JPH0229545U - - Google Patents
Info
- Publication number
- JPH0229545U JPH0229545U JP1988108654U JP10865488U JPH0229545U JP H0229545 U JPH0229545 U JP H0229545U JP 1988108654 U JP1988108654 U JP 1988108654U JP 10865488 U JP10865488 U JP 10865488U JP H0229545 U JPH0229545 U JP H0229545U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting chip
- emitting diode
- recess
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988108654U JPH0229545U (mo) | 1988-08-18 | 1988-08-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988108654U JPH0229545U (mo) | 1988-08-18 | 1988-08-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0229545U true JPH0229545U (mo) | 1990-02-26 |
Family
ID=31344192
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988108654U Pending JPH0229545U (mo) | 1988-08-18 | 1988-08-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0229545U (mo) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4913916A (mo) * | 1972-05-18 | 1974-02-06 | ||
| JPS5230846U (mo) * | 1975-08-13 | 1977-03-04 | ||
| JPS59112668A (ja) * | 1982-12-20 | 1984-06-29 | Fujitsu Ltd | 発光ダイオ−ド装置 |
| JPS62174980A (ja) * | 1986-01-28 | 1987-07-31 | Mitsubishi Cable Ind Ltd | 光フアイバ通信用発光装置 |
| JPS6323377A (ja) * | 1986-07-02 | 1988-01-30 | Mitsutoyo Corp | 発光ダイオ−ド |
-
1988
- 1988-08-18 JP JP1988108654U patent/JPH0229545U/ja active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4913916A (mo) * | 1972-05-18 | 1974-02-06 | ||
| JPS5230846U (mo) * | 1975-08-13 | 1977-03-04 | ||
| JPS59112668A (ja) * | 1982-12-20 | 1984-06-29 | Fujitsu Ltd | 発光ダイオ−ド装置 |
| JPS62174980A (ja) * | 1986-01-28 | 1987-07-31 | Mitsubishi Cable Ind Ltd | 光フアイバ通信用発光装置 |
| JPS6323377A (ja) * | 1986-07-02 | 1988-01-30 | Mitsutoyo Corp | 発光ダイオ−ド |