JPH0614599B2 - Multilayer printed wiring board - Google Patents

Description

TECHNICAL FIELD The present invention relates to a multilayer printed wiring board having four or more layers, and more specifically, connecting a power circuit layer or an earth circuit layer as an inner layer to an electronic part or circuit on the surface. , A technique for connecting a power supply terminal and a power supply circuit layer.

[Prior Art] Conventionally, a four-layer printed wiring board, which is an example of a multilayer printed wiring board, has three insulating layers 1a, 1b, 1 as shown in FIG.
A power supply circuit layer (VCC layer) 2 and a ground circuit layer (GND layer) 3 are separately provided between the two layers c. That is, the power supply circuit layer 2 is provided between the insulating layer 1a and the insulating layer 1b,
The ground circuit layer 3 is provided between the insulating layer 1b and the insulating layer 1c. The electronic portion 4 disposed on the surface side of the insulating layer 1a and the insulating layer 1c is connected to the power circuit layer 2 and the ground circuit layer 3 via the power via hole 5a 'and the ground via hole 5b', respectively. . Further, a power feeding path 9'is provided on the upper surface so as to be continuous with the power feeding terminal 8, and the power feeding path 9'and the power supply circuit layer 2 are connected by a power feeding via hole 10 '.

[Problems to be Solved by the Invention] In the above-mentioned conventional example, since the power supply circuit layer 2 and the ground circuit layer 3 are separately provided between the two layers, they are provided on the surface side of the insulating layer 1a. Electronic component 4 and earth circuit layer 3
Is a via hole 5 for grounding through the power supply circuit layer 2.
The electronic component 4 and the power supply circuit layer 2 provided on the front surface side of the insulating layer 1c must be connected to each other by the ground circuit layer 3
Must be connected through the power supply via hole 5a '. Therefore, the via holes 5a ', 5b'
It is necessary to provide a clearance 6 for insulating the power supply circuit layer 2 and the ground circuit layer 3 at a portion where the power circuit layer 2 and the ground circuit layer 3 are penetrated, which makes the structure complicated and lowers the wiring density. There's a problem. In addition, the power supply terminal 8
Power is supplied to the power supply circuit layer 2 from the power supply path 9'and the power supply via hole 10 ', and from the power supply circuit layer 2 to the electronic component 4 via the power supply via hole 5a'. However, there is a problem in that it can only be specified for double-sided mounting in which power is supplied to the upper and lower electronic components 4, and cannot be specified in single-sided mounting for supplying power to the single-sided electronic component 4.

The present invention has been made in view of the above-mentioned points, and the object of the present invention is to provide a simple structure with which a power circuit layer or an earth circuit layer and electronic components on the surface can connect a circuit and wiring density. (EN) It is possible to provide a multilayer printed wiring board which can be raised and can be easily mounted on one side in addition to the specification on both sides.

[Means for Solving the Problems] In order to achieve the above object, the multilayer printed wiring board of the present invention comprises:
The power circuit layer 2 and the ground circuit layer 3 are provided separately in at least two layers of the plurality of insulating layers 1a, 1b, 1c of three layers or more, and the electronic components 4 and the circuits on the upper and lower surfaces are provided. 7 and the power supply circuit layer 2 and the ground circuit layer 3 are connected to the power supply via hole 5a and the grounding via hole 5
b, the power supply terminals 8 are provided on one of the upper and lower surfaces, and a power supply path 9 that conducts to the power supply terminals 8 is provided on the surface, and the power supply circuit layer 2 and the power supply path 9 are formed of a plurality of layers.
Are conducted with the power supply via holes 10a and 10b,
It is characterized in that the feeding path 9 can be cut at an appropriate position on the surface.

