JPH02664U - - Google Patents
Info
- Publication number
- JPH02664U JPH02664U JP7850488U JP7850488U JPH02664U JP H02664 U JPH02664 U JP H02664U JP 7850488 U JP7850488 U JP 7850488U JP 7850488 U JP7850488 U JP 7850488U JP H02664 U JPH02664 U JP H02664U
- Authority
- JP
- Japan
- Prior art keywords
- probe
- semiconductor substrate
- tip
- utility
- parallel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000523 sample Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
Description
第１図は本考案の実施例の縦断面図、第２図は
本考案の別の実施例の縦断面図、第３図は従来例
の縦断面図である。 １０１，２０１，３０１……半導体基板、１０
２，２０２，３０２……層間酸化膜、１０３，２
０３，３０３……ボンデイングパツド、１０４，
２０４，３０４……カバー酸化膜、１０５，２０
５，３０５……ポリイミド樹脂、１０６，２０６
，３０６……金バンプ、１０７，２０７，３０７
……プローブ。
本考案の別の実施例の縦断面図、第３図は従来例
の縦断面図である。 １０１，２０１，３０１……半導体基板、１０
２，２０２，３０２……層間酸化膜、１０３，２
０３，３０３……ボンデイングパツド、１０４，
２０４，３０４……カバー酸化膜、１０５，２０
５，３０５……ポリイミド樹脂、１０６，２０６
，３０６……金バンプ、１０７，２０７，３０７
……プローブ。
Claims (1)
- プローブの先端が半導体基板の一主面と平行で
あることを特徴とするプローブカード。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7850488U JPH02664U (ja) | 1988-06-13 | 1988-06-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7850488U JPH02664U (ja) | 1988-06-13 | 1988-06-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02664U true JPH02664U (ja) | 1990-01-05 |
Family
ID=31303426
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7850488U Pending JPH02664U (ja) | 1988-06-13 | 1988-06-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02664U (ja) |
-
1988
- 1988-06-13 JP JP7850488U patent/JPH02664U/ja active Pending