JPH025491Y2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a hybrid circuit formed by connecting an integrated circuit and a delay line.

Recently, most electronic circuits have tended to be integrated circuits, but there are some circuits that include inductance, such as delay line circuits made up of a combination of coils and capacitors, which are difficult to integrate.
If such a circuit is included in the overall circuit, it will be necessary to connect it to the outside of the integrated circuit. This also corresponds to the case where a buffered delay line is constructed by combining a delay line with a saturation type logic circuit using TTL elements.

Then, a delay line circuit is constructed by arranging coils and capacitors on a printed circuit board, and the board is placed on a flat package of an integrated circuit, and the delay line circuit and integrated circuit are connected via the terminals of the flat package. A hybrid circuit in which external terminals are exposed to the outside of a dual in-line package (hereinafter referred to as DIP) is known from Japanese Utility Model Application Publication No. 58-89953.

However, since the external terminals are usually formed using a lead frame, the spacing between them is determined by the standard, and the spacing between the terminals of a flat package is also determined by the standard, and moreover, it is formed using a lead frame. In addition, the circuit configuration inside the flat package cannot be easily changed because it is an integrated circuit, and the role of the terminals is also determined by their position. Therefore, it is not easy to change the mutual connection positions between the integrated circuit and the delay line circuit, or the connection positions of the external terminals of the hybrid circuit, depending on the customer's specifications. By the way, when installing a 14-pin external terminal, the distance between the DIPs is 2.54mm, and the distance between the 14-pin external terminals is 2.54mm.
The standard terminal spacing for 4 pins is 1.27mm.

In order to solve these technical problems, the present invention provides a technology that allows the terminals of a flat package whose role is fixed to be connected to the delay line circuit at any position on the board on which the delay line is configured. .

In this invention, a delay line board consisting of a coil and a capacitor is placed on a flat package of an integrated circuit, and the connection between the integrated circuit and the circuit of the board is made on the side of the board. In a hybrid circuit in which the entire circuit is sealed with resin with external terminals exposed in two rows sandwiching the substrate and the flat package, at least one of the flat packages The two terminals are connected to the sides of the board via jumper leads.

Taking the circuit diagram of the buffered delay line shown in FIG. 1 as an example, an explanation will be given below with reference to FIGS. 2 to 6 showing embodiments of the hybrid circuit of the present invention. Figures 2 and 3 are explanatory diagrams for explaining the connections between the circuit, mainly the delay line, and the integrated circuit configured on the board, and Figures 4 and 5 are partial perspective views of the hybrid circuit. , FIG. 6 is an explanatory diagram of the hybrid circuit viewed from the side in the length direction.

In Figure 1, G1 to G6 are TTL elements,
1 is an input terminal, 2 to 6 are output terminals, Vc is a power supply terminal, and E is an earth terminal. A portion surrounded by a dotted line constitutes a delay line, and elements G1 to G6 are configured within an integrated circuit.

FIG. 2 shows a substrate 10 and an integrated circuit flat package 11, each of which constitutes a delay line by arranging coils and capacitors using a known method and connecting them with conductor patterns. The white circles represent pitch positions on a plane where external terminals can exist, and are determined by the lead frame standard. VcA, NA, EA, and 1A to 6A are external terminals, and their positions are determined by the customer's specifications or standards at the time of design. As will be explained in detail later, the third
It is placed on a flat package 11 as shown in the figure.

Note that the distance L1 between the closest external terminals is twice the distance L2 between the terminals of the flat package 11.

Coils and capacitors constituting the delay line on the surface of the substrate 10 are not shown, and only the conductor patterns around the side grooves and the main grooves are shown. An external terminal VcA serving as a power supply terminal Vc is fixed to the groove 70, an external terminal 1A serving as the input terminal 1 to the groove 77, and an external terminal EA serving as the earth terminal E to the groove 78, as shown in the figure. Connect to the delay line circuit through a conductor pattern that is not connected to the delay line.
The groove 76 has an external terminal 2A serving as the output terminal 2.
is fixed, and the external terminal 2 is fixed by the conductor pattern 12.
A is electrically connected to the groove 73. An external terminal 4A serving as an output terminal 4 is fixed to the groove 75 and connected to the groove 74 through the conductor pattern 13. Groove 79
The external terminal NA fixed to is an empty terminal.

The flat package 11 is composed of six TTL elements, and each element is given the same reference numeral as in Fig. 1 and corresponds to the one shown in Fig. 2 in order to meet the specifications of the external terminals. be. 81 to 87 are the main terminals that are exposed horizontally on the outside of the flat package 11, and the terminals with black circles, including those without numbers, are bent vertically upward and placed on the bottom side of the board 10. into its corresponding groove. Element G3, element G5, element G
The output side terminals 85, 86, and 87 of the flat package 11 are bent downward at the sides of the flat package 11 and connected to the external terminals 3A, 5A, and 6A, respectively.

