JPH022888U - - Google Patents

Info

Publication number
JPH022888U
JPH022888U JP1988078821U JP7882188U JPH022888U JP H022888 U JPH022888 U JP H022888U JP 1988078821 U JP1988078821 U JP 1988078821U JP 7882188 U JP7882188 U JP 7882188U JP H022888 U JPH022888 U JP H022888U
Authority
JP
Japan
Prior art keywords
heat
electronic circuit
circuit package
plate
attached
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988078821U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988078821U priority Critical patent/JPH022888U/ja
Publication of JPH022888U publication Critical patent/JPH022888U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07354—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/341—Dispositions of die-attach connectors, e.g. layouts
    • H10W72/347—Dispositions of multiple die-attach connectors

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の一実施例を示す構造図、第２
図は本実施例の放熱構造の斜視図、第３図は本実
施例の使用状態を示す斜視図、第４図は従来例を
示す斜視図である。 １……電子回路パツケージ、４……ＩＣ、５…
…熱伝導板、６……ヒートシンク、７……接触片
、８……シエルフ、９……表面カバー、９ａ……
放熱穴。 Figure 1 is a structural diagram showing one embodiment of the present invention;
The figure is a perspective view of the heat dissipation structure of this embodiment, FIG. 3 is a perspective view showing the usage state of this embodiment, and FIG. 4 is a perspective view of a conventional example. 1...Electronic circuit package, 4...IC, 5...
...Thermal conduction plate, 6... Heat sink, 7... Contact piece, 8... Shelf, 9... Surface cover, 9a...
Heat radiation hole.

Claims (1)

【実用新案登録請求の範囲】 シエルフ内に収容される電子回路パツケージの
所定の位置に実装された複数個のＩＣから発生す
る熱を、前記ＩＣの放熱面に接触させた熱伝導部
材を介して空気中に放熱するＩＣの放熱構造にお
いて、 前記ＩＣをその放熱面が前記電子回路パツケー
ジと平行となるように実装し、 金属性の熱伝導部材から成る板状の熱伝導板の
一端に金属板を略Ｚ状に折り曲げて形成したヒー
トシンクの一片を面接触させて取り付けると共に
、この熱伝導板の前記ＩＣと対応する位置に、金
属性の薄板状の熱伝導部材をＵ字状に折り曲げて
バネ性を有するように形成された接触片の一端を
固定してその他端を自由端とし、 各々の自由端が前記電子回路パツケージのＩＣ
の放熱面と接触するように熱伝導板と電子回路パ
ツケージを平行かつ一体に固定し、 前記熱伝導板に取り付けられたヒートシンクが
前記シエルフの外部にできるように電子回路パツ
ケージをシエルフ内に収容することを特徴とする
ＩＣの放熱構造。[Claims for Utility Model Registration] Heat generated from a plurality of ICs mounted at predetermined positions of an electronic circuit package housed in a shelf is transferred through a heat conductive member that is in contact with the heat dissipation surface of the IC. In a heat dissipation structure for an IC that dissipates heat into the air, the IC is mounted so that its heat dissipation surface is parallel to the electronic circuit package, and a metal plate is attached to one end of a plate-shaped heat conduction plate made of a metallic heat conduction member. A piece of a heat sink formed by bending a sheet into a Z shape is attached in surface contact with the heat sink, and a thin metal heat conductive member is bent into a U shape and attached to the heat conductive plate at a position corresponding to the IC. One end of the contact piece is fixed and the other end is a free end, and each free end is connected to an IC of the electronic circuit package.
A heat conduction plate and an electronic circuit package are fixed in parallel and integrally so as to be in contact with the heat dissipation surface of the heat conduction plate, and the electronic circuit package is housed within the shelf so that a heat sink attached to the heat conduction plate is formed outside the shelf. An IC heat dissipation structure characterized by:
JP1988078821U 1988-06-16 1988-06-16 Pending JPH022888U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988078821U JPH022888U (en) 1988-06-16 1988-06-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988078821U JPH022888U (en) 1988-06-16 1988-06-16

Publications (1)

Publication Number Publication Date
JPH022888U true JPH022888U (en) 1990-01-10

Family

ID=31303718

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988078821U Pending JPH022888U (en) 1988-06-16 1988-06-16

Country Status (1)

Country Link
JP (1) JPH022888U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024520046A (en) * 2021-05-25 2024-05-21 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング Insertion Module and Module Assembly

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024520046A (en) * 2021-05-25 2024-05-21 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング Insertion Module and Module Assembly

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