[Operation] Power supply circuit layer 2 and ground circuit layer 3 formed between the same layers
And the electronic component 4 and the circuit 7 on the surface can be connected to each other through the power supply via hole 5a and the ground via hole 5b, respectively, and the power supply via hole and the ground penetrating the power supply circuit layer 2 and the ground circuit layer 3 as in the conventional case. The structure can be simplified by connecting without the need for via holes. In addition, the power supply terminal 8
By supplying power from a plurality of power supply circuit layers 2 to a double-sided mounting specification, it is possible to cut the power supply path 9 at an appropriate position to supply power to one power supply circuit layer 2 and to easily mount on one side. You can

[Examples] Examples of a four-layer printed wiring board as an example of the multilayer printed wiring board of the present invention will be described below. A single-sided metal foil-clad laminate B is laminated on the upper and lower surfaces of the double-sided metal foil-clad laminate A, and the three members are adhered by a prepreg C to form a four-layer laminate plate. As shown in FIG. Insulating layers 1a, 1b, 1c
And 4 metal foil layers. The double-sided metal foil-clad laminate A is a double-sided copper-clad glass epoxy or double-sided copper-clad glass-polyimide resin laminate plate laminated with gold foil on both sides. A resin laminate such as copper-clad glass polyimide on one side is used as a substrate and metal foil is laminated on one side. The L ₂ layer of the metal foil between the insulating layer 1a and the insulating layer 1b is divided into left and right, and a power supply circuit (VCC layer) 2 is provided on the right side and a ground circuit layer (GND layer) 3 is provided on the left side. The L ₃ layer of the metal foil between the insulating layer 1b and the insulating layer 1c is also divided into left and right, and the power circuit layer 2 is provided on the right side and the ground circuit layer 3 is provided on the left side. A circuit 7 having an appropriate pattern is provided on the L ₁ and L ₄ layers of the metal foil on the surface side of the insulating layer 1a and the insulating layer 1c.
The electronic component 4 is mounted at a proper position on the front surface side. The electronic component 4 is, for example, a surface mount device such as a memory element, and in the case of a memory element, a plurality of electronic components 4 are arranged in parallel. The L ₁ layer electronic component 4 and a power supply circuit of the L ₂ layer layer 2 and the ground circuit layer 3 are electrically connected respectively, L ₄
The electronic component 4 of the layer and the power circuit layer 2 and the ground circuit layer 3 of the L ₃ layer are electrically connected to each other. That is, the power supply side terminal of the electronic component 4 of the L ₁ layer and the power supply circuit layer 2 of the L ₂ layer pass through the insulating layer 1a, and a via hole for power supply (via ho)
le) 5a, and the ground side terminal of the electronic component 4 of the L ₁ layer is connected to the ground circuit layer 3 of the L ₂ layer by a ground via hole 5b penetrating the insulating layer 1a. _four layers of the supply-side terminal and the L ₃ layer power circuit layer 2 of the electronic component 4 is connected at the power supply via-hole 5a penetrating the insulating layer 1c, the ground terminal and L of the electronic component 4 L ₄ layer _{The three} ground circuit layers 3 are connected to each other by a ground via hole 5b penetrating the insulating layer 1c. In the case of this embodiment, an IVH (interstitial via hole) is used as the via hole 5a for power supply and the via hole 5b for grounding.
However, in addition to IVH, a normal through hole (through hole is perforated and plated through) may be used as a via hole, or another connection method similar to this may be used. The electronic components 4 mounted on the L ₁ layer and the L ₄ layer are connected to the circuit 7 on the appropriate surface. A power supply terminal 8 is provided on the surface of the L ₁ layer, and a power supply path 9 is provided so as to be continuous with the power supply terminal 8. The power supply circuit layer 2 of the L ₂ layer and the power supply circuit layer 2 of the L ₃ layer and the power supply path 9 are connected by power supply via holes 10a and 10b. In the present embodiment, the IVH is also used for the power feeding via holes 10a and 10b. However, other than the IVH, a normal through hole (through hole is plated by through hole) may be used as well. The same connection method as this may be used. Therefore, from the power feeding terminal 8 to the power feeding path 9 and the power feeding via holes 10a, 1
Power is supplied to the power supply circuit layers 2 of the L ₂ layer and the L ₃ layer through 0b, and power is supplied from the power supply circuit layer 2 to the electronic components 4 of the L ₁ layer and the L ₄ layer, so that double-sided mounting can be achieved. At this time, power supply line 9
2 and 3 are cut by a drill 11 between the portions connected to the power feeding via holes 10a and 10b of the power feeding terminal 8 and the power feeding via hole 10 of FIG.
Power supply to the power supply circuit layer 2 of the L ₂ layer is stopped from the power supply terminal 8 and power is supplied only to the electronic component 4 of the L ₁ layer so that the single-sided mounting can be achieved. Further, FIG. 4 shows another embodiment, in which a power feeding path 9 connecting the power feeding via holes 10a and 10b and the power feeding terminal 8 is connected to the first power feeding path 9a and the second power feeding path 9a.
It is configured by the power feeding path 9b, and by cutting one of the first power feeding path 9a and the second power feeding path 9b with the drill 11, L
_Two layers or to power the power supply circuit layer 2, which is to be the specification of one side implementation or to power the power supply circuit layer 2 of the L ₃ layer.

