JPH0246058Y2 - - Google Patents

Description

[Detailed description of the invention] [Industrial application field] This invention consists of a plurality of semiconductor elements fixed to a heat sink, housed in an insulating case, sealed with resin, and connected to a predetermined circuit by a terminal board outside the insulating case. The present invention relates to a composite semiconductor device that forms a composite semiconductor device.

[Prior Art] Due to improvements in surface treatment technology for semiconductor pellets, in recent years, devices have appeared in which a plurality of semiconductor pellets are directly mounted on a heat sink and housed in an insulating case. Such a composite semiconductor device allows several types of circuits to be formed by preparing several types of terminal boards for external connections, and is extremely convenient for assembling external devices that use a large number of semiconductor elements. The modularization of composite semiconductor devices is progressing.

FIG. 4 is an external view of a conventional modularized composite semiconductor device, and FIG. 5 is a vertical cross-sectional view thereof.

In these figures, 1 is an insulating case, 2 is a heat sink placed on the bottom of the case 1, 3 is an insulator, 4 is a conductor, and 5 is a semiconductor pellet placed on the conductor. This semiconductor pellet 5 has various structures such as a diode and a thyristor. For example, in the case of a diode pellet, the anode side of this pellet is connected to the conductor 4, and the conductor 4 and the insulating case 1 are connected to each other. A terminal 7a buried in the sealing resin 6 so as to be partially exposed on the surface is electrically connected by a lead wire 8. Further, the cathode side of the pellet is connected to another terminal 7b by a lead wire 9.

In the composite semiconductor device configured as described above, as shown in FIG. Or 7b,
7b to form a predetermined circuit.

For example, if a single-phase full-wave rectifier bridge circuit is required for an external device, it is sufficient to prepare two of the above-mentioned composite semiconductor devices and configure the specified circuit. It's convenient.

However, conventional composite semiconductor devices have the following problems.

[Problems to be solved by the invention] Since the external terminal board 10 for external connection is formed in a shape that follows the side surface of the insulating case 1, its ends and the heat sink 2 are close to each other, and sufficient electrical insulation cannot be achieved. It was not possible to maintain the equipment, and there were problems with the safety of the equipment.

Furthermore, when mounting an external device using the mounting hole 12, since the external terminal board 10 is exposed on the side, it is not possible to arrange multiple composite semiconductor devices in close proximity to each other in consideration of the risk of electrical discharge, etc. However, there was a problem in that it was impossible to save space.

This idea was made in order to solve these problems, and to obtain a composite semiconductor device that can maintain sufficient electrical insulation of the external terminal board and that can contribute to space saving when attached to an external device. The purpose is to

[Means for Solving the Problems] The composite semiconductor device according to this invention has a pocket portion provided on the side surface of an insulating case, and one end of an external terminal board is inserted into the pocket portion.

[Function] One end of the external terminal board is covered by the pocket portion, so that the end portion is not exposed, and the vertical distance from the heat sink is increased.

[Embodiment] FIG. 1 is an external view of a composite semiconductor device showing an embodiment of this invention, FIG. 2 is a cross-sectional view thereof, and FIG. 3 is a circuit diagram showing an example of the configuration of an external circuit.

Note that the same or equivalent parts as in FIGS. 4 and 5 showing the conventional example are given the same reference numerals.

In the above figure, 13 is a pocket portion formed on the side surface of the insulating case 1 from the top to the bottom. This pocket portion 13 has a window 13a in the illustration.
However, the window 13a may not be provided and the window 13a may be closed to the top.

One end of the external terminal board 10 is inserted into the pocket portion 13, and the other end is fixed to the terminals 7a and 7b arranged on the surface of the insulating case 1 with screws 11.

For example, in the example of the circuit shown in FIG. 3, two types of external terminals 10, 10a and 10b, can be prepared to configure a common anode, a common cathode, and a series connection circuit for the diodes _D1 and _D2 . can.

Furthermore, although not shown, if pocket portions 13 are formed on both sides of the insulating case, various connections can be made by using a plurality of external terminal boards 10 even when three or more semiconductor pellets are enclosed. .

[Effects of the invention] Since this invention is constructed as described above, one end of the external terminal board is covered by the pocket part of the insulating case, so the vertical distance between the external terminal and the heat sink is long. Therefore, sufficient electrical insulation can be achieved.

Furthermore, since one end of the external terminal board is inserted into the pocket, other composite semiconductor devices can be placed adjacent to each other, thereby saving space for external mounting.

[Brief explanation of the drawing]

FIG. 1 is an external view of a composite semiconductor device showing an embodiment of this invention, FIG. 2 is a cross-sectional view thereof, FIGS. 3A, B, and C are circuit diagrams showing an example of the configuration of an external circuit, FIG. 4 is an external view showing an example of a conventional composite semiconductor device, and FIG. 5 is a longitudinal sectional view thereof. In the figure, 1 is an insulating case, 2 is a heat sink, and 5
1 is a semiconductor pellet, 10 is an external terminal board, and 13 is a pocket portion.

Claims (1)

[Scope of utility model registration request] An insulating case, a heat sink provided on the bottom of the case, a plurality of semiconductor elements sealed in the insulating case, a plurality of terminals electrically connected to the elements and arranged on the surface of the insulating case, and the terminals. In a composite semiconductor device having an external terminal board extending between the two and forming a predetermined circuit on a side surface of the insulating case, at least one pocket section is provided on the side surface of the insulating case, and one end of the external terminal board is attached to the pocket section. A composite semiconductor device characterized by being inserted.