JPH0249717Y2 - - Google Patents

Info

Publication number
JPH0249717Y2
JPH0249717Y2 JP1988027004U JP2700488U JPH0249717Y2 JP H0249717 Y2 JPH0249717 Y2 JP H0249717Y2 JP 1988027004 U JP1988027004 U JP 1988027004U JP 2700488 U JP2700488 U JP 2700488U JP H0249717 Y2 JPH0249717 Y2 JP H0249717Y2
Authority
JP
Japan
Prior art keywords
boat
wafer
wafers
base
pins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1988027004U
Other languages
English (en)
Japanese (ja)
Other versions
JPH01130538U (lt
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988027004U priority Critical patent/JPH0249717Y2/ja
Publication of JPH01130538U publication Critical patent/JPH01130538U/ja
Application granted granted Critical
Publication of JPH0249717Y2 publication Critical patent/JPH0249717Y2/ja
Expired legal-status Critical Current

Links

JP1988027004U 1988-02-29 1988-02-29 Expired JPH0249717Y2 (lt)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988027004U JPH0249717Y2 (lt) 1988-02-29 1988-02-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988027004U JPH0249717Y2 (lt) 1988-02-29 1988-02-29

Publications (2)

Publication Number Publication Date
JPH01130538U JPH01130538U (lt) 1989-09-05
JPH0249717Y2 true JPH0249717Y2 (lt) 1990-12-27

Family

ID=31249133

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988027004U Expired JPH0249717Y2 (lt) 1988-02-29 1988-02-29

Country Status (1)

Country Link
JP (1) JPH0249717Y2 (lt)

Also Published As

Publication number Publication date
JPH01130538U (lt) 1989-09-05

Similar Documents

Publication Publication Date Title
JPH10233426A (ja) 自動ティ−チング方法
CN115274483B (zh) 一种晶圆电性能检测设备
US5825500A (en) Unit for transferring to-be-inspected object to inspection position
KR100230987B1 (ko) 광문자인식기가 부착된 반도체 웨이퍼 검사장치
JPH08148546A (ja) ウェハ配列検出装置
JP2000200810A (ja) プロ―バ
JP3365781B2 (ja) 基板外観検査装置
US8097966B2 (en) Adjustable film frame aligner
JP2002151577A (ja) 基板のエッジ保持アライナー
JPH07335718A (ja) ウエハキャリア装置
JP2000058625A (ja) 基板搬送装置
JP2862956B2 (ja) 基板搬送装置
JP2882746B2 (ja) 基板搬送装置
JPH07335716A (ja) 基板姿勢転換装置及び基板受渡し装置並びにそれを用いた基板湿式処理装置
JP3526709B2 (ja) 液晶パネルのアライメント装置
JP2552017B2 (ja) 基板の位置合わせ支持装置
JP5927791B2 (ja) 搬送車
JPH0333065Y2 (lt)
JPH0211489B2 (lt)
JPH10123193A (ja) 表示パネル基板の検査装置および検査方法
JPH0652753B2 (ja) 基板搬出入装置
JPH0310672Y2 (lt)
CN115015596B (zh) 一种半导体姿态调整结构、调整方法和探针台
JP2547212Y2 (ja) 基板用測定装置
JPH0691152B2 (ja) 半導体ウエハ計数装置