JPH02295192A - Multilayer printed wiring board - Google Patents

Abstract

PURPOSE:To increase the density of interconnection and moreover upgrade high frequency characteristics without increasing inductance by connecting one circuit with the other circuit installed on the surfaces on the both sides of a multilayer printed board with a connection VIA hole designed to penetrate and insulated part between a power supply circuit layer and an earth circuit layer. CONSTITUTION:An edge section where a power supply circuit layer 2 is adapted to face an earth circuit layer 3, is zigzag-shaped and provided with a zigzag-shaped insulated section 9 between the power supply circuit 2 and the earth circuit layer 3. An electric power side terminal for an electronic components 4 on a layer L1 is connected with the power supply circuit layer 2 on a layer L2 by way of a power supply VIA hole 5a which penetrates an insulation layer 1a while an earth side terminal on the layer L1 is connected with the earth circuit layer 3 on the layer L2 by way of an earth VIA hole 5b which penetrates the insulation layer 1a. The power supply side terminal for the electronic component 4 on a layer L4 is connected with the power supply layer on a layer L3 by way of the power supply VIA hole 5a which penetrates an insulation layer 3c while the earth side terminal for the electronic component on the layer L4 is connected with the earth circuit layer 3 on the layer L2 by way of an earth VIA hole 5b which penetrates the insulation layer c.

Description

[Detailed Description of the Invention] [Industrial Application No. 1] The present invention relates to a multilayer printed wiring board of 4M or more, and more specifically, the invention relates to a multilayer printed wiring board of 4M or more. The 4/l!I printed wiring board, which is an example of a multilayer printed wiring board, is a 3N printed wiring board, which is an example of a multilayer printed wiring board. Insulating layer 1 at
1 b. 1 The power supply layer (vcc
71) 2 and a ground layer (GND layer) 3 are provided separately.

That is, a power layer 2 is provided between the insulation /W1a and the insulation 1@1b, and a 7-base layer 3 is provided between the insulation N1b and the insulation /tl 1 c. Then, the electronic components 4, the power supply layer 2, and the ground layer 3 arranged on the surface side of the ZI/l 1a and ZETM layers 1c are connected to the power supply V7-7 hole 5a' and the ground V7-7 hole 5b, respectively. ' are connected via.

There is also a connecting via hole 8' between the circuits 7 on the upper and lower surfaces.
It is connected at.

[Problems to be Solved by the Invention] By the way, in the above conventional example, the power supply layers 2 and 7-6M! are separately provided between the two layers. J3 is provided, so there is no need to
The electronic component 4 and the 7-base layer 3 provided on the surface side of the lla must pass through the power supply layer 2 and be connected at the 7-use via hole 5b', which is provided on the surface side of the insulating layer 1c. The electronic component 4 and the electric current mM2 must pass through the ground layer 3 and be connected through the power supply via hole 5a'. For this reason VTI 7 hole 5a'. 5b' is passed through the power supply layer 2 and the earth layer 3, the electric i8X layer 2 and the earth layer 3 are
It is necessary to provide a clearance 6 for insulation between the wires, which complicates the structure and lowers the wiring density.Moreover, because the wire holes 5a' and SL+'' are passed through to the electric [1] 2 and the earth IrII3, There was a problem that the inctance increased.

In addition, to connect the upper and lower circuits 7, the power layer 2 and ground N3
A connecting via hole 8' is provided so as to penetrate through the (
In this case as well, since a clearance is provided for insulation from the power source 2 and the ground layer 3), there is also a problem in that the inductance increases.

The present invention has been made in view of the above points, and an object of the present invention is to connect a power supply layer and a ground layer to electronic components and circuits on the surface with a simple structure, and to increase wiring density. It is an object of the present invention to provide a multilayer printed wiring board that can improve high frequency characteristics without increasing inductance.

[Means for Solving the Problems 1 To achieve the above object, the multilayer printed wiring board of the present invention has the following features:
Multiple insulating layers 1 a, 1 b. The power supply layer 2 and the ground 71] 3 are provided separately between the same eyebrows between the layers of 1c, and the electronic components 4 and circuits 7 on the surface and the above-mentioned IL source layer 2 and 7-3 are connected to the power source layer 2 and the ground 71] Connecting via hole 8 is connected through hole 5a and ground via hole 5b, and is provided between the circuits 7 on the upper and lower surfaces so as to penetrate through the open insulating part between power supply /i12 and earth /913. It is characterized by being connected at.

[Function 1] The electric a layer 2 and 7-s/13 formed in the same layer and the electronic components 4 and circuit 7 on the surface are connected to the power supply via hole 5, respectively.
A and grounding via holes 5b can be connected, and the connection can be made without the need for power supply via hole 7 and ground via hole 5b that pass through power supply M2 and ground/13 as in the conventional case, simplifying the structure and increasing wiring density. can be raised. The power supply via hole 5a, the ground via hole 5b, and the connection via hole 8 can be provided so as not to penetrate the power supply layer 2 and the earth layer 3, thereby eliminating an increase in inductance and improving high frequency characteristics. [Example] An example of a four-layer printed wiring board as an example of the multilayer printed wiring board of the present invention will be described below.

