JPH0272565U - - Google Patents

Info

Publication number
JPH0272565U
JPH0272565U JP1988151642U JP15164288U JPH0272565U JP H0272565 U JPH0272565 U JP H0272565U JP 1988151642 U JP1988151642 U JP 1988151642U JP 15164288 U JP15164288 U JP 15164288U JP H0272565 U JPH0272565 U JP H0272565U
Authority
JP
Japan
Prior art keywords
surface electrode
receiving element
mount plate
semiconductor light
out structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988151642U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988151642U priority Critical patent/JPH0272565U/ja
Publication of JPH0272565U publication Critical patent/JPH0272565U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図はこの考案の一実施例のマウント板電極
導出構造を採用した半導体受光素子の断面図、第
２図は斜視図である。第３図は従来のボンデイン
グワイヤ導出構造を採用した半導体受光素子の断
面図、第４図は斜視図である。 １……半導体基板、３……接合面（受光面）、
４……絶縁膜、５……表面電極、６……ボンデイ
ングワイヤ、７……マウント板、７ａ……光通過
用穴、８……光フアイバ。

Claims (1)

  1. 【実用新案登録請求の範囲】 光信号を電気信号に変換する半導体受光素子の
    表面電極導出構造において、 前記表面電極を導電性マウント板を介して導出
    したことを特徴とする半導体受光素子電極導出構
    造。
JP1988151642U 1988-11-21 1988-11-21 Pending JPH0272565U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988151642U JPH0272565U (ja) 1988-11-21 1988-11-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988151642U JPH0272565U (ja) 1988-11-21 1988-11-21

Publications (1)

Publication Number Publication Date
JPH0272565U true JPH0272565U (ja) 1990-06-01

Family

ID=31425864

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988151642U Pending JPH0272565U (ja) 1988-11-21 1988-11-21

Country Status (1)

Country Link
JP (1) JPH0272565U (ja)

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