JPH022889U - - Google Patents
Info
- Publication number
- JPH022889U JPH022889U JP7882488U JP7882488U JPH022889U JP H022889 U JPH022889 U JP H022889U JP 7882488 U JP7882488 U JP 7882488U JP 7882488 U JP7882488 U JP 7882488U JP H022889 U JPH022889 U JP H022889U
- Authority
- JP
- Japan
- Prior art keywords
- heat
- electronic circuit
- heat conductive
- circuit package
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の一実施例を示す構造図、第２
図は本実施例の放熱構造の斜視図、第３図は本実
施例の使用状態を示す斜視図、第４図は従来例を
示す斜視図である。
１……電子回路パツケージ、４……ＩＣ、５…
…熱伝導板、６……ヒートシンク、７……接触棒
、８……シエルフ、９……表面カバー、９ａ……
放熱穴。
Figure 1 is a structural diagram showing one embodiment of the present invention;
The figure is a perspective view of the heat dissipation structure of this embodiment, FIG. 3 is a perspective view showing the usage state of this embodiment, and FIG. 4 is a perspective view of a conventional example. 1...Electronic circuit package, 4...IC, 5...
...Heat conduction plate, 6...Heat sink, 7...Contact rod, 8...Shelf, 9...Surface cover, 9a...
Heat radiation hole.
Claims (1)
所定の位置に実装された複数個のＩＣから発生す
る熱を、前記ＩＣの放熱面に接触させた熱伝導部
材を介して空気中に放熱するＩＣの放熱構造にお
いて、 前記ＩＣをその放熱面が前記電子回路パツケー
ジと平行となるように実装し、 金属性の熱伝導部材から成る板状の熱伝導板の
、前記ＩＣと対応する位置に各々ネジ穴を形成し
、このネジ穴に熱伝導部材から成り一端面を平滑
面としたネジ状の接触棒を螺合させると共に、該
熱伝導板の一端に金属板を略Ｚ状に折り曲げて形
成したヒートシンクの一片を面接触させて取り付
け、 前記接触棒の平滑面を前記電子回路パツケージ
のＩＣの放熱面と接触するように熱伝導板と電子
回路パツケージを平行かつ一体に固定し、 前記熱伝導板に取り付けられたヒートシンクが
前記シエルフの外部にでるように電子回路パツケ
ージをシエルフ内に収容することを特徴とするＩ
Ｃの放熱構造。[Claims for Utility Model Registration] Heat generated from a plurality of ICs mounted at predetermined positions of an electronic circuit package housed in a shelf is transferred through a heat conductive member that is in contact with the heat dissipation surface of the IC. In the heat dissipation structure for an IC that dissipates heat into the air, the IC is mounted so that its heat dissipation surface is parallel to the electronic circuit package, and the IC and the IC are mounted on a plate-shaped heat conductive plate made of a metallic heat conductive member. Screw holes are formed at corresponding positions, and screw-like contact rods made of a heat conductive member and having one end surface smooth are screwed into the screw holes, and a metal plate is attached to one end of the heat conductive plate at approximately Z. A piece of the heat sink formed by bending it into a shape is attached in surface contact, and the heat conductive plate and the electronic circuit package are fixed in parallel and integrally so that the smooth surface of the contact rod is in contact with the heat dissipation surface of the IC of the electronic circuit package. and an electronic circuit package is housed within the shelf so that the heat sink attached to the heat conductive plate is exposed to the outside of the shelf.
C heat dissipation structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7882488U JPH022889U (en) | 1988-06-16 | 1988-06-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7882488U JPH022889U (en) | 1988-06-16 | 1988-06-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH022889U true JPH022889U (en) | 1990-01-10 |
Family
ID=31303721
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7882488U Pending JPH022889U (en) | 1988-06-16 | 1988-06-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH022889U (en) |
-
1988
- 1988-06-16 JP JP7882488U patent/JPH022889U/ja active Pending
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