JPH022656A - Semiconductor device with heat radiating plate - Google Patents
Semiconductor device with heat radiating plateInfo
- Publication number
- JPH022656A JPH022656A JP63148753A JP14875388A JPH022656A JP H022656 A JPH022656 A JP H022656A JP 63148753 A JP63148753 A JP 63148753A JP 14875388 A JP14875388 A JP 14875388A JP H022656 A JPH022656 A JP H022656A
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- semiconductor device
- package
- view
- heat radiating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半導体装置に関し、特に放熱板付半導体装置に
関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor device, and particularly to a semiconductor device with a heat sink.
従来の少なくともパッケージの一端部に露出する放熱板
を有する放熱板付半導体装置は、その放熱板の露出部と
パッケージ内部との境界部分ては放熱板は水平な板状の
構造を有していた。この−例を第３図（ａ）、（ｂ）、
（ｃ）に示す。第３図（ａ）は従来の放熱板付半導体装
置の平面図であり、第３図（ｂ）はその側面図、第３図
（Ｃ）はその正面図である。これらの図において、１は
放熱板であり、２はこの放熱板１上にマウントされた半
導体素子、３はパッケージ、４は外部リードである。第
３図（ａ）のａ−ａ線に沿った断面で表わされる放熱板
１の露出部とパッケージ内部との境界部分では放熱板１
は水平な板状の構造を有している。In a conventional semiconductor device with a heat sink having a heat sink exposed at least at one end of the package, the heat sink has a horizontal plate-like structure at the boundary between the exposed portion of the heat sink and the inside of the package. This example is shown in Figure 3 (a), (b),
Shown in (c). FIG. 3(a) is a plan view of a conventional semiconductor device with a heat sink, FIG. 3(b) is a side view thereof, and FIG. 3(C) is a front view thereof. In these figures, 1 is a heat sink, 2 is a semiconductor element mounted on the heat sink 1, 3 is a package, and 4 is an external lead. At the boundary between the exposed part of the heat sink 1 and the inside of the package, which is shown in the cross section along the a-a line in FIG. 3(a), the heat sink 1
has a horizontal plate-like structure.
上述した従来の放熱板付半導体装置は、上記の様な構造
を有するため、衝突、落下等により物理的外部力が放熱
板１の露出部に加えられると、放熱板１が第３図（ａ）
のａ−ａ線に沿った断面で表わされる露出部とパッケー
ジ内部との境界部で折れ曲がりやすく、場合によって折
れ曲がった放熱板１が外部リード４に接触して、外部リ
ード４も折れ曲がり、実装性が悪化するという欠点があ
る。Since the above-described conventional semiconductor device with a heat sink has the above-described structure, when a physical external force is applied to the exposed portion of the heat sink 1 due to a collision, a fall, etc., the heat sink 1 will move as shown in FIG. 3(a).
It is easy to bend at the boundary between the exposed part and the inside of the package, which is represented by the cross section along the a-a line, and in some cases, the bent heat sink 1 comes into contact with the external lead 4, and the external lead 4 also bends, resulting in poor mounting performance. The disadvantage is that it gets worse.
本発明の目的は、放熱板の材質、厚さ等を変更すること
なく放熱板露出部の物理的外部力による変形を減らし、
さらに放熱板の変形による外部リードの変形が起らない
放熱板付半導体装置を提供することにある。The purpose of the present invention is to reduce the deformation of the exposed portion of the heat sink due to physical external force without changing the material, thickness, etc. of the heat sink.
Another object of the present invention is to provide a semiconductor device with a heat sink in which external leads are not deformed due to deformation of the heat sink.
本発明の放熱板付半導体装置は、少なくともパッケージ
の一端部より露出する放熱板を有する半導体装置におい
て、放熱板の露出部とパッケージ内部との境界部分で放
熱板がパッケージの内外にまたがる凹状成形構造を有し
ている。A semiconductor device with a heat sink of the present invention is a semiconductor device having a heat sink exposed from at least one end of the package, in which the heat sink has a concave molded structure that spans the inside and outside of the package at the boundary between the exposed portion of the heat sink and the inside of the package. have.
次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
筑１図（ａ）、（ｂ）、（ｃ）は本発明の一実施例の平
面図、側面図、および正面図である。Figures (a), (b), and (c) are a plan view, a side view, and a front view of an embodiment of the present invention.
第１図（ａ）、（ｂ）、（ｃ）において、１は放熱板で
あり、２はこの放熱板１上にマウントされた半導体素子
、３はパッケージ、４は外部り一部、５は放熱板１の凹
状成形部分である。In FIGS. 1(a), (b), and (c), 1 is a heat sink, 2 is a semiconductor element mounted on the heat sink 1, 3 is a package, 4 is an external part, and 5 is a heat sink. This is a concave molded portion of the heat dissipation plate 1.
