JPH0243774A - Transparent resin molded photoelectric conversion element - Google Patents

Transparent resin molded photoelectric conversion element

Info

Publication number
JPH0243774A
JPH0243774A JP63194902A JP19490288A JPH0243774A JP H0243774 A JPH0243774 A JP H0243774A JP 63194902 A JP63194902 A JP 63194902A JP 19490288 A JP19490288 A JP 19490288A JP H0243774 A JPH0243774 A JP H0243774A
Authority
JP
Japan
Prior art keywords
inner leads
transparent resin
photoelectric conversion
conversion element
space
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63194902A
Other languages
Japanese (ja)
Inventor
Hisashi Shirahata
白畑　久
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP63194902A priority Critical patent/JPH0243774A/en
Publication of JPH0243774A publication Critical patent/JPH0243774A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Light Receiving Elements (AREA)

Abstract

PURPOSE:To surely prevent stray light from being incident from the rear side of a transparent resin mold so as to improve an element of this design in a photoelectric conversion property by a method wherein an opaque thin plate is provided to the rear sides of inner leads and a mount section covering a space between the inner leads and a space between the inner leads and the mounting section. CONSTITUTION:A photoelectric conversion element, which is mounted on a mounting section 1 of a lead frame 3 and connected to inner leads 2a, is molded with a transparent resin 6, where an opaque thin plate 10 is provided to the rear sides of the inner leads 2 and the mount section 1 covering spaces between the inner leads 2a and a space between the inner leads 2a and the mounting section 1 inside the inner region of the transparent resin 6. For instance, a semiconductor integrated circuit element 4, composed of a photoelectric conversion element and its environmental circuits, is mounted on the mount section 1 through bonding and connected to the inner leads 2a through a metal wire 5. Thereafter, the opaque thin plate 10 of a black color of the like is fitted to the rear of the inner leads 2a and the mount section 1 covering the space between the inner leads 2a and the inner leads 2a and the counting section 1 through an adhesion agent or the like, and the whole components are molded with a transparent resin 6.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、ホトトランジスタ等の光電変換素子とその
周辺回路とから構成された半導体集積回路素子を透明樹
脂でモールドしてパッケージとするものに関する。[Detailed Description of the Invention] [Industrial Application Field] This invention relates to a package in which a semiconductor integrated circuit element consisting of a photoelectric conversion element such as a phototransistor and its peripheral circuit is molded with a transparent resin. .

〔従来の技術〕[Conventional technology]

第３図は従来の技術例の断面図である。 FIG. 3 is a sectional view of a conventional technique.

図面において、マウント部１と外部リード２とインナリ
ード２ａとからなるリードフレーム３のマウント部１に
は光電変換素子とその周辺回路とからなる半導体集積回
路素子４が装着されている。In the drawing, a semiconductor integrated circuit element 4 comprising a photoelectric conversion element and its peripheral circuit is mounted on a mount part 1 of a lead frame 3 comprising a mount part 1, external leads 2, and inner leads 2a.

この半導体集積回路素子４は金属線５でインナリード２
ａに接続され、全体が透明樹脂６でモールドされてパッ
ケージとなる。矢印は光線を示し、センサ部である光電
変換素子が正面から受光すべき本来の光のほかに様々な
方向からも受光する。This semiconductor integrated circuit element 4 has an inner lead 2 with a metal wire 5.
a, and the whole is molded with transparent resin 6 to form a package. The arrows indicate light rays, and the photoelectric conversion element, which is the sensor section, receives light from various directions in addition to the original light that should be received from the front.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

前記の従来の技術において、透明樹脂６の内部領域には
、マウント部ｌとインナリード２ａとの間に空間があっ
て、この空間を通過して透明樹脂６の裏面からも光が入
射することがある。この裏面からの光は透明樹脂内で乱
反射を繰り返して半導体集積回路素子４の光電変換素子
部分やその周辺回路部分に入射する。このような光は迷
光といわれ、光電変換特性の低下や誤動作の原因になる
。In the conventional technology described above, there is a space in the internal region of the transparent resin 6 between the mount part l and the inner lead 2a, and light passes through this space and also enters from the back surface of the transparent resin 6. There is. The light from the back surface repeats diffuse reflection within the transparent resin and enters the photoelectric conversion element portion of the semiconductor integrated circuit element 4 and its peripheral circuit portion. Such light is called stray light and can cause deterioration of photoelectric conversion characteristics and malfunction.