Single-sided metal foil clad laminate B is laminated on both the upper and lower surfaces of double-sided metal foil clad laminate A, and the three are bonded together with prepreg C to form a 4-layer laminate, with 3N insulation as shown in Figure 1. layer 1
at 1 b, 1 c and 4/! It has one metal M layer. Double-sided metal foil-clad laminate A is a resin laminate such as double-sided copper-clad lath epoxy or double-sided copper-clad glass polyimide, and metal foil is laminated on both sides, while single-sided metal-clad laminate B is one-sided steel-clad glass epoxy, The substrate is a resin laminate such as glass polyimide with copper cladding on one side, and metal foil is laminated on one side. Insulating layer 1a and insulating layer 1b
L2/1 of the metal foil between the left and right is minutes i! After being fl1, ground the power supply (VCCI) 2 on the right side and ground it on the left side! (GND
Layer) 3 is provided. Insulating layer 1b and insulation layer 1
The Lj layer of the foil associated with c is also divided into left and right, with the power supply on the left /! 2, and 71st NJ3 on the right side. Power supply N
The opposing edges of N2 and N3 have a nogzag shape, and a nogzag insulating portion 9 is provided between the power supply N2 and the ground N3. L. of the metal foil on the surface side of the insulating layer 1a and the M green layer 1c. ,L. A suitably patterned circuit 7 is provided on the layer, and electronic components 4 are mounted at appropriate locations on the surface side. This electronic component 4 is, for example, a server 7 such as a memory element.
It is an eighth mount device, and in the case of memory devices, many devices are arranged in parallel. L, scrap electronic parts 4 and L2
The power supply layer 2 and the ground Nj3 of the layer are electrically connected, respectively, and the electronic component 4 of the [,, layer L, /1 and the electrical a/12 and the ground /[3 are electrically connected, respectively. . Tmari L.
The power supply side terminal of the electronic component 4 of 1r1 and the power supply terminal 2 of L2/I are connected to the power supply via hole (v
The ground m terminal of the electronic component 4 of Ll71 and the ground layer 3 of L2NJ are connected through a grounding hole (via Iiole) 5a that penetrates the insulating layer 1a.
The power supply side terminal of the electronic component 4 of the L, layer and the power supply layer 2 of the L3 layer are connected to the power supply V7I7 hole 5a that penetrates the insulating layer IC, and the power supply side terminal of the electronic component 4 of the L, layer The ground side terminal of the electronic component 4 and the ground layer 3 of the L layer are disconnected.
Via hole 5 for 7-s through it/l 1 c
It is connected at b. In this embodiment, IV is used as the power supply via hole 5a and the ground via hole 5b.
H (interstitial via hole)
However, in addition to IVH, a normal through hole (a through hole formed by drilling and through hole plating) may be used as the via hole, or other similar connection methods may be used. The electronic components 4 mounted on the Ll/lm and L layers are appropriately connected to the circuit 7 on the surface. Further, the circuits 7 on the upper and lower surfaces are connected by a connecting via hole 8, and this connecting via hole 8 is provided so as to penetrate an insulating portion 9 between the power source ffi2 and the ground M3. In this embodiment, a normal through hole (a through hole is drilled and plated) is used as the connection via hole 8, but other similar connection methods may be used for IVH.

In the above embodiment, the power layer 2 and the ground layer 3 are connected to the electronic component 4 through the power supply via hole 5a and the ground via hole 5b. If it is necessary to connect it to the circuit 7, it can be similarly connected using a power supply via hole or a ground via hole. Further, in the above embodiments, a 4N printed wiring board has been described, but the present invention can be applied to a multilayer printed wiring board having more than four layers.

[Effects of the Invention 1] As described above, the present invention provides a power layer and a ground layer separately in the same space between the eyebrows of a plurality of insulation layers, and connects electronic components and circuits on the surface with the power layer and the ground layer. are connected through the power supply via hole and the ground via hole, respectively, so that the power supply layer and ground layer provided on the same inner layer and the electronic components and circuits on the surface side are connected through the same insulating layer. It can be connected with a via hole and a grounding via hole, and it can be connected without the need for a power supply via hole or a grounding via hole that penetrates the power supply layer and ground layer as in the conventional case, and the structure is better than conventional ones. It is possible to increase the MA density without having to provide clearance for insulation at the part that penetrates the power supply layer or the ground layer, as is the case with conventional methods. In addition, since the power supply via hole and the grounding via hole do not penetrate the power supply layer or the ground layer, an increase in inductance can be prevented. Moreover, between the circuits on the upper and lower surfaces, the insulation between the electrical A layer and the ground layer can be prevented. Since the connection is made with a connecting via hole provided to penetrate the parts, the connecting via hole does not penetrate the power supply layer or the ground layer, preventing an increase in inductance. The commercial frequency characteristics can be improved by using the power supply via hole, the grounding via hole, and the connection via hole. The shielding effect of the upper and lower layers can be improved because the conductor does not penetrate through the power supply layer or the ground layer.

[Brief explanation of drawings]

FIG. 1 is a sectional view of an embodiment of the present invention, FIG. 2 is a plan view showing the power supply layer and ground layer portions of the same, and FIG. tJtJ3 is a sectional view of the conventional example. 1 c is an insulating layer, 2 is a power layer, 3 is a ground layer, 4 is an electronic component, 5a
5b is a via hole for a TrL source, 5b is a grounding via hole, 7 is a circuit, and 8 is a connecting via hole. Agent Patent Attorney Ai Ishida 7 Figure 2 Procedures Minister 1 official document (self-motivated) February 10, 1990 1). We have corrected the specification as shown in the attached revised specification 2). Figure 1 of the drawings will be corrected as shown in the attached sheet. 1999 Patent Application No. 1] No. 6619 2. Name of invention Multilayer printed wiring board

Claims (1)

[Claims] [1] Separately provide a power layer and a ground layer between the same layers of multiple insulating layers, and connect electronic components and circuits on the surface to the power layer and ground layer through power supply via holes and ground vias. A multilayer structure characterized in that the circuits on the upper and lower surfaces are connected through holes, and the circuits on the upper and lower surfaces are connected through connection via holes provided to penetrate the insulating part between the power supply layer and the ground layer. printed wiring board.