JPH0283913A - Conductive paste application to edge face of chip-shaped electronic component - Google Patents

Abstract

PURPOSE:To apply conductive paste uniformly by putting a holding plate having elastic holes slightly smaller than a diameter of electronic component between a base plate and a guide plate 6, which have through holes slightly larger than the diameter of electronic component and fitting electronic components thereinto from the guide plate. CONSTITUTION:For instance, an elastic holding plate 4 being 1mm thick and having through holes 3 1mm in diameter is placed on a base-plate 2 made of stainless steel being 2mm thick and having through holes 1 1.5mm in diameter. Next, a guide plate 6 having through holes 5 1.5mm in diameter is placed on the holding plate 4. An electronic component 7 in the shape of a cylindrical chip being 1.25mm in diameter and 2mm long is fitted into the through holes 5 in the guide plate 6. Next, the components 7 are pushed in with pins 8 until both ends are projected from the through holes 3 of the holding plate 4 in order to apply conductive paste 9 to one edge face of the component 7 by roller printing while removing the guide plate 6. Then, the holding plate 4 is reversed for applying conductive paste 9' to the other edge face of the component 7.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method of applying a conductive paste to an end surface of a chip-shaped electronic component.

(Prior Art) Conventionally, the following two methods are known as methods for applying conductive paste to the end face of a chip-shaped electronic component.

The first method, as shown in FIG. 6, is to attach a guide plate d to one side of a plate C made of an elastic material, which has a through hole smaller than the outer diameter and longer than the length of the chip-shaped electronic component a. The electronic component a placed in the through hole e is placed on the plate c
As shown in FIG. Push the component a until the end surface protrudes, and apply conductive paste f' to the other end surface of the electronic component a, as shown in FIG.
is applied, and then the electronic component a is extruded from the plate C (see, for example, Japanese Patent Publication No. 1982-2H85).
.

The second method is to use a chip-shaped electronic component a as shown in FIG.
The child part a is pushed into the through hole 7 of the plate c made of an elastic material, which has a through hole shorter than the length, so that both end surfaces thereof protrude, and a conductive paste f is applied to both end surfaces using a roller printing machine or the like. After that, the electronic component a is extruded from the plate c (see Japanese Patent Publication No. 81-503G5).

(Problems to be Solved by the Invention) According to the first conventional method described above, the electronic component a must be pushed in from one side of the plate c and then pushed in three times until it is pushed out from the other side. However, a fairly large force is required to push the electronic component a into the plate C, and this is particularly necessary for cylindrical electronic components because the entire side surface of the cylinder comes into contact with the wall of the through hole. Since electronic components are small, electronic components a
There was a problem in that cracks were likely to occur in the product, making it easy to produce defective products.

According to the second method, when the conductive paste f is applied to the end face of the electronic component a in the state shown in FIG. There was a problem that the number of children was uneven, and unevenness was likely to occur.

The present invention aims to solve these conventional problems.

(Means for Solving the Problems) In order to achieve the above object, the present invention provides a bottom plate having a plurality of through holes, and a hole having a diameter slightly smaller than that of a chip-shaped electronic component at a position corresponding to the through hole of the bottom plate. A holding plate having a thickness thinner than the length of the electronic component and having a through hole with at least an inner wall formed of an elastic material and having a diameter smaller than the length of the electronic component is placed, A guide plate provided with a through hole having a somewhat large diameter is placed on the holding plate so that the through hole corresponds to the through hole of the holding plate, and an electronic component is fitted into the through hole of the guide plate. , push the electronic component until both ends of the electronic component are exposed from both sides of the holding plate, remove the guide plate from the holding plate, and place a conductor on one end surface of the electronic component protruding from one side of the holding plate. Apply the paste, invert the holding plate so that the electronic component protruding from one side of the holding plate fits into the through hole of the bottom plate, and then remove the other electronic component protruding from the other side of the holding plate again. The feature is that a conductive paste is applied to the end face of the

(Function) Since the holding plate is thin, when pushing the electronic component into the through hole of the holding plate, the contact area between the electronic component and the holding plate is small, and therefore the force pushing the electronic component into the through hole is small.

