JPH0236554A - Electronic component - Google Patents

Electronic component

Info

Publication number
JPH0236554A
JPH0236554A JP63187227A JP18722788A JPH0236554A JP H0236554 A JPH0236554 A JP H0236554A JP 63187227 A JP63187227 A JP 63187227A JP 18722788 A JP18722788 A JP 18722788A JP H0236554 A JPH0236554 A JP H0236554A
Authority
JP
Japan
Prior art keywords
terminals
electronic components
electronic component
becomes possible
main body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63187227A
Other languages
Japanese (ja)
Inventor
Yasufumi Nakajima
康文 中島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP63187227A priority Critical patent/JPH0236554A/en
Publication of JPH0236554A publication Critical patent/JPH0236554A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components

Landscapes

  • Details Of Resistors (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

PURPOSE:To utilize effectively an idle space by arranging threedimensionally electronic components and to make possible the high density mounting of the electronic components by a method wherein terminals made to project outward are formed at the part of each surface of a rectangular parallelepiped excluding the side part of each surface. CONSTITUTION:A main body 4 of an electronic component has terminals 1-3 (other 3 pieces of terminals are not shown by a diagram.) protruding outward at the central parts of its respective surfaces excepting the side parts of its respective surfaces. With these electronic components stacked in a block type, the terminals 1-3 made to project outward are abutted on one another, whereby it becomes possible to form one circuit block. If a cream solder is used for a joining of the fellow terminals 1-3 between the electronic components, it becomes possible to obtain an electrical and mechanical coupling by a reflow.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は、抵抗、コンデンサ、インダクタ、トランス、
半導体等の電゛子部品に関するものである。[Detailed Description of the Invention] Industrial Fields of Application The present invention is applicable to resistors, capacitors, inductors, transformers,
It relates to electronic parts such as semiconductors.

従来の技術 近年、電子部品の高密度実装化が進み、特に、面実装部
品のデイツプ半田対応力の強化により、プリント配線基
板の半田面に実装できる部品が増加し、半田面は、非常
に高密度化されて来た。Conventional technology In recent years, electronic components have become more densely packaged, and in particular, the ability of surface-mounted components to support deep soldering has increased, resulting in an increase in the number of components that can be mounted on the soldered surface of printed wiring boards. It has become more dense.

発明が解決しようとする課題 上述のようにプリント配線基板の半田面の高密度化はま
すます進んでいるが、このプリント配線基板上にそれ以
外に配置される大型の電解コンデンサ、トランス、電力
用半導体の放熱板等の大型部品によって高さが規定され
、逆に云えば小型電子部品の周辺には高さ方向に空間的
な無駄が大きくなり、高密度実装の点で問題を有するも
のであった。Problems to be Solved by the Invention As mentioned above, the solder surface of printed wiring boards is becoming more and more densely packed, but large electrolytic capacitors, transformers, and power capacitors that are placed on these printed wiring boards are also becoming more and more dense. The height is determined by large components such as semiconductor heat sinks, and conversely, there is a large waste of space in the height direction around small electronic components, which poses a problem in terms of high-density packaging. Ta.

課題を解決するための手段 そして上記目的を達成するために本発明は直方体の各面
の辺部を除いた中央部に、外方に突出した端子を形成し
たものである。Means for Solving the Problems and In order to achieve the above object, the present invention is such that terminals protruding outward are formed in the center of each surface of the rectangular parallelepiped, excluding the edges.

作用 以上のごとく直方体の各面の辺部を除いた部分に、外方
に突出した端子を形成すれば、電子部品を立体的に配置
することができ、高密度実装が可能となる。Function As described above, by forming outwardly protruding terminals on each surface of the rectangular parallelepiped except for the sides, electronic components can be arranged three-dimensionally and high-density packaging becomes possible.

実強例 第１図は本発明の一実施例を示す斜視図である。practical example FIG. 1 is a perspective view showing an embodiment of the present invention.

