JPH0392035U - - Google Patents

Info

Publication number
JPH0392035U
JPH0392035U JP15226889U JP15226889U JPH0392035U JP H0392035 U JPH0392035 U JP H0392035U JP 15226889 U JP15226889 U JP 15226889U JP 15226889 U JP15226889 U JP 15226889U JP H0392035 U JPH0392035 U JP H0392035U
Authority
JP
Japan
Prior art keywords
metal film
substrate
electrode
film
film made
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15226889U
Other languages
English (en)
Other versions
JPH0810948Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15226889U priority Critical patent/JPH0810948Y2/ja
Publication of JPH0392035U publication Critical patent/JPH0392035U/ja
Application granted granted Critical
Publication of JPH0810948Y2 publication Critical patent/JPH0810948Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/923—Bond pads having multiple stacked layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/934—Cross-sectional shape, i.e. in side view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図乃至第３図は本考案の一実施例であり、
第１図は金属膜間にワイヤボンデイングを施した
状態の基板の要部縦断面図、第２図はスルーホー
ルを設けた絶縁膜の要部縦断面図、第３図は第２
図のＡ−Ａ線断面図である。第４図は従来例を示
し、金属膜間にワイヤボンデイングを施した状態
の基板の要部縦断面図である。 １０……基板、１１……第１の金属膜、１２…
…絶縁膜、１３……第２の金属膜、１３ａ，１３
ｂ……導通部、１４……金属膜電極、１５……ボ
ンデイングワイヤ。

Claims (1)

    【実用新案登録請求の範囲】
  1. 基板上にタンタル等からなる第１の金属膜を設
    け、その上面にシリコン等からなる絶縁膜を介し
    てニツケル又はクローム等の第２の金属膜を形成
    し、前記絶縁膜の外周縁部にて第２の金属膜を第
    １の金属膜へ電気的接続させ、更に、第２の金属
    膜の上面にアルミニウム又は金等からなる金属膜
    電極を形成したことを特徴とする回路基板に於け
    るボンデイングワイヤ用の金属膜電極。
JP15226889U 1989-12-29 1989-12-29 回路基板に於けるボンデイングワイヤ用の金属膜電極 Expired - Lifetime JPH0810948Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15226889U JPH0810948Y2 (ja) 1989-12-29 1989-12-29 回路基板に於けるボンデイングワイヤ用の金属膜電極

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15226889U JPH0810948Y2 (ja) 1989-12-29 1989-12-29 回路基板に於けるボンデイングワイヤ用の金属膜電極

Publications (2)

Publication Number Publication Date
JPH0392035U true JPH0392035U (ja) 1991-09-19
JPH0810948Y2 JPH0810948Y2 (ja) 1996-03-29

Family

ID=31698539

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15226889U Expired - Lifetime JPH0810948Y2 (ja) 1989-12-29 1989-12-29 回路基板に於けるボンデイングワイヤ用の金属膜電極

Country Status (1)

Country Link
JP (1) JPH0810948Y2 (ja)

Also Published As

Publication number Publication date
JPH0810948Y2 (ja) 1996-03-29

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