JPH02664U - - Google Patents
Info
- Publication number
- JPH02664U JPH02664U JP7850488U JP7850488U JPH02664U JP H02664 U JPH02664 U JP H02664U JP 7850488 U JP7850488 U JP 7850488U JP 7850488 U JP7850488 U JP 7850488U JP H02664 U JPH02664 U JP H02664U
- Authority
- JP
- Japan
- Prior art keywords
- probe
- semiconductor substrate
- tip
- utility
- parallel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000523 sample Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
Landscapes
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
第１図は本考案の実施例の縦断面図、第２図は
本考案の別の実施例の縦断面図、第３図は従来例
の縦断面図である。 １０１，２０１，３０１……半導体基板、１０
２，２０２，３０２……層間酸化膜、１０３，２
０３，３０３……ボンデイングパツド、１０４，
２０４，３０４……カバー酸化膜、１０５，２０
５，３０５……ポリイミド樹脂、１０６，２０６
，３０６……金バンプ、１０７，２０７，３０７
……プローブ。
本考案の別の実施例の縦断面図、第３図は従来例
の縦断面図である。 １０１，２０１，３０１……半導体基板、１０
２，２０２，３０２……層間酸化膜、１０３，２
０３，３０３……ボンデイングパツド、１０４，
２０４，３０４……カバー酸化膜、１０５，２０
５，３０５……ポリイミド樹脂、１０６，２０６
，３０６……金バンプ、１０７，２０７，３０７
……プローブ。
Claims (1)
- プローブの先端が半導体基板の一主面と平行で
あることを特徴とするプローブカード。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7850488U JPH02664U (ja) | 1988-06-13 | 1988-06-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7850488U JPH02664U (ja) | 1988-06-13 | 1988-06-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02664U true JPH02664U (ja) | 1990-01-05 |
Family
ID=31303426
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7850488U Pending JPH02664U (ja) | 1988-06-13 | 1988-06-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02664U (ja) |
-
1988
- 1988-06-13 JP JP7850488U patent/JPH02664U/ja active Pending