JPH0243745A - Manufacture of photoelectric conversion element molded with transparent resin - Google Patents

Abstract

PURPOSE:To completely reject stray light or random light coming from parts other than a photoelectric conversion element photodetecting surface serving as a sensor and thereby improve photoelectric conversion characteristics by a method wherein a detachable tape is pasted to the surface of a transparent resin corresponding to the photodetecting surface, a non-translucent resin film is attached to the outer surface of the transparent resin, and then the tape is peeled off. CONSTITUTION:In a device wherein a photoelectric conversion element is installed on a mount 1, connected to outer leads 2, and molded in a transparent resin 6, a detachable tape 8 is pasted on the surface of the transparent resin 6 corresponding to the photodetecting surface of the photoelectric conversion element. A non-translucent resin film 9 is formed thin on the tape 8 and the outer surface of the transparent resin 6. Then the tape 8 is peeled off together with a resin tape 9a attached to the surface of the tape 8 for the formation of an opening 10 on said photodetecting surface. For example, on the mount 1 of a lead frame 3, a semiconductor integrated circuit element 4 consisting of a photoelectric conversion element and its peripheral circuits is installed, and it is so arranged that light will fall only upon the photodetecting surface corresponding to the photoelectric conversion element constituting a part of the semiconductor integrated circuit element 4.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a puff cage made by molding a semiconductor integrated circuit element composed of a photoelectric conversion element such as a phototransistor and its peripheral circuit with a transparent resin. .

(Prior Art) FIG. 3 is a sectional view of a conventional technique, and FIG. 4 is a sectional view of a different conventional technique.

In these drawings, a semiconductor integrated circuit element 4 comprising a photoelectric conversion element and its peripheral circuit is mounted on a mount part 1 of a lead frame 3 comprising a mount part 1 and external leads 2. This semiconductor integrated circuit element 4 has a metal wire 5
It is connected to external leads 2, and the whole is molded with transparent resin 6 to form a package. The arrows indicate light rays, and the photoelectric conversion element, which is the sensor section, receives light from various directions in addition to the original light that should be received from the front.

In the latter conventional technique, as shown in the figure, a black film 7 is applied to the back surface of the transparent resin 6 to block unnecessary light reception from the back surface.

Although not particularly shown, the semiconductor integrated circuit element is molded with transparent resin, and only the light-receiving surface corresponding to the photoelectric conversion element part, which is the sensor part, is made transparent and smooth among its outer surfaces.
Others have a satin finish on the surface. This is to reduce the amount of light that enters from the satin finished surface.

[Problem to be solved by the invention]

In the above-mentioned conventional technology, the light that is supposed to be received from the front by the photoelectric conversion element, which is the sensor section, is also called stray light or scattered light, which may reduce the sensitivity of the photoelectric conversion effect or cause malfunctions. be. This may also occur when light hits peripheral circuits around the photoelectric conversion element. Therefore, in the case where the package is molded with transparent resin as described above, stray light or scattered light from various directions causes deterioration of photoelectric conversion characteristics and malfunction. Even if a black film is applied to the back surface, or the light-receiving surface is made transparent and smooth and the other outer surfaces are treated with a satin finish, no significant improvement is achieved.

An object of the present invention is to reliably prevent stray light and scattered light from sources other than the light-receiving surface of a photoelectric conversion element, which is a sensor section, and to improve photoelectric conversion characteristics.

[Means to solve the problem]

In the present invention, in which a photoelectric conversion element mounted on a mount part and connected to an external lead is molded with a transparent resin, a peelable tape is attached to a surface of the transparent resin corresponding to a light receiving surface of the photoelectric conversion element. A thin non-transparent resin film is applied to the outer surface of the transparent resin together with this tape, and then the tape is peeled together with the resin film applied to the surface of the tape to cover the light-receiving surface. It forms an opening.

