The integrated circuit cooling structure of the present invention includes an integrated circuit mounted on a substrate, a cold brute provided with a counterbore hole on the back side of the surface facing the top surface of the integrated circuit with a small distance therebetween, and a coolant intake port. A refrigerant flow path connected to the counterbore and the discharge chamber is formed between the cold plate which is in close contact with the cold plate, the refrigerant flow path being connected to the counterbore and the discharge chamber, and the refrigerant in the suction chamber being connected to the refrigerant outlet. The cooling device includes a cooling device provided with a nozzle that can reach the bottom of the counterbore and emit water.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a sectional view of an embodiment of the present invention. Referring to FIG. 1, 1 is a substrate, and 2 is an integrated circuit mounted on the substrate. The outer peripheral edge of the substrate 1 is firmly fixed to the substrate frame 3. A counterbore hole 4 is provided on the top surface of the integrated circuit 2 at a position corresponding to the IA integrated circuit 2 on the opposite surface with a minute interval maintained therebetween.
A cold pluto 5 having a shape is attached to the substrate frame 3. A cooling container 11 is provided with a refrigerant intake port 8 and a refrigerant exit port 9 on top of the cold plate 5, and a partition wall 10 is provided in order to create a partition between the two. A nozzle 7 is provided which faces perpendicularly to the.

When the refrigerant 6 flows in the direction of the arrow from the intake port 8 of the cooling container 11, it fills the suction chamber 12 partitioned by the partition wall 10, and is sprayed into the counterbore holes 4 from each nozzle 7. The refrigerant 6 that has been sifted passes through holes provided in the cooling container 11 and collects in the discharge chamber 13, and is discharged to the outside through the outlet 9. The arrows in FIG. 1 indicate the flow of the refrigerant 6.

〔Effect of the invention〕

As explained above, by adopting the above structure, the present invention effectively transfers the heat generated from the semiconductor chip to the outside of the device by keeping the thermal resistance with the integrated circuit low with a simple structure and without changing the flow rate of the coolant. It has the effect of allowing it to be discharged.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of an embodiment of the present invention. 1... Board, 2... S-circuit, 3...
... Board frame, 4 ... Counterbore hole, 5 ...
...cold plate, 6...refrigerant, 7...
...Nozzle, 8...Intake, 9...Outlet, 10...Partition, 11...Cooling container, 12... Suction chamber, 13... Discharge chamber, 14... Refrigerant flow path.

Claims (1)

[Claims] An integrated circuit mounted on a substrate, a cold pluto having a counterbore on the back side of the surface facing the top surface of the integrated circuit with a small distance therebetween, a suction chamber connected to a refrigerant intake port, and a refrigerant exit port. and a discharge chamber connected to the counterbore, a refrigerant flow path connected to the counterbore and the discharge chamber is formed between the cold plate that is in close contact with the cold plate, and a nozzle is configured to jet the refrigerant in the suction chamber toward the bottom of the counterbore. A cooling structure for an integrated circuit, comprising a cooling device provided with a cooling device.