図において４は電子部品の本体で直方体形状となってい
る。この本体４は、それぞれの面の辺部を除いた中央部
には、外方に突出する端子１〜３（他の３個は図示せず
）を有する。これを第２図に示すようにブロック状に積
み重ねるとともに、外方に突出した端子１〜３を当接さ
せることにより、一つの回路ブロックを形成することが
可能となる。第２図において、破線で示したものは第１
図に示す直方体の本体４に相等するものであり、各電子
部品間の端子１〜３同志の接合にはクリーム半田を用い
るとりフローにより電気的１機械的結合を得ることが可
能となる。また本電子部品は６個の端子１〜３を有する
ものであるが、本体４内において３個の電子部品を有し
たものとすれば、それぞれが２個づつ端子１〜３を有す
るものとできる。トランジスタ等の一般的には３端子の
電子部品については本体４内に２個配置すれば良い。In the figure, 4 is the main body of the electronic component, which is shaped like a rectangular parallelepiped. The main body 4 has terminals 1 to 3 (the other three are not shown) projecting outward in the center of each surface excluding the sides. By stacking these in a block shape as shown in FIG. 2 and bringing the outwardly protruding terminals 1 to 3 into contact, one circuit block can be formed. In Figure 2, the broken line indicates the first
It is equivalent to the rectangular parallelepiped main body 4 shown in the figure, and it is possible to obtain electrical and mechanical connections by using cream solder to join the terminals 1 to 3 between each electronic component. Furthermore, although this electronic component has six terminals 1 to 3, if the main body 4 has three electronic components, each can have two terminals 1 to 3. . In general, two electronic components such as transistors that have three terminals may be placed in the main body 4.

第３図に示すものは両側面に１個づつ、周面には２個づ
つ端子６〜９を形成したものである。また、第２図に示
した回路ブロックは、図示しないプリント配線基板上に
実装されるものである。The one shown in FIG. 3 has terminals 6 to 9 formed one on each side and two on the circumferential surface. Further, the circuit block shown in FIG. 2 is mounted on a printed wiring board (not shown).

発明の効果 上記の通り、本発明によれば電子部品を立体的に配置す
ることによって遊休空間を有効に活用することができ、
電子部品の高密度実装が可能となる。Effects of the Invention As described above, according to the present invention, idle space can be effectively utilized by arranging electronic components three-dimensionally.
High-density mounting of electronic components becomes possible.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明の一実施例の斜視図、第２図はその電子
部品の積み重ねた回路ブロックを示す斜視図、第３図は
本発明の他の実施例の斜視図である。 １〜３．６〜９・・・・・・端子、４・・・・・・本体
。 代理人の氏名　弁理士　粟　野　重　孝　ほか１名ｌ〜
３−”Ａ子FIG. 1 is a perspective view of one embodiment of the present invention, FIG. 2 is a perspective view showing a stacked circuit block of electronic components, and FIG. 3 is a perspective view of another embodiment of the invention. 1-3.6-9...terminal, 4...main body. Name of agent: Patent attorney Shigetaka Awano and 1 other person
3-”A child

Claims (1)

【特許請求の範囲】[Claims] 　直方体の各面の辺部を除いた部分に、外方に突出した
端子を形成した電子部品。An electronic component that has terminals that protrude outward on each side of a rectangular parallelepiped, excluding the edges.
JP63187227A 1988-07-27 1988-07-27 Electronic component Pending JPH0236554A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63187227A JPH0236554A (en) 1988-07-27 1988-07-27 Electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63187227A JPH0236554A (en) 1988-07-27 1988-07-27 Electronic component

Publications (1)

Publication Number Publication Date
JPH0236554A true JPH0236554A (en) 1990-02-06

Family

ID=16202289

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63187227A Pending JPH0236554A (en) 1988-07-27 1988-07-27 Electronic component

Country Status (1)

Country Link
JP (1) JPH0236554A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04107989A (en) * 1990-08-29 1992-04-09 Hitachi Denshi Ltd Electronic parts
US5426566A (en) * 1991-09-30 1995-06-20 International Business Machines Corporation Multichip integrated circuit packages and systems
US5502667A (en) * 1993-09-13 1996-03-26 International Business Machines Corporation Integrated multichip memory module structure
US5561622A (en) * 1993-09-13 1996-10-01 International Business Machines Corporation Integrated memory cube structure

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04107989A (en) * 1990-08-29 1992-04-09 Hitachi Denshi Ltd Electronic parts
US5426566A (en) * 1991-09-30 1995-06-20 International Business Machines Corporation Multichip integrated circuit packages and systems
US5502667A (en) * 1993-09-13 1996-03-26 International Business Machines Corporation Integrated multichip memory module structure
US5561622A (en) * 1993-09-13 1996-10-01 International Business Machines Corporation Integrated memory cube structure

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