特に用途上、裏面側に反射率の高い物がある時に著しい
。This is especially noticeable when there is something with high reflectance on the back side.

この発明の目的は透明樹脂モールドの裏面からの迷光の
入射を確実に防止して、光電変換特性を向上させること
にある。An object of the present invention is to reliably prevent stray light from entering from the back surface of a transparent resin mold, thereby improving photoelectric conversion characteristics.

〔課題を解決するための手段〕[Means to solve the problem]

この発明は、リードフレームのマウント部に装着してリ
ードフレームのインナリードに接続を施した光電変換素
子を透明樹脂でモールドするものにおいて、この透明樹
脂の内部領域であって前記インナリード相互間及びこれ
らと前記マウント部との間の空間を覆う不透光薄板を前
記インナリードと前記マウント部の裏面に設けるもので
ある。In the present invention, in which a photoelectric conversion element mounted on a mount portion of a lead frame and connected to inner leads of the lead frame is molded with a transparent resin, the inner area of the transparent resin is located between the inner leads and between the inner leads. A non-light-transmitting thin plate is provided on the back surface of the inner lead and the mount portion to cover a space between them and the mount portion.

〔作用〕[Effect]

マウント部１とインナリード２ａとの間を通過しようと
して透明樹脂６の裏面から入って来る光を不透光薄板１
０が遮断し、そのような光が迷光となって光電変換特性
を低下させたり、誤動作するのを防止する。The non-transparent thin plate 1 prevents light coming from the back side of the transparent resin 6 to pass between the mount part 1 and the inner lead 2a.
0 is blocked to prevent such light from becoming stray light and deteriorating photoelectric conversion characteristics or malfunctioning.

〔実施例〕〔Example〕

第１図は実施例の断面図、第２図は第１図の透視平面図
である。第３図と同一符号を付けたものはおよそ同一機
能を持つ。リードフレーム３には外部リード２とその延
長上のインナリード２ａがあり、マウント部１は接続部
２Ｃによってリードフレーム３の連結部２ｂに接続され
ている。光電変換素子とその周辺回路とからなる半導体
集積回路素子４はマウント部ｌに接着により装着され、
金等の金属線５でインナリード２ａに接続する。FIG. 1 is a sectional view of the embodiment, and FIG. 2 is a perspective plan view of FIG. 1. Components with the same reference numerals as in FIG. 3 have approximately the same functions. The lead frame 3 has an outer lead 2 and an inner lead 2a as an extension thereof, and the mount part 1 is connected to the connecting part 2b of the lead frame 3 by a connecting part 2C. A semiconductor integrated circuit element 4 consisting of a photoelectric conversion element and its peripheral circuit is attached to a mount l by adhesive,
It is connected to the inner lead 2a with a metal wire 5 made of gold or the like.

そして透明樹脂６でモールドし、外部リード２の端部と
接続部２Ｃとで連結部２ｂから図示の一点鎖線のように
切断して取り出される。すなわち従来例と同一の工程で
ある。Then, it is molded with a transparent resin 6, and cut and taken out from the connecting portion 2b at the end of the external lead 2 and the connecting portion 2C as shown in the dashed line shown in the figure. That is, the process is the same as that of the conventional example.