第１図（ａ）のａ−ａ線に沿った断面で表わされる放熱
板１の露出部とパッケージ内部との境界部分で、放熱板
１にパッケージ３の内外にまたがる凹状成形部分５を持
たせることにより、従来の放熱板付半導体装置に比べ、
第１図（ａ）のａ −ａ線に沿った断面で表わされる放
熱板１の露出部とパッケージ内部との境界部分の強度が
増すのである。At the boundary between the exposed part of the heat sink 1 and the inside of the package, which is shown in the cross section along the a-a line in FIG. As a result, compared to conventional semiconductor devices with heat sinks,
This increases the strength of the boundary between the exposed portion of the heat sink 1 and the inside of the package, which is represented by a cross section taken along line a-a in FIG. 1(a).
第２図（ａ＞、（ｂ）、（ｃ）は本発明の他の実施例の
平面図、側面図、および正面図である。FIGS. 2(a), (b), and (c) are a plan view, a side view, and a front view of another embodiment of the present invention.
この実施例では、放熱板１の凹状成形部分５を３つに増
しである。そのため第２図（ａ）のａ−ａ線に沿った断
面で表わされる放熱板１の露出部とパッケージ内部との
境界部分の強度が第１の実施例の場合よりもさらに増す
。In this embodiment, the number of concave molded portions 5 of the heat sink 1 is increased to three. Therefore, the strength of the boundary portion between the exposed portion of the heat sink 1 and the inside of the package, which is represented by a cross section taken along line a-a in FIG. 2(a), is further increased than in the first embodiment.
さらに放熱板表面積を大きくすることにもなり、放熱効
率が良くなるという利点もある。Furthermore, it also increases the surface area of the heat sink, which has the advantage of improving heat dissipation efficiency.
以上説明したように本発明は、放熱板の露出部とパッケ
ージ内部との境界部分で放熱板にパッケージの内外にま
たがる凹状成形構造を持たせることにより、放熱板の材
質、厚さ等を変更することなく、放熱板露出部の物理的
外部力による変形を減らし、さらに放熱板の変形による
外部リードの変形が起こらない放熱板付半導体装置を実
現できるという効果がある。As explained above, the present invention changes the material, thickness, etc. of the heat sink by giving the heat sink a concave molded structure that spans the inside and outside of the package at the boundary between the exposed part of the heat sink and the inside of the package. This has the effect of reducing the deformation of the exposed portion of the heat sink due to physical external force and realizing a semiconductor device with a heat sink in which deformation of the external leads due to deformation of the heat sink does not occur.
第１図（ａ＞、（ｂ）、（ｃ）は本発明の一実施例の平
面図、側面図、および正面図、第２図（ａ）、（ｂ）、
（ｃ）は本発明の他の実施例の平面図、側面図、正面図
、第３図（ａ＞、（ｂ）、（ｃ）は従来の放熱板付半導
体装置の一例の平面図、側面図、正面図である。
１・・・放熱板、２・・・半導体素子、３・・・パッケ
ージ、４・・・外部リード、５・・・放熱板の凹状成形
部殆 １ ズ
Ｉ−θ
灼
図
日
納
スFIGS. 1(a), (b), and (c) are a plan view, a side view, and a front view of an embodiment of the present invention; FIGS. 2(a), (b),
(c) is a plan view, side view, and front view of another embodiment of the present invention, and FIG. 3 (a>, (b), and (c) are plan views and side views of an example of a conventional semiconductor device with a heat sink. , is a front view. 1... Heat sink, 2... Semiconductor element, 3... Package, 4... External lead, 5... Concave molded portion of heat sink. Diagram daily payment
Claims (1)
する半導体装置において、放熱板の露出部とパッケージ
内部との境界部分で放熱板がパッケージの内外にまたが
る凹状成形構造を有することを特徴とする放熱板付半導
体装置。A semiconductor device having a heat sink exposed from at least one end of the package, wherein the heat sink has a concave molded structure spanning the inside and outside of the package at a boundary between the exposed portion of the heat sink and the inside of the package. Device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63148753A JPH022656A (en) | 1988-06-15 | 1988-06-15 | Semiconductor device with heat radiating plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63148753A JPH022656A (en) | 1988-06-15 | 1988-06-15 | Semiconductor device with heat radiating plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH022656A true JPH022656A (en) | 1990-01-08 |
Family
ID=15459863
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63148753A Pending JPH022656A (en) | 1988-06-15 | 1988-06-15 | Semiconductor device with heat radiating plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH022656A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR19990035569A (en) * | 1997-10-31 | 1999-05-15 | 윤종용 | package |
-
1988
- 1988-06-15 JP JP63148753A patent/JPH022656A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR19990035569A (en) * | 1997-10-31 | 1999-05-15 | 윤종용 | package |
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