JPH0270435U - - Google Patents
Info
- Publication number
- JPH0270435U JPH0270435U JP15025988U JP15025988U JPH0270435U JP H0270435 U JPH0270435 U JP H0270435U JP 15025988 U JP15025988 U JP 15025988U JP 15025988 U JP15025988 U JP 15025988U JP H0270435 U JPH0270435 U JP H0270435U
- Authority
- JP
- Japan
- Prior art keywords
- metal layer
- layer
- oxidation
- electrode structure
- back surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 claims 6
- 239000002184 metal Substances 0.000 claims 6
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- 239000013078 crystal Substances 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 229910052804 chromium Inorganic materials 0.000 claims 1
- 239000011651 chromium Substances 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000008188 pellet Substances 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Landscapes
- Die Bonding (AREA)
Description
第１図は本考案を説明する為の断面図、第２図
は従来例を説明する為の断面図である。
は従来例を説明する為の断面図である。
Claims (1)
- 【実用新案登録請求の範囲】 (1) シリコン基板の裏面に、柱状結晶を成す金
属層が複数層被着され、次いで接着用金属層、酸
化防止金属層が順次積層されたことを特徴とする
半導体ベレツトの裏面電極構造。 (2) 前記柱状結晶を成す金属層はクロム層、前
記接着用金属層は銅層、前記酸化防止金属層は金
層であることを特徴とする請求項第１項に記載の
半導体ペレツトの裏面電極構造。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15025988U JPH0270435U (ja) | 1988-11-17 | 1988-11-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15025988U JPH0270435U (ja) | 1988-11-17 | 1988-11-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0270435U true JPH0270435U (ja) | 1990-05-29 |
Family
ID=31423242
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15025988U Pending JPH0270435U (ja) | 1988-11-17 | 1988-11-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0270435U (ja) |
-
1988
- 1988-11-17 JP JP15025988U patent/JPH0270435U/ja active Pending
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