ところでこの実施例では金属線５によるワイヤボンディ
ング後、インナリード２ａの相互間及びこれらとマウン
ト部１との間の空間を覆うように黒又は他の色の不透光
薄板１０をインナリード２ａとマウント部ｌの裏面から
接着等により取付け、モールドする。この不透光薄板１
０は裏面からの迷光を遮断する。By the way, in this embodiment, after wire bonding with the metal wire 5, an opaque thin plate 10 of black or other color is attached to the inner leads 2a so as to cover the spaces between the inner leads 2a and between them and the mount part 1. Attach by gluing or the like from the back side of the mount part l and mold. This opaque thin plate 1
0 blocks stray light from the back side.

Ｃ発明の効果〕 この発明は、リードフレームのマウント部に装着してリ
ードフレームのインナリードに接続を施した光電変換素
子を透明樹脂でモールドするものにおいて、この透明樹
脂の内部領域であって前記インナリード相互間及びこれ
らと前記マウント部との間の空間を覆う不透光薄板を前
記インナリードと前記マウント部の裏面に設けるように
したので、透明樹脂モールドの裏面からの迷光の入射が
確実に防止され、光電変換特性が向上するという効果が
ある。C Effects of the Invention] The present invention is a device in which a photoelectric conversion element mounted on a mount portion of a lead frame and connected to an inner lead of the lead frame is molded with a transparent resin, in which the inner area of the transparent resin is Since an opaque thin plate is provided on the back surface of the inner leads and the mount portion to cover the spaces between the inner leads and between these and the mount portion, stray light is surely prevented from entering from the back surface of the transparent resin mold. This has the effect of preventing this and improving photoelectric conversion characteristics.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は実施例の断面図、第２図は第１図の透視平面図
、第３図は従来の技術例の断面図である。 １・・・マウント部、２ａ・・・インナリード、３・・
・リードフレーム、４・・・半導体集積回路素子、６・
・・透明樹脂、１０・・・不透光薄板。 第１図 第２図 第３図FIG. 1 is a sectional view of an embodiment, FIG. 2 is a perspective plan view of FIG. 1, and FIG. 3 is a sectional view of a conventional technique. 1...Mount part, 2a...Inner lead, 3...
・Lead frame, 4... Semiconductor integrated circuit element, 6.
... Transparent resin, 10... Opaque thin plate. Figure 1 Figure 2 Figure 3

Claims (1)

【特許請求の範囲】[Claims] １）リードフレームのマウント部に装着してリードフレ
ームのインナリードに接続を施した光電変換素子を透明
樹脂でモールドするものにおいて、この透明樹脂の内部
領域であって前記インナリード相互間及びこれらと前記
マウント部との間の空間を覆う不透光薄板を前記インナ
リードと前記マウント部の裏面に設けることを特徴とす
る透明樹脂モールドの光電変換素子。1) In a device in which a photoelectric conversion element mounted on a mount portion of a lead frame and connected to the inner leads of the lead frame is molded with a transparent resin, the inner area of the transparent resin is between the inner leads and between them. A transparent resin molded photoelectric conversion element, characterized in that an opaque thin plate covering a space between the inner lead and the mount part is provided on the back surface of the inner lead and the mount part.
JP63194902A 1988-08-04 1988-08-04 Transparent resin molded photoelectric conversion element Pending JPH0243774A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63194902A JPH0243774A (en) 1988-08-04 1988-08-04 Transparent resin molded photoelectric conversion element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63194902A JPH0243774A (en) 1988-08-04 1988-08-04 Transparent resin molded photoelectric conversion element

Publications (1)

Publication Number Publication Date
JPH0243774A true JPH0243774A (en) 1990-02-14

Family

ID=16332234

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63194902A Pending JPH0243774A (en) 1988-08-04 1988-08-04 Transparent resin molded photoelectric conversion element

Country Status (1)

Country Link
JP (1) JPH0243774A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH041506U (en) * 1990-04-18 1992-01-08 Honda Motor Co Ltd Optical link

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH041506U (en) * 1990-04-18 1992-01-08 Honda Motor Co Ltd Optical link

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