JPH0353858U - - Google Patents

Info

Publication number
JPH0353858U
JPH0353858U JP1989114666U JP11466689U JPH0353858U JP H0353858 U JPH0353858 U JP H0353858U JP 1989114666 U JP1989114666 U JP 1989114666U JP 11466689 U JP11466689 U JP 11466689U JP H0353858 U JPH0353858 U JP H0353858U
Authority
JP
Japan
Prior art keywords
base material
semiconductor base
light emitting
insulating substrate
conductor pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989114666U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989114666U priority Critical patent/JPH0353858U/ja
Publication of JPH0353858U publication Critical patent/JPH0353858U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Dot-Matrix Printers And Others (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)

Description

【図面の簡単な説明】
第１図は本考案に係るＬＥＤアレイプリントヘ
ツドの断面図、第２図ａ，ｂは従来のＬＥＤチツ
プの一部を示す平面図と断面図、第３図は従来の
ＬＥＤアレイプリントヘツドの断面図、第４図は
本考案の他の実施例を示す断面図、第５図は本考
案のさらに他の実施例を示す断面図である。 １……電極、２……半導体母材、３……発光部
、５……絶縁膜、６……発光部電極、８……絶縁
基板、９，１０，１６，１８……導体パターン、
１１……ＬＥＤチツプ、１２，１７……ボンデイ
ングワイヤ、１４……樹脂被膜、１５……ＩＣド
ライバ。

Claims (1)

  1. 【実用新案登録請求の範囲】 絶縁基板と、 上記絶縁基板上に備えられた導体パターンと、 上記絶縁基板上に備えられた半導体母材と、 上記半導体母材の所定の位置に形成された発光
    部と、 上記半導体母材上に形成された発光部電極と、 上記発光部電極又は上記導体パターンに接続さ
    れるワイヤとを有するＬＥＤアレイプリントヘツ
    ドにおいて、 上記導体パターン表面、上記ワイヤ表面及び上
    記発光部を除く半導体母材表面を覆う樹脂被膜を
    設けたことを特徴とするＬＥＤアレイプリントヘ
    ツド。
JP1989114666U 1989-09-29 1989-09-29 Pending JPH0353858U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989114666U JPH0353858U (ja) 1989-09-29 1989-09-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989114666U JPH0353858U (ja) 1989-09-29 1989-09-29

Publications (1)

Publication Number Publication Date
JPH0353858U true JPH0353858U (ja) 1991-05-24

Family

ID=31663022

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989114666U Pending JPH0353858U (ja) 1989-09-29 1989-09-29

Country Status (1)

Country Link
JP (1) JPH0353858U (ja)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001024231A (ja) * 1999-07-12 2001-01-26 Nippon Sheet Glass Co Ltd 発光素子アレイ装置
JP2009055006A (ja) * 2007-07-27 2009-03-12 Nichia Corp 発光装置及びその製造方法
JP2011146480A (ja) * 2010-01-13 2011-07-28 Nichia Corp 発光装置および発光装置の製造方法
WO2014080583A1 (ja) * 2012-11-21 2014-05-30 信越半導体株式会社 発光装置及び発光装置の製造方法
JP2015062261A (ja) * 2010-08-25 2015-04-02 日亜化学工業株式会社 発光装置
US9306127B2 (en) 2010-08-25 2016-04-05 Nichia Corporation Light emitting device that includes protective film having uniform thickness
JP2019009171A (ja) * 2017-06-21 2019-01-17 スタンレー電気株式会社 半導体装置

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001024231A (ja) * 1999-07-12 2001-01-26 Nippon Sheet Glass Co Ltd 発光素子アレイ装置
JP2009055006A (ja) * 2007-07-27 2009-03-12 Nichia Corp 発光装置及びその製造方法
JP2011146480A (ja) * 2010-01-13 2011-07-28 Nichia Corp 発光装置および発光装置の製造方法
JP2015062261A (ja) * 2010-08-25 2015-04-02 日亜化学工業株式会社 発光装置
US9306127B2 (en) 2010-08-25 2016-04-05 Nichia Corporation Light emitting device that includes protective film having uniform thickness
WO2014080583A1 (ja) * 2012-11-21 2014-05-30 信越半導体株式会社 発光装置及び発光装置の製造方法
JP2019009171A (ja) * 2017-06-21 2019-01-17 スタンレー電気株式会社 半導体装置

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