JPH02307253A - Resin-sealed semiconductor device - Google Patents

Abstract

PURPOSE:To avoid the slant of an insulating substrate caused by the external force of melted resin created at the time of resin sealing and avoid the deformation and open-circuit of a bonding wire by a method wherein the insulating substrate which has an aperture a little larger than the outer size of a semiconductor pellet, to which the circumference of an island and the tips of inner leads are bonded and fixed and which has wirings on its surface and so forth are provided. CONSTITUTION:An island 3 on which a semiconductor pellet 1 is mounted at its center, inner leads 5 arranged around the island 3, an insulating substrate 2 which has an aperture 12 a little larger than the outer size of the semiconductor pellet 1 at its center, to which the circumference of the island 3 and the tips of the inner leads 5 are bonded and fixed and which has wirings 8 on its surface, inner bonding wires which connect the semiconductor pellet 1 to the wirings 8 and outer bonding wires 10 which connect the wirings 8 to the inner leads 5 are provided. For instance, the substrate 2 having the aperture 12 at its center is fixed onto the island 3 and onto the tips of the inner leads 5. The printed wirings 8 are arranged radially from the center of the substrate 2 toward the corresponding inner leads 5.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to a resin-sealed semiconductor device.

[Conventional technology]

A conventional resin-sealed semiconductor device is shown in FIG. 3(a).

As shown in (b), the island 3 is connected to the lead frame outer frame 11 with four hanging leads 4.
An internal lead 5 is arranged around the island 3 at a distance of about 1 m rn H, and on the island 3 there is a hole 12 in the center with approximately the same dimensions as the outer shape of the island 3, and a printed wiring 8 on the top surface. The substrate 2 was fixed with adhesive or the like. A semiconductor pellet 1 is fixed to the upper center surface of the island 3 with an adhesive, and the semiconductor pellet 1 and the external lead 6 are connected to the printed wiring 8 on the upper surface of the substrate 2 and the inner bonding wire 9.
and was connected via an outer bonding wire 10.

[Problem to be solved by the invention]

In the above-mentioned conventional resin-sealed semiconductor device, the ratio of the substrate and island to the area of the resin-sealed portion is 65 to 65.
This was as high as 75%, and since the island and the board were only supported by four hanging leads to the outer frame of the lead frame, the structure was susceptible to resistance from the melt-resistant resin during resin sealing. Therefore, as the molten resin hardens during resin sealing, it pushes up or down the island and the board, causing deformation or disconnection of the bonding wires connecting the board and internal leads, or exposing the bonding wires to the resin surface. Otherwise, the lower surface of the island may be exposed to the lower surface of the resin, resulting in lower assembly yield and reliability.

[Means to solve the problem]

The resin-sealed semiconductor device of the present invention has internal leads arranged around the island to an island 1 on which a semiconductor pellet is mounted in the center, and internal leads arranged in a manner slightly smaller than the outer diameter of the semiconductor pellet in the center. inner bonding for connecting between an insulating substrate having a large hole, bonding and fixing the peripheral edge of the island and the tip of the internal lead, and having wiring on the surface, and the semiconductor pellet and the wiring; and an outer bonding line connecting between the wiring and the internal lead.

〔Example〕

Next, embodiments of the present invention will be explained with reference to the drawings.

FIGS. 1(a) and 1(b) are a partially cutaway plan view and a sectional view showing an embodiment of the present invention.

As shown in FIGS. 1(a) and 1(b), the island 3 is connected to the lead frame outer frame 11 by four hanging reats 4 at the four corners of the island 3, and also has internal leads 5.
The external lead 6 of the extension is connected by a tie bar 7,
It is connected to the lead frame outer frame 11. The tip of the internal lead 5 is located around the island 3, and a substrate 2 having a hole 2 in the center is coated with an insulating material such as resin on the island 3 and on the tip up to about 2 mm from the tip of the internal lead 5. It is fixed. Since the material of the substrate 2 is usually glass epoxy, insulation between the lower surface of the substrate 2 and the internal leads 5 is maintained. The printed wirings 8 on the board 2 are arranged radially from the center of the board 2 toward the outer periphery of the board 2 and toward the internal leads 5 corresponding to each printed wiring 8. In other words, this is to facilitate the connection between the printed wiring 8 of the board 2 and the inner wires 1 and 5 using the outer bonding wire 10. In the center of island 3, there is a semiconductor pellet I.
The semiconductor pellet 1 and the external lead 6 are connected by an inner bonding wire, a printed wiring 8, and an outer bonding wire 10.

FIG. 2 is a sectional view showing a second embodiment of the invention.

As shown in FIG. 3, the insulating substrate 14 has approximately the same outer diameter as the substrate 2, and an insulating material such as resin is attached to the bottom surface of the substrate 2 via the island 3 and the tip of the inner wall. It is fixed in place.

In this embodiment, the adhesive that fixes the tip of the internal lead 5 to the substrate 2 is not affected by the protrusion of the adhesive onto the bottom surface of the internal lead 5, and the thermal conductivity to the bonding portion of the internal lead 5 and the substrate 2 is improved. This has the advantage of improving bonding properties.

〔Effect of the invention〕

As explained above, the present invention improves the stability of the substrate by fixing the internal leads to the lower surface of the outer periphery of the substrate, thereby preventing the substrate from being hit by external force of the molten resin during resin sealing, and further improving bonding. This has the effect of preventing wire deformation and wire breakage. Therefore, the bonding wire is no longer exposed to the resin surface and the island is not exposed to the resin lower surface, which has the effect of improving assembly yield and f3 axis property.

fffl Brief Description of the Drawings 1st [J (a) and (b) are partially cutaway plan views and sectional views showing the first embodiment of the present invention, and Figure 2 is a partially cutaway plan view and sectional view showing the second embodiment of the present invention. A sectional view shown in FIG. 3(a).

(b) is a partially cutaway plan view and a sectional view showing an example of a conventional resin-sealed semiconductor device.

1...Semiconductor pellet j~, 2...Substrate, 3...Island, 4...Hanging lead, 5...Internal lead, 6...
...External lead, 7...Tie bar, 8...Printed wiring, 9...Inner (regular bonding wire), 10...Outer (
Standard honding line, 11 ・Lead frame outer frame, 12
. . . Hole, 13. Resin sealing portion, 14. Insulating substrate.

Claims (1)

[Claims] an island on which a semiconductor pellet is mounted in the center, internal leads arranged around the island, and a hole slightly larger than the outer diameter of the semiconductor pellet in the center, and a peripheral portion of the island and the inside. an insulating substrate on which the tip of the lead is bonded and fixed and has a wiring on its surface; an inner bonding wire that connects the semiconductor pellet and the wiring; and a connection between the wiring and the internal lead. 1. A resin-sealed semiconductor device comprising an outer bonding line.