JPH0229526U - - Google Patents

Info

Publication number
JPH0229526U
JPH0229526U JP1988108518U JP10851888U JPH0229526U JP H0229526 U JPH0229526 U JP H0229526U JP 1988108518 U JP1988108518 U JP 1988108518U JP 10851888 U JP10851888 U JP 10851888U JP H0229526 U JPH0229526 U JP H0229526U
Authority
JP
Japan
Prior art keywords
bonding jig
bonding
island
semiconductor chip
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988108518U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988108518U priority Critical patent/JPH0229526U/ja
Publication of JPH0229526U publication Critical patent/JPH0229526U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07553—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図ａ，ｂは本考案の一実施例を説明するた
めのボンデイング治具の平面図及びＡ―Ａ′線断
面図、第２図ａ，ｂは従来のボンデイング治具を
示す平面図及びＢ―Ｂ′線断面図である。 １…ヒータブロツク、２…気体吹出孔、３…ア
イランド、４…半導体チツプ、５…リード、６…
ボンデイング線、７…不活性ガス。

Claims (1)

    【実用新案登録請求の範囲】
  1. アイランドに半導体チツプを搭載したリードフ
    レームを載せて加熱し前記リードフレームのリー
    ドと前記半導体チツプの電極との間をワイヤボン
    デイングするためのボンデイング用治具において
    、前記ボンデイング治具が前記アイランドと前記
    リードとの間に設けた気体吹出孔を有することを
    特徴とするボンデイング用治具。
JP1988108518U 1988-08-17 1988-08-17 Pending JPH0229526U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988108518U JPH0229526U (ja) 1988-08-17 1988-08-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988108518U JPH0229526U (ja) 1988-08-17 1988-08-17

Publications (1)

Publication Number Publication Date
JPH0229526U true JPH0229526U (ja) 1990-02-26

Family

ID=31343929

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988108518U Pending JPH0229526U (ja) 1988-08-17 1988-08-17

Country Status (1)

Country Link
JP (1) JPH0229526U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102569135A (zh) * 2012-02-07 2012-07-11 三星半导体(中国)研究开发有限公司 用于引线键合的加热块

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102569135A (zh) * 2012-02-07 2012-07-11 三星半导体(中国)研究开发有限公司 用于引线键合的加热块

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