JPH02273952A - Method of inserting wire into a capillary - Google Patents

Abstract

PURPOSE:To enable smooth insertion in a short time without requiring trained skill by applying ultrasonic wave vibration to a capillary when a wire is inserted into the capillary. CONSTITUTION:A capillary is fixed to one end of a bonding arm 3, and a vibrator 5 is fixed to the other end. When a wire 7 is inserted into the capillary 4, the switch of a vibration source 10 is turned ON, and voltage and current are applied to the vibrator 5, thereby vibrating the capillary 5 via the bonding arm 3. By the effect of ultrasonic wave vibration of the capillary 4, the wire 7 is prevented from attaching to the inner surface of the capillary 4, and the friction resistance between the wire 7 and the capillary 4 can be reduced. By this constitution, the wire 7 can be smoothly inserted into the capillary 4.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a first bonding point (for example, a bullet) of a semiconductor component.
The present invention relates to a method for passing a wire through a capillary in a wire bonder that connects a wire with a capillary between a wire and a second bond point (for example, a lead).

[Prior Art] When replacing the spool on which the wire is wound or when the wire breaks and comes out of the capillary during operation of the wire bonder, the tip of the wire is passed through the hole in the capillary and protrudes from the lower end of the capillary. Requires work.

Conventionally, such a wire threading operation is performed by holding the tip of the wire by hand.

[Problems to be Solved by the Invention] The above conventional technology has the problem that when passing the wire through the capillary, the wire sticks to the inner surface of the capillary and cannot be inserted smoothly, which takes a lot of time and requires skill. there were.

An object of the present invention is to provide a method for passing a wire through a capillary, which allows the wire to be passed through the capillary smoothly.

[Means for Solving the Problem] The above object is achieved by applying ultrasonic vibration to the capillary when passing the wire through the capillary.

[Function] Applying vibration to the capillary when passing the wire through the wire prevents the wire from sticking to the capillary and also reduces the frictional resistance between the two, allowing the wire to pass through the capillary smoothly.

[Example] Hereinafter, an example of the present invention will be described with reference to FIG. XY
A bonding head 2 is mounted on the child table, and this bonding head 2 is provided with a bonding arm 3 that can be moved up and down or rotated by a drive means (not shown). A capillary 4 is fixed to one end of the bonding arm 3, and a vibrator 5 is fixed to the other end. A wire 7 wound around a spool 6 is attached to the capillary 4 through a guide 8. It is inserted into the capillary 4 via the clamper 9. Further, a vibration source lO is connected to the vibrator 5.

By the way, when passing the wire 7 through the capillary 4, the vibration source lO is turned on. As a result, voltage and current are applied to the vibrator 5, and the capillary 4 vibrates via the pounding arm 3. This ultrasonic vibration of the capillary 4 prevents the wire 7 from sticking to the inner surface of the capillary 4, and also reduces the frictional resistance between the wire 7 and the capillary 4, so that the wire 7 can be smoothly inserted into the capillary 4.
can be passed through.

In addition, in the ultrasonic wire bonder, the vibrator 5
Since it is equipped with a vibration source 10 and a vibration source 10, it can be easily performed by using it. For example, in a thermocompression type wire bonder that is not an ultrasonic type, this can be carried out by attaching the vibrator 5 connected to the vibration source 10 to the bonding arm 3, or by applying the vibrator 5 to the bonding arm 3. .

[Effects of the Invention] As is clear from the above description, according to the present invention, when a wire is passed through a capillary, ultrasonic vibration is applied to the capillary, so that the wire can be inserted smoothly in a short time and without requiring any skill. .

[Brief explanation of drawings]

FIG. 1 is an explanatory diagram showing an example of a wire bonder used in a method according to an embodiment of the present invention. 3: Ponding arm, : Cavillary. 5: Vibrator. Nispur. 7: Wire, O: Vibration source. Fig. 1 3: Sho 2 te'°i〉Deform 4: Cab ridge 5: Insertion tfi+ 6: Spool 7: Wire 10: Image holder

Claims (1)

[Claims] (1) In a wire bonder that inserts a wire wound around a spool into a capillary and connects the wire between the first bond point and the second bond point of a semiconductor component using the capillary, when the wire is passed through the capillary, the capillary A method for passing a wire through a capillary, characterized by applying sonic vibration.