[Effect]

When the tape 8 is peeled off, only the resin film 9a that is attached to the surface of the tape 8 is the thin non-transparent resin film 9.9a that is attached to the outer surface of the transparent resin 6 in which the photoelectric conversion element is molded. Opening part 1 corresponding to the light-receiving surface by peeling off with 8
0 is formed, and the other surface of the transparent resin 6 is still covered with an opaque resin film 9 to reliably prevent the incidence of stray light and scattered light.

〔Example〕

FIG. 1 is a sectional view of the embodiment, and FIG. 2 is a plan view of FIG. 1.

In the drawings, the same reference numerals as in the drawings showing the above-mentioned conventional technology have approximately the same functions.

That is, a semiconductor integrated circuit element 4 consisting of a photoelectric conversion element and its peripheral circuit is mounted on the mount part 1 of a node frame 3 consisting of a mount part 1 and external leads 2, and is molded with a transparent resin 6 after being connected with metal wires 5. be done. Note that other mounting methods may be used, such as mounting by a tape assembly method in which an element with bumps is bonded to a flexible tape. Next, the external leads 2 of the semiconductor integrated circuit element 4 molded with the transparent resin 6 are soldered to the flexible printed circuit board 2a.

Now, it is preferable that the surface of the semiconductor integrated circuit element 4 is such that only a small part thereof is used as a photoelectric conversion element, and the other part is used as a peripheral circuit, and that light is irradiated only on the light-receiving surface corresponding to the photoelectric conversion element. . Therefore, a tape 8 having the same shape as the light receiving surface is attached to the surface of the transparent resin 6 corresponding to the light receiving surface.
An opaque resin film 9 colored black or another color is thinly applied to the surface of the transparent resin 6 along with the tape 8. The tape 8 is removable like an adhesive tape, and the resin film 9 is suitable for a potting technique in which resin liquid is dropped onto the surface of the object.
In the case of a material that does not have a resin, known techniques such as dipping in resin liquid, powder coating, and spray coating can be used. After the resin film 9 is cured or semi-cured, the tape 8 is peeled together with the resin film 9a on the surface of the tape to form an opening 10 on the surface of the transparent resin 6 corresponding to the light receiving surface.

〔Effect of the invention〕

In the present invention, in which a photoelectric conversion element mounted on a mount part and connected to an external lead is molded with a transparent resin, a peelable tape is attached to a surface of the transparent resin corresponding to a light receiving surface of the photoelectric conversion element. A thin non-transparent resin film is applied to the outer surface of the transparent resin together with this tape, and then the tape is peeled together with the resin film applied to the surface of the tape to cover the light-receiving surface. Since the opening is formed, the semiconductor integrated circuit element receives light only from the light-receiving surface corresponding to the photoelectric conversion element, which is the sensor part, excluding peripheral circuits, thereby reliably preventing stray light or scattered light from entering. This is an effective and economical process that prevents a decrease in sensitivity and malfunctions and improves photoelectric conversion characteristics.

[Brief explanation of the drawing]

1 is a sectional view of the embodiment, FIG. 2 is a plan view of FIG. 1, FIG. 3 is a sectional view of a conventional technique, and FIG. 4 is a sectional view of a different conventional technique. 1...Mount part, 3...Lead frame, 4...
- Semiconductor integrated circuit element, 6... Transparent resin, 8... Tape, 9... Resin film, 10... Opening.

Claims (1)

[Claims] 1) In a device in which a photoelectric conversion element mounted on a mount part and connected to an external lead is molded with a transparent resin, a peelable tape is pasted on the surface of the transparent resin corresponding to the light receiving surface of the photoelectric conversion element. A thin non-transparent resin film is applied to the outer surface of the transparent resin together with this tape, and then the tape is peeled off along with the resin film applied to the surface of the tape to form an opening on the light receiving surface. 1. A method of manufacturing a photoelectric conversion element molded with a transparent resin, the method comprising: forming a transparent resin.