JPH0268448U - - Google Patents

Info

Publication number
JPH0268448U
JPH0268448U JP14741188U JP14741188U JPH0268448U JP H0268448 U JPH0268448 U JP H0268448U JP 14741188 U JP14741188 U JP 14741188U JP 14741188 U JP14741188 U JP 14741188U JP H0268448 U JPH0268448 U JP H0268448U
Authority
JP
Japan
Prior art keywords
plate material
alloy
thin plate
circuit
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14741188U
Other languages
English (en)
Other versions
JPH0723964Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988147411U priority Critical patent/JPH0723964Y2/ja
Publication of JPH0268448U publication Critical patent/JPH0268448U/ja
Application granted granted Critical
Publication of JPH0723964Y2 publication Critical patent/JPH0723964Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Description

【図面の簡単な説明】
第１図はこの考案の半導体装置用基板の概略説
明図、第２図は従来半導体装置用基板の概略説明
図である。 Ａ，Ａ′…ヒートシンク板材、Ｂ，Ｂ′…薄板
材、Ｃ，Ｃ′…絶縁板材、Ｄ…ろう材、Ｄ′…は
んだ材。

Claims (1)

    【実用新案登録請求の範囲】
  1. いずれもＡまたはＡ合金からなるヒートシ
    ンク板材および回路形成用薄板材を、酸化アルミ
    ニウム焼結体からなる絶縁板材を両側からはさん
    だ状態で、Ａ―Ｓｉ系合金またはＡ―Ｇｅ系
    合金のろう材を用いて積層接合してなり、かつ前
    記回路形成用薄板材の表面の所定部分または全面
    にＣｕまたはＮｉメツキ層を形成してなる半導体
    装置用軽量基板。
JP1988147411U 1988-11-11 1988-11-11 半導体装置用軽量基板 Expired - Lifetime JPH0723964Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988147411U JPH0723964Y2 (ja) 1988-11-11 1988-11-11 半導体装置用軽量基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988147411U JPH0723964Y2 (ja) 1988-11-11 1988-11-11 半導体装置用軽量基板

Publications (2)

Publication Number Publication Date
JPH0268448U true JPH0268448U (ja) 1990-05-24
JPH0723964Y2 JPH0723964Y2 (ja) 1995-05-31

Family

ID=31417786

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988147411U Expired - Lifetime JPH0723964Y2 (ja) 1988-11-11 1988-11-11 半導体装置用軽量基板

Country Status (1)

Country Link
JP (1) JPH0723964Y2 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002059272A (ja) * 2000-08-11 2002-02-26 Mitsubishi Materials Corp セラミック粉末層を介在させたＡｌ複合材及びその製造方法
EP1187198A2 (en) 2000-09-04 2002-03-13 Dowa Mining Co., Ltd. Metal-ceramic circuit board and manufacturing method thereof
JP2005503039A (ja) * 2001-08-31 2005-01-27 シーメンス　アクチエンゲゼルシヤフト パワー電子ユニット
JP2013179374A (ja) * 2008-03-17 2013-09-09 Mitsubishi Materials Corp パワーモジュール用基板

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59121890A (ja) * 1982-12-28 1984-07-14 株式会社東芝 セラミツクスと金属との接合体
JPS6071579A (ja) * 1983-09-28 1985-04-23 株式会社日立製作所 アルミナと金属との接合方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59121890A (ja) * 1982-12-28 1984-07-14 株式会社東芝 セラミツクスと金属との接合体
JPS6071579A (ja) * 1983-09-28 1985-04-23 株式会社日立製作所 アルミナと金属との接合方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002059272A (ja) * 2000-08-11 2002-02-26 Mitsubishi Materials Corp セラミック粉末層を介在させたＡｌ複合材及びその製造方法
EP1187198A2 (en) 2000-09-04 2002-03-13 Dowa Mining Co., Ltd. Metal-ceramic circuit board and manufacturing method thereof
EP2214202A2 (en) 2000-09-04 2010-08-04 Dowa Metaltech Co., Ltd. Metal-ceramic circuit board
JP2005503039A (ja) * 2001-08-31 2005-01-27 シーメンス　アクチエンゲゼルシヤフト パワー電子ユニット
JP2013179374A (ja) * 2008-03-17 2013-09-09 Mitsubishi Materials Corp パワーモジュール用基板

Also Published As

Publication number Publication date
JPH0723964Y2 (ja) 1995-05-31

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