JPH0284328U - - Google Patents
Info
- Publication number
- JPH0284328U JPH0284328U JP1988163586U JP16358688U JPH0284328U JP H0284328 U JPH0284328 U JP H0284328U JP 1988163586 U JP1988163586 U JP 1988163586U JP 16358688 U JP16358688 U JP 16358688U JP H0284328 U JPH0284328 U JP H0284328U
- Authority
- JP
- Japan
- Prior art keywords
- film
- silver
- noble metal
- bonding
- based noble
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Wire Bonding (AREA)
Description
第１図および第２図は本考案によるボンデイン
グ構造の各実施例をそれぞれ示す断面図で、第３
図および第４図はそれぞれ従来のボンデイング構
造を示す断面図である。
グ構造の各実施例をそれぞれ示す断面図で、第３
図および第４図はそれぞれ従来のボンデイング構
造を示す断面図である。
Claims (1)
- 【実用新案登録請求の範囲】 １ 厚膜印刷により導体配線として銅膜を形成し
た基板上に、前記銅膜に一部を接続して銀系貴金
属膜を形成し、前記銀系貴金属膜にボンデイング
用金線の一端を接合したことを特徴とするボンデ
イングパツドの構造。 ２ 厚膜印刷により導体配線として銅膜を形成し
た基板上に、前記銅膜に一部を接続して銀系貴金
属膜を形成し、基板上に前記銀系貴金属に一部を
接続させて金膜を形成し、前記金膜上にボンデイ
ング用金線の一端を接合したことを特徴とするボ
ンデイングパツドの構造。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988163586U JPH0284328U (ja) | 1988-12-17 | 1988-12-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988163586U JPH0284328U (ja) | 1988-12-17 | 1988-12-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0284328U true JPH0284328U (ja) | 1990-06-29 |
Family
ID=31448438
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988163586U Pending JPH0284328U (ja) | 1988-12-17 | 1988-12-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0284328U (ja) |
-
1988
- 1988-12-17 JP JP1988163586U patent/JPH0284328U/ja active Pending