JPH0252200U - - Google Patents
Info
- Publication number
- JPH0252200U JPH0252200U JP12999488U JP12999488U JPH0252200U JP H0252200 U JPH0252200 U JP H0252200U JP 12999488 U JP12999488 U JP 12999488U JP 12999488 U JP12999488 U JP 12999488U JP H0252200 U JPH0252200 U JP H0252200U
- Authority
- JP
- Japan
- Prior art keywords
- electron beam
- processed
- irradiation
- thickness
- workpiece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010894 electron beam technology Methods 0.000 claims description 9
- 238000001514 detection method Methods 0.000 claims description 3
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
Description
第１図は本考案の１実施例である電子線照射装
置の概略図、第２図は繋ぎ目のあるシート状又は
板状の被処理物に電子線を照射する場合の説明図
、第３図は従来の電子線照射装置の概略図である
。
１０……電子線発生部、１１……照射窓部、１
１ａ……チタン箔、２０……処理室、２１……照
射部、２２……搬送ローラ、２３……照射部ロー
ラ、３０……制御部、３１……厚検出部、３２…
…速度検出部、３３……駆動装置、Ａ，Ｂ……被
処理物。
FIG. 1 is a schematic diagram of an electron beam irradiation apparatus which is an embodiment of the present invention, FIG. 2 is an explanatory diagram of irradiating a jointed sheet or plate-shaped workpiece with an electron beam, and FIG. The figure is a schematic diagram of a conventional electron beam irradiation device. 10... Electron beam generating section, 11... Irradiation window section, 1
1a... Titanium foil, 20... Processing chamber, 21... Irradiation section, 22... Conveyance roller, 23... Irradiation section roller, 30... Control section, 31... Thickness detection section, 32...
...Speed detection section, 33... Drive device, A, B... Workpiece.
Claims (1)
介して被処理物に照射する電子線照射装置におい
て、 前記被処理物の厚さを検出する厚検出手段と、 前記照射窓部と前記被処理物との間隔を調整す
るために前記被処理物を移動する移動手段と、 前記厚検出手段からの信号を受けて前記移動手
段を制御し、前記被処理物に電子線を照射する際
に該被処理物の処理面と前記照射窓部との間隔を
予め定めた一定値とする制御手段とを設けたこと
を特徴とする電子線照射装置。[Claims for Utility Model Registration] In an electron beam irradiation device that irradiates a workpiece with an electron beam emitted from an electron beam generation source through an irradiation window, a thickness detection means for detecting the thickness of the workpiece. a moving means for moving the object to be processed in order to adjust the distance between the irradiation window section and the object to be processed; and a moving means for controlling the moving means in response to a signal from the thickness detecting means, An electron beam irradiation apparatus comprising: a control means for setting a distance between the processing surface of the object to be processed and the irradiation window to a predetermined constant value when irradiating the object with the electron beam.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12999488U JPH0252200U (en) | 1988-10-05 | 1988-10-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12999488U JPH0252200U (en) | 1988-10-05 | 1988-10-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0252200U true JPH0252200U (en) | 1990-04-13 |
Family
ID=31384764
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12999488U Pending JPH0252200U (en) | 1988-10-05 | 1988-10-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0252200U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003508760A (en) * | 1999-08-31 | 2003-03-04 | スリーエム イノベイティブ プロパティズ カンパニー | Electron beam device with low loss beam path |
| WO2020036056A1 (en) * | 2018-08-17 | 2020-02-20 | 日立造船株式会社 | Electron beam irradiation device, adhesion equipment provided with same, and adhesion method |
-
1988
- 1988-10-05 JP JP12999488U patent/JPH0252200U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003508760A (en) * | 1999-08-31 | 2003-03-04 | スリーエム イノベイティブ プロパティズ カンパニー | Electron beam device with low loss beam path |
| WO2020036056A1 (en) * | 2018-08-17 | 2020-02-20 | 日立造船株式会社 | Electron beam irradiation device, adhesion equipment provided with same, and adhesion method |
| JP2020027078A (en) * | 2018-08-17 | 2020-02-20 | 日立造船株式会社 | Electron beam irradiation apparatus, bonding equipment including the same, and bonding method |
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