JPH0377445U - - Google Patents
Info
- Publication number
- JPH0377445U JPH0377445U JP1989139087U JP13908789U JPH0377445U JP H0377445 U JPH0377445 U JP H0377445U JP 1989139087 U JP1989139087 U JP 1989139087U JP 13908789 U JP13908789 U JP 13908789U JP H0377445 U JPH0377445 U JP H0377445U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- elasticity
- circuit board
- printed circuit
- end side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Description
第１図は本考案の原理図、第２図は一実施例に
よる半導体チツプの接続構造を示す図、第３図は
本実施例の接続部材を示す斜視図、第４図は従来
の半導体チツプの接続構造を示す側断面図である
。 図において、１……基板、１−１……表面パタ
ーン、２……チツプ、２−１……パツド、１３，
２３……接続部材、１３ａ，２３ａ……押圧部、
２３ｂ……接合部、２３ａ……スリツト、２３−
１……相転移板、２３−２……絶縁膜、２３−３
……接続パターン、を示す。
よる半導体チツプの接続構造を示す図、第３図は
本実施例の接続部材を示す斜視図、第４図は従来
の半導体チツプの接続構造を示す側断面図である
。 図において、１……基板、１−１……表面パタ
ーン、２……チツプ、２−１……パツド、１３，
２３……接続部材、１３ａ，２３ａ……押圧部、
２３ｂ……接合部、２３ａ……スリツト、２３−
１……相転移板、２３−２……絶縁膜、２３−３
……接続パターン、を示す。
Claims (1)
- プリント回路基板１の主面に形成された表面パ
ターン１−１のそれぞれに弾性および導電性を有
する多数本の接続部材１３の一端側を接合して、
他端側に設けた押圧部１３ａを半導体チツプ２に
配列された各外部接合パツド２−１に圧接させ、
当該接続部材１３の弾性により上記プリント回路
基板１の各該表面パターン１−１と上記半導体チ
ツプ２の各該パツド２−１と接続するとともに当
該半導体チツプ２を保持するように構成したこと
を特徴とする半導体チツプの接続構造。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989139087U JPH0377445U (ja) | 1989-11-29 | 1989-11-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989139087U JPH0377445U (ja) | 1989-11-29 | 1989-11-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0377445U true JPH0377445U (ja) | 1991-08-05 |
Family
ID=31686148
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989139087U Pending JPH0377445U (ja) | 1989-11-29 | 1989-11-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0377445U (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006144524A (ja) * | 2004-11-19 | 2006-06-08 | Toyoyuki Murase | 尿排出器具 |
| JP2010148852A (ja) * | 2008-11-18 | 2010-07-08 | Shoji Shimada | 排便介護器具 |
-
1989
- 1989-11-29 JP JP1989139087U patent/JPH0377445U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006144524A (ja) * | 2004-11-19 | 2006-06-08 | Toyoyuki Murase | 尿排出器具 |
| JP2010148852A (ja) * | 2008-11-18 | 2010-07-08 | Shoji Shimada | 排便介護器具 |