JPH0224543U - - Google Patents

Info

Publication number
JPH0224543U
JPH0224543U JP1988101331U JP10133188U JPH0224543U JP H0224543 U JPH0224543 U JP H0224543U JP 1988101331 U JP1988101331 U JP 1988101331U JP 10133188 U JP10133188 U JP 10133188U JP H0224543 U JPH0224543 U JP H0224543U
Authority
JP
Japan
Prior art keywords
solder
supplying
pellet
stirring
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988101331U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988101331U priority Critical patent/JPH0224543U/ja
Publication of JPH0224543U publication Critical patent/JPH0224543U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01308—Manufacture or treatment of die-attach connectors using permanent auxiliary members, e.g. using alignment marks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例にかかる半導体製造
装置の概略説明図、第２図は同実施例のコーテイ
ング手段７を説明する斜視図、第３図は同実施例
の半田供給手段と半田撹拌手段とペレツト供給手
段を説明する斜視図、第４図から第６図は従来の
リードフレームのペレツトマウント予定部を示す
断面図である。 １……リードフレーム、２……ペレツトマウン
ト予定部、３……半田、４……半導体ペレツト、
５……ガイドレール、６……樹脂層、７……コー
テイング手段、８……半田供給手段、９……半田
撹拌手段、１０……ペレツト供給手段。

Claims (1)

  1. 【実用新案登録請求の範囲】 リードフレームをガイドするガイドレールと、 リードフレームのペレツトマウント予定部を取
    り囲む領域に樹脂コーテイングするコーテイング
    手段と、 上記ペレツトマウント予定部に半田を供給する
    半田供給手段と、 上記半田供給手段によつて供給された半田を撹
    拌する半田撹拌手段と、 上記半田撹拌手段で撹拌された半田上に半導体
    ペレツトを供給するペレツト供給手段よりなる半
    導体製造装置。
JP1988101331U 1988-07-29 1988-07-29 Pending JPH0224543U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988101331U JPH0224543U (ja) 1988-07-29 1988-07-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988101331U JPH0224543U (ja) 1988-07-29 1988-07-29

Publications (1)

Publication Number Publication Date
JPH0224543U true JPH0224543U (ja) 1990-02-19

Family

ID=31330224

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988101331U Pending JPH0224543U (ja) 1988-07-29 1988-07-29

Country Status (1)

Country Link
JP (1) JPH0224543U (ja)

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