JPH028147U - - Google Patents

Info

Publication number
JPH028147U
JPH028147U JP1988086815U JP8681588U JPH028147U JP H028147 U JPH028147 U JP H028147U JP 1988086815 U JP1988086815 U JP 1988086815U JP 8681588 U JP8681588 U JP 8681588U JP H028147 U JPH028147 U JP H028147U
Authority
JP
Japan
Prior art keywords
ceramic
heat dissipation
ceramic mold
houses
protects
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988086815U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988086815U priority Critical patent/JPH028147U/ja
Publication of JPH028147U publication Critical patent/JPH028147U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • H10W74/10Encapsulations, e.g. protective coatings characterised by their shape or disposition

Description

【図面の簡単な説明】
第1図は本考案のセラミツクICの一実施例を
示す外観斜視図である。 図において、1……セラミツクIC、2……セ
ラミツク・モールド、2a……放熱フイン、3…
…端子ピン。

Claims (1)

  1. 【実用新案登録請求の範囲】 ICチツプを内蔵し保護すると共に、複数の端
    子ピンが外部に露出して設けられているセラミツ
    ク・モールドにより構成されるセラミツクICに
    おいて、 前記セラミツク・モールドの一部に放熱フイン
    を一体に形成したことを特徴とするセラミツクI
    C。
JP1988086815U 1988-06-30 1988-06-30 Pending JPH028147U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988086815U JPH028147U (ja) 1988-06-30 1988-06-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988086815U JPH028147U (ja) 1988-06-30 1988-06-30

Publications (1)

Publication Number Publication Date
JPH028147U true JPH028147U (ja) 1990-01-19

Family

ID=31311456

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988086815U Pending JPH028147U (ja) 1988-06-30 1988-06-30

Country Status (1)

Country Link
JP (1) JPH028147U (ja)

Similar Documents

Publication Publication Date Title
JPH028147U (ja)
JPH0361386U (ja)
JPH01171045U (ja)
JPH0265347U (ja)
JPS5937747U (ja) 半導体装置
JPS61207037U (ja)
JPS63101481U (ja)
JPS6169845U (ja)
JPH0254263U (ja)
JPS628643U (ja)
JPS61199056U (ja)
JPS6420740U (ja)
JPS62128636U (ja)
JPH0179842U (ja)
JPH01115247U (ja)
JPH0179851U (ja)
JPS62122350U (ja)
JPS6219750U (ja)
JPH0211352U (ja)
JPS61190143U (ja)
JPH0241453U (ja)
JPS6328278U (ja)
JPH0276844U (ja)
JPH01169037U (ja)
JPH0217851U (ja)