The output side terminal 83 of the element G2 is fitted into the groove 73 and passes through the conductor pattern 12 to the external terminal 2.
Connected to A. The terminal 81 on the input side of the element G2 and the groove 71 are connected by a jumper lead J1 formed of a flat metal piece using a lead frame. A delay line circuit is connected to the groove 71 by a conductor pattern (not shown). Further, the output side terminal 84 of the element G4 is fitted into the groove 74,
It is connected to the external terminal 4A via the conductor pattern 13. The terminal 82 on the input side and the groove 72 are connected by a jumper lead J2 formed in the same manner as the jumper lead J1, and the terminal 82 is connected to a delay line circuit.

In the hybrid circuit of the present invention, if the terminals of the flat package 11 cannot be bent upward and connected to the circuit portion of the desired delay line due to the arrangement of the external terminals, as in the embodiment, the delay line to be connected to the desired delay line circuit section is used. After the circuit portion is pulled out to a desired position on the side of the board 10, it is connected again via jumper leads. The method of connecting to the terminals 81 and 82 corresponds to this case.

FIG. 3 shows a plan view of the substrate 10 placed on the flat package 11. Further, the position of the flat package 11 is indicated by a dashed line, and the jumper leads J1 and J2 are indicated by dotted lines.

FIG. 4 is a partial perspective view specifically showing the hybrid circuit in the vicinity from the external terminal VcA to the external terminal 2A in FIG. The same parts of the substrate 10 as in FIGS. 2 and 3 are shown. Figure 5 shows the external terminals shown in Figure 3.
FIG. 3 is a partial perspective view of a nearby hybrid circuit from EA to external terminal 6A.

In FIGS. 4 and 5, the same parts as in FIGS. 2 and 3 are given the same reference numerals, and the connection between the board 10 and the flat package 11 has already been made as shown in FIGS. 2 and 3.
Since it has been described in the figure, no new explanation is necessary. External terminal VcA, external terminal 2A, external terminal
The tapered upper part of the EA is fitted into a groove in the board 10 and soldered to it, becomes almost horizontal in the middle, and extends further downward. The narrowed portions of the jumper leads J1 and J2 at one end are soldered to the grooves of the substrate 10. The jumper lead J1 is pulled out vertically from the part soldered to the board 10 to below the flat package 11, bent horizontally inward, and then further bent and extended in the length direction of the flat package 11. do. Then, it is pulled out vertically at the position of the terminal 81 and soldered. The end of the jumper lead J1 connected to the terminal 81 is formed in a U shape, and the terminal 81 has a tip bent downward.
Connect by inserting the horizontal part from below. In short, the jumper lead J1 is pulled out vertically upward at the connection position, and extends horizontally along the bottom surface 14 of the flat package 11 in a U-shape. The same applies to jumper lead J2. The jumper leads J1 and J2 are formed of flat metal pieces using a lead frame. Therefore, it is advisable to use two types of lead frames, one for external terminals and one for jumper leads, during manufacturing. External terminal 2A is terminal 8 to which jumper lead J1 is connected.
1 is soldered to the groove 76 of the upper substrate 10. Of course, the terminal 81 and the external terminal 2A are not in contact with each other, and a so-called two-story terminal structure is formed in this part. The external terminal 6A connected to the terminal of the flat package 11, for example, the external terminal 6A connected to the terminal 87, has a U-shaped tip, and is connected by inserting the horizontal part of the terminal 87 from above. There is. It extends upward from the tip along the side surface of the flat package 11, curves approximately horizontally, and then extends downward. The height of the horizontal portion 15 is the same as that of the horizontal portion 16 of an external terminal connected to the substrate 10, for example, the external terminal EA. In addition to the board 10 and the flat package 11, FIG. 6 shows an external terminal 6A connected to the terminal 87 of the flat package 11, an external terminal 4A connected to the board 10, and an external terminal EA as representative external terminals. However, as shown by the dotted line, when the hybrid circuit is sealed with resin by DIP, the external terminals and the board 10 that are connected to the terminals of the flat package 11 are connected to the terminals of the flat package 11.
Both external terminals connected to the package can be pulled out from the same height approximately in the center of the package where the resin is thick. This improves the strength of the external terminal and also improves the commercial value in terms of appearance.

7 and 8 are explanatory diagrams showing other embodiments of the hybrid circuit of the present invention. The hybrid circuit will be explained using the buffered delay line shown in FIG. 1 as an example. In FIG. 7, a substrate 17 constituting a delay line and a flat package 11 of an integrated circuit are shown in plan view. The white circles represent the plane positions where external terminals can exist, and are determined by the lead frame standard. The positions of the external terminals having the same symbols as in the first embodiment are determined by the customer's specifications or standards at the time of design.

