JPH02735U - - Google Patents

Info

Publication number
JPH02735U
JPH02735U JP7829088U JP7829088U JPH02735U JP H02735 U JPH02735 U JP H02735U JP 7829088 U JP7829088 U JP 7829088U JP 7829088 U JP7829088 U JP 7829088U JP H02735 U JPH02735 U JP H02735U
Authority
JP
Japan
Prior art keywords
resin
sealed
semiconductor device
outer shell
sealed semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7829088U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7829088U priority Critical patent/JPH02735U/ja
Publication of JPH02735U publication Critical patent/JPH02735U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第1図は本考案の実施例を示す樹脂封止半導体
装置の断面図、第2図は同樹脂封止半導体装置の
側面図、第3図は同樹脂封止半導体装置の外観斜
視図、第4図は従来の樹脂封止半導体装置の構成
図、第5図は同樹脂封止半導体装置の部分平面図
、第6図は従来の他の例を示す樹脂封止半導体装
置の構成図である。 11……封止樹脂、21……半導体素子、22
……アイランド、23……外部引き出しリード、
24……金属細線、25……上部球面状隆起外殻
、26……下部球面状隆起外殻。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 樹脂封止外殻の半導体素子周辺を球面状隆
    起形状に樹脂封止するようにしたことを特徴とす
    る樹脂封止半導体装置。 (2) 前記樹脂封止外殻の形状が上下対称である
    ことを特徴とする請求項1記載の樹脂封止半導体
    装置。
JP7829088U 1988-06-15 1988-06-15 Pending JPH02735U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7829088U JPH02735U (ja) 1988-06-15 1988-06-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7829088U JPH02735U (ja) 1988-06-15 1988-06-15

Publications (1)

Publication Number Publication Date
JPH02735U true JPH02735U (ja) 1990-01-05

Family

ID=31303226

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7829088U Pending JPH02735U (ja) 1988-06-15 1988-06-15

Country Status (1)

Country Link
JP (1) JPH02735U (ja)

Similar Documents

Publication Publication Date Title
JPS63178342U (ja)
JPH02735U (ja)
JPH0284329U (ja)
JPH024258U (ja)
JPH0279058U (ja)
JPS61203564U (ja)
JPH0313754U (ja)
JPH0245651U (ja)
JPH03101524U (ja)
JPH01145130U (ja)
JPH0217855U (ja)
JPS61151350U (ja)
JPS617038U (ja) 樹脂封止型半導体装置
JPH0474455U (ja)
JPH0328754U (ja)
JPS6298237U (ja)
JPS62163967U (ja)
JPH044767U (ja)
JPS6384958U (ja)
JPS63157947U (ja)
JPS6418734U (ja)
JPS63180928U (ja)
JPH0165145U (ja)
JPS6420746U (ja)
JPH01110435U (ja)