In the above embodiment, the power circuit layer 2 and the ground circuit layer 3 are connected to the electronic component 4 through the power via hole 5a and the ground via hole 5b, but the power circuit layer 2 and the ground circuit layer 3 are described. If it is necessary to connect the circuit 7 on the front side to the circuit 7 on the surface, the connection can be made similarly by the via hole for the power supply via hole. Further, in the above-mentioned embodiment, the embodiment of the four-layer printed wiring board is described, but the same can be applied to a multilayer printed wiring board having more than four layers.

[Effects of the Invention] As described above, the present invention provides a power circuit layer and a ground circuit layer separately between the same layers among a plurality of insulating layers,
Since the electronic components and circuits on the surface are connected to the power supply circuit layer and the ground circuit layer through the power supply via hole and the grounding via hole, respectively, the power supply circuit layer and the ground circuit provided on the same inner layer are provided. A layer and a surface side electronic component or circuit can be connected by a power via hole and a ground via hole penetrating the same insulating layer,
The power supply circuit layer and the ground can be connected without the need for power supply via holes and ground via holes that pass through the power supply circuit layer or the ground circuit layer as in the past, and the structure can be simpler than in the past. It is possible to increase the wiring density without the need to provide a clearance for insulation in the part that penetrates the circuit layer, and also to provide a power supply terminal on one of the upper and lower surfaces and to connect to the power supply terminal. Since the power supply path is provided on the surface and the power supply circuit layers of the plurality of layers are electrically connected to the power supply path through the power supply via hole, the power supply circuit of the plurality of layers is formed from the power supply terminal through the power supply path and the power supply via hole. In addition to being able to supply power to the layers for double-sided mounting, the power feed path can be cut at appropriate positions on the surface, so the power supply path can be cut at the appropriate position with a drill or the like. Those that can be the specification of one side mounted easily to the structure just to power the power supply circuit layer of Tekisen by.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of an embodiment of the present invention, FIG. 2 is a cross-sectional view showing a state in which the same is cut with a drill, FIG. 3 is a schematic plan view explaining the same state as the cutting, and FIG. FIG. 5 is a schematic plan view of another embodiment of the present invention, and FIG.
a, 1b and 1c are insulating layers, 2 is a power circuit layer, 3 is a ground circuit layer, 4 is an electronic component, 5a is a power via hole,
Reference numeral 5b is a ground via hole, 7 is a circuit, 8 is a feeding terminal, 9 is a feeding path, and 10a and 10b are feeding via holes.

Claims (1)

[Claims] 1. At least two of three or more insulating layers.
A power circuit layer and a ground circuit layer are separately provided between the two layers, and electronic parts and circuits on the upper and lower surfaces and the power circuit layer and the ground circuit layer are connected to the power via hole and the ground via hole. And the power supply terminal on one surface of the upper and lower surfaces and the power supply path that conducts the power supply terminal is provided on the surface, and the power supply circuit layer and the power supply path of the plurality of layers are used as a power supply via hole. A multi-layer printed wiring board, characterized in that the power supply path can be cut at an appropriate position on the surface.