JPH0268449U - - Google Patents
Info
- Publication number
- JPH0268449U JPH0268449U JP1988149174U JP14917488U JPH0268449U JP H0268449 U JPH0268449 U JP H0268449U JP 1988149174 U JP1988149174 U JP 1988149174U JP 14917488 U JP14917488 U JP 14917488U JP H0268449 U JPH0268449 U JP H0268449U
- Authority
- JP
- Japan
- Prior art keywords
- plastic
- plastic resin
- semiconductor device
- thin film
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案による半導体ＩＣの一実施例を
示し、ａは断面図、ｂは上側図、ｃはアルミ薄板
形状、ｄはプラスチツク樹脂形状である。第２図
は本考案による半導体ＩＣの他の実施例を示しａ
は断面図、ｂは上側図、ｃはアルミ薄板形状、ｄ
はプラスチツク樹脂形状。 １……アルミ薄板、２……プラスチツク樹脂、
３……リードフレーム。
示し、ａは断面図、ｂは上側図、ｃはアルミ薄板
形状、ｄはプラスチツク樹脂形状である。第２図
は本考案による半導体ＩＣの他の実施例を示しａ
は断面図、ｂは上側図、ｃはアルミ薄板形状、ｄ
はプラスチツク樹脂形状。 １……アルミ薄板、２……プラスチツク樹脂、
３……リードフレーム。
Claims (1)
- プラスチツク樹脂の上部表面に、前記表面層よ
り反射率の高い薄膜を装着させた事を特徴とする
プラスチツク封止型半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988149174U JPH0268449U (ja) | 1988-11-15 | 1988-11-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988149174U JPH0268449U (ja) | 1988-11-15 | 1988-11-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0268449U true JPH0268449U (ja) | 1990-05-24 |
Family
ID=31421164
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988149174U Pending JPH0268449U (ja) | 1988-11-15 | 1988-11-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0268449U (ja) |
-
1988
- 1988-11-15 JP JP1988149174U patent/JPH0268449U/ja active Pending