The substrate 17, like the substrate 10, shows only the side grooves and the conductor pattern around the main grooves.
An external terminal VcA is fixed to the groove 101, an external terminal 1A is fixed to the groove 97, and an external terminal EA is fixed to the groove 95, respectively, and is connected to the delay line circuit by a conductor pattern (not shown). The grooves 90, 100, and 99 have external terminals 2A, 4A, and 6A, respectively.
is fixed. External terminal 2A, external terminal 4A, external terminal 6A are conductor pattern 18, conductor pattern 1
9. Groove 93 and groove 9 are formed by the conductor pattern 20, respectively.
4. Electrically connect to groove 98. The flat package 11 has exactly the same structure as that used in the first embodiment, but the numbering of the six TTL elements is changed to meet the specifications of the external terminals. 81 to 88 are terminals of the flat package 11, and the terminals with black circles, including those without numbers, are bent upward and fitted into the corresponding grooves from the bottom of the board 17. Motoko G
3. The terminals 85 and 87 on the output side of the element G5 are connected to the external terminals 3 on the sides of the flat package 11, respectively.
A, connected to external terminal 5A. and element G2
The output side terminal 83 is fitted into the groove 93 and connected to the external terminal 2A via the conductive pattern 18.
The terminal 81 on the input side of the element G2 and the groove 91 are connected by a jumper lead J3 formed of a flat metal piece using a lead frame.
It is connected to the delay line circuit by a conductor pattern not shown. Terminal 82 on the input side of element G4
Do the same thing between the groove 92 and the jumper lead J.
Connected by 4. Further, the output side terminal 86 of the element G1 is connected to the groove 96 by a jumper lead J5.

FIG. 8 shows a state in which the substrate 17 is placed on the flat package 11 in a plan view. The dotted line represents the position of the flat package 11, and the dotted lines represent the jumper lead J3, jumper lead J4, and jumper lead J5, respectively. The shapes of the external terminals, jumper leads, and terminals of the flat package 11 are the same as in FIGS. 4 and 5.

As described above, in the hybrid circuit of the present invention, the connection position between the integrated circuit and the substrate on which the delay line is formed can be freely changed using jumper leads on the sides of the substrate. Therefore, integrated circuits have the inconvenience that the spacing between the terminals of the flat package and the spacing between the external terminals are set to different values depending on the standards, and that it is difficult to change the role of the terminals of the flat package. However, it is possible to set the position of the external terminal relatively freely by changing the connection position. In the embodiment as well, it has been explained that two types of methods for leading out external terminals are possible by using a common flat package and only slightly changing the conductor pattern on the side of the board, which is easy to change. Of course, the number of changes to the board will also be reduced compared to the past. If jumper leads are formed using a lead frame, productivity during manufacturing is high and connection reliability can be improved in the same way as external terminals.

Note that it is easier to connect the integrated circuit to the circuit on the board by fitting the flat package terminals or jumper leads into the grooves on the sides of the board and fixing them, as shown in the example, but it is easier to connect the integrated circuits to the circuits on the board. It is also possible to provide a hole and insert the tip of a terminal or jumper lead for connection, or to further insert an external terminal into the hole and fix it.

Thus, the hybrid circuit of the present invention can have wide versatility in both the substrate and the flat package, and can be easily connected to each other, making it compact, inexpensive, and highly practical.

[Brief explanation of the drawing]

Figure 1 is a circuit diagram of a buffered delay line used in the hybrid circuit of the present invention, Figures 2 and 3.
Figure 6 is an explanatory diagram showing an embodiment of the hybrid circuit of the present invention, Figures 4 and 5 are partial perspective views of the hybrid circuit of the present invention, and Figures 7 and 8 are hybrid circuits of the present invention. It is an explanatory view showing other examples of. 1: Input terminal, 2, 3, 4, 5, 6: Output terminal, 10, 17: Board, 11: Flat package, 12, 13, 18, 19, 20: Conductor pattern, 14: Bottom surface, 15, 16 :Horizontal part, 1A~
6A: External terminal, G1 to G6: TTL element, J1
~J5: Jumper lead.

Claims (1)

[Scope of utility model registration request] A delay line board consisting of a coil and a capacitor is placed on a flat package of an integrated circuit, and the connection between the integrated circuit and the circuit of the board is made by connecting the terminals of the flat package on the side of the board. In a hybrid circuit in which the entire circuit is sealed with resin with external terminals exposed in two rows sandwiching the substrate and the flat package, at least one terminal of the flat package is A hybrid circuit, characterized in that the hybrid circuit is connected to the side of the substrate via a jumper lead made of a flat metal piece that extends along the bottom surface of the flat package and is pulled out vertically.