JPH0267639U - - Google Patents

Info

Publication number
JPH0267639U
JPH0267639U JP14669488U JP14669488U JPH0267639U JP H0267639 U JPH0267639 U JP H0267639U JP 14669488 U JP14669488 U JP 14669488U JP 14669488 U JP14669488 U JP 14669488U JP H0267639 U JPH0267639 U JP H0267639U
Authority
JP
Japan
Prior art keywords
mold
lead frame
transfer molding
runner
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14669488U
Other languages
English (en)
Other versions
JPH0739230Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14669488U priority Critical patent/JPH0739230Y2/ja
Publication of JPH0267639U publication Critical patent/JPH0267639U/ja
Application granted granted Critical
Publication of JPH0739230Y2 publication Critical patent/JPH0739230Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図は本考案実施例の構造を示す金型の断面
図、第２図は従来におけるトランスフア成形用金
型の断面図、第３図は第２図における下型の斜視
図である。図において、 １：上型、２：下型、３：キヤビテイ、４：ラ
ンナ、５：ゲート、６：リードフレーム、７：半
導体チツプ、８：フラツシユ生成間隙、ｇ：間隙
寸法、ｄ：リードフレームの板厚寸法。

Claims (1)

    【実用新案登録請求の範囲】
  1. 樹脂封止形半導体素子を成形するトランスフア
    成形用金型であり、上型と下型との間にチツプ素
    子をマウントしたリードフレームをインサートし
    、この状態でランナよりゲートを経てキヤビテイ
    に溶融樹脂を注入するものにおいて、ランナブロ
    ツクに対応する金型のパーテイング面域に０．０
    ２mmないしリードフレームの板厚寸法に相当する
    フラツシユ生成間隙を設けたことを特徴とするト
    ランスフア成形用金型。
JP14669488U 1988-11-10 1988-11-10 トランスファ成形用金型 Expired - Fee Related JPH0739230Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14669488U JPH0739230Y2 (ja) 1988-11-10 1988-11-10 トランスファ成形用金型

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14669488U JPH0739230Y2 (ja) 1988-11-10 1988-11-10 トランスファ成形用金型

Publications (2)

Publication Number Publication Date
JPH0267639U true JPH0267639U (ja) 1990-05-22
JPH0739230Y2 JPH0739230Y2 (ja) 1995-09-06

Family

ID=31416424

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14669488U Expired - Fee Related JPH0739230Y2 (ja) 1988-11-10 1988-11-10 トランスファ成形用金型

Country Status (1)

Country Link
JP (1) JPH0739230Y2 (ja)

Also Published As

Publication number Publication date
JPH0739230Y2 (ja) 1995-09-06

Similar Documents

Publication Publication Date Title
JPH032638U (ja)
JPH0276838U (ja)
JPH01156016U (ja)
JPS62188143U (ja)
JPS6167113U (ja)
JPS6188239U (ja)
JPS61179746U (ja)
JPS63159830U (ja)
JPH01176928U (ja)
JPS63155632U (ja)
JPH0460416U (ja)
JPH0173946U (ja)
JPS6416634U (ja)
JPS62114440U (ja)
JPH0415854U (ja)
JPS6420728U (ja)
JPH0448625U (ja)
JPH02122437U (ja)
JPH0221736U (ja)
JPS5844841U (ja) 樹脂封止形半導体装置のモ−ルド金型
JPS6183036U (ja)
JPS63162529U (ja)
JPH0180930U (ja)
JPH01104730U (ja)
JPH032639U (ja)

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees