JPH0227762U - - Google Patents

Info

Publication number
JPH0227762U
JPH0227762U JP10593788U JP10593788U JPH0227762U JP H0227762 U JPH0227762 U JP H0227762U JP 10593788 U JP10593788 U JP 10593788U JP 10593788 U JP10593788 U JP 10593788U JP H0227762 U JPH0227762 U JP H0227762U
Authority
JP
Japan
Prior art keywords
integrated circuit
hybrid integrated
multilayer
view
electrically
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10593788U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10593788U priority Critical patent/JPH0227762U/ja
Publication of JPH0227762U publication Critical patent/JPH0227762U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Combinations Of Printed Boards (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例の混成集積回路モジ
ユールの概略斜視図、第２図はその縦断面図、第
３図はこの実施例における部品の多層混成集積回
路基板の接続装置を示す斜視図、第４図、第５図
、第６図はその他のそれぞれ別の接続装置を示す
斜視図、第７図はこれらの実施例の多層集積回路
基板にリードを取付けた状態を示す図、第８図は
その他のリード取付状態を示す図である。 図中、１１，１２，１３，１４は多層混成集積
回路基板、１４ｂ，１４ｂ……，１５，１５……
は電子部品、１６はクリツプ、１７は導電性接続
体、１８はセラミツクチツプ、１９，１９は接続
ピンである。

Claims (1)

    【実用新案登録請求の範囲】
  1. 混成集積回路を形成した層の複数積層体からな
    る多層混成集積回路基板をその両面に電子部品搭
    載可能に複数枚垂直方向に並べ、かつ電気的及び
    機械的に結合したことを特徴とする混成集積回路
    モジユール。
JP10593788U 1988-08-12 1988-08-12 Pending JPH0227762U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10593788U JPH0227762U (ja) 1988-08-12 1988-08-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10593788U JPH0227762U (ja) 1988-08-12 1988-08-12

Publications (1)

Publication Number Publication Date
JPH0227762U true JPH0227762U (ja) 1990-02-22

Family

ID=31338999

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10593788U Pending JPH0227762U (ja) 1988-08-12 1988-08-12

Country Status (1)

Country Link
JP (1) JPH0227762U (ja)

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