The number of times electronic components are pushed in is also reduced. the result,
Defective products are less likely to occur. Furthermore, since the holding plate is placed on the bottom plate, the holding plate does not bend when applying the conductive paste to the end face of the electronic component (1i).Therefore, the conductive paste is evenly applied to the end face of the electronic component.

(Example) Embodiments of the present invention will be described below with reference to the drawings.

As shown in the first figure, for example, a stainless steel bottom plate 2 with a thickness of 2.0 mm is provided with circular through holes 1 of 1.5 mm in diameter regularly, and a diameter Thickness 1.0 with a through hole 3 having a diameter of 1.0 mm. f)1
A holding plate 4 made of an elastic material having a length of 11 m is placed on it, and a guide plate 6 with a through hole 5 having a diameter of 1.5 mm corresponding to the through hole 3 of the holding plate 4 is placed so as to correspond to the through hole 3 of the holding plate 4. A cylindrical chip-shaped electronic component 7 with a diameter of 1.25 m and a length of 2.0 mm is placed on the guide plate G and is vibrated in the horizontal direction to remove the through hole 5 of the guide plate 6. and remove the electronic parts 7 that did not fit. Then the second
As shown in the figure, the electronic component 7 is pushed in with the pin 8 shown in the first figure until its both ends protrude from the through hole 3 of the holding plate 4, and the guide plate 6 is removed from the holding plate 4 as shown in the third figure. A conductive paste 9 is applied to one end surface of the component 7 using a roller printing device, and is dried by heating at 150° C. for 10 minutes.

Next, as shown in the fourth figure, the holding plate 4 is turned over so that one end of the protruding electronic component 7 fits into the through hole 1 of the bottom plate 2, and a conductive paste 9' is again applied to the other end surface of the electronic component 1. After drying, the electronic component 7 held on the holding plate 4 is pushed out from the through hole 1 of the bottom plate 2 using a bottle 8 as shown in FIG.

In the above embodiment, the retention! Although the through hole 24 is made of an elastic material, only the inner wall of the through hole 3 may be made of an elastic material. Further, in the above embodiment, a cylindrical chip-shaped electronic component was used, but it goes without saying that any cylindrical chip-shaped electronic component or the like may be used.

(Effects of the Invention) Since the present invention has the above-described configuration, it is possible to reduce the number of times the electronic component is pushed into the through hole of the holding plate, and the pushing force can be reduced, resulting in defective electronic components. can reduce the occurrence of Further, there is no unevenness in the amount of conductive paste applied to the end face of the electronic component.

[Brief explanation of the drawing]

1 to 5 are cross-sectional views showing each step of an embodiment of the method of the present invention, FIGS. 6 to 8 are cross-sectional views showing each step of a conventional method, and FIG. 9 is a cross-sectional view showing each step of a conventional method. FIG. 7 is a cross-sectional view illustrating another method. 1.3.5...Through hole 2...Bottom plate 4
...Holding plate 6...Guide plate 7...Chip-shaped electronic component 8...Bin 9.9'...Conductive paste Fig. 1 Fig. 21! ! Figure 5Figure 4

Claims (1)

[Claims] A bottom plate having a plurality of through holes is provided with a through hole having a diameter slightly smaller than the diameter of the chip-shaped electronic component and having at least an inner wall formed of an elastic material at a position corresponding to the through holes of the bottom plate. A holding plate with a thickness thinner than the length of the electronic component is placed thereon, and a guide plate is provided with a through hole having a diameter slightly larger than the diameter of the electronic component corresponding to the through hole of the holding plate. Place the electronic component on the holding plate so as to correspond to the through-hole of the holding plate, fit the electronic component into the through-hole of the guide plate, and push the electronic component until both ends of the electronic component are exposed from both sides of the holding plate, The guide plate is removed from the holding plate, a conductive paste is applied to one end face of the electronic component protruding from one side of the holding plate, and the electronic component protruding from one side of the holding plate penetrates the bottom plate. Applying conductive paste to the end face of a chip-shaped electronic component, characterized in that the holding plate is reversed so as to fit into the hole, and the conductive paste is again applied to the other end face of the electronic component protruding from the other side of the holding plate. Method.