JPH0289871U - - Google Patents
Info
- Publication number
- JPH0289871U JPH0289871U JP17055988U JP17055988U JPH0289871U JP H0289871 U JPH0289871 U JP H0289871U JP 17055988 U JP17055988 U JP 17055988U JP 17055988 U JP17055988 U JP 17055988U JP H0289871 U JPH0289871 U JP H0289871U
- Authority
- JP
- Japan
- Prior art keywords
- pad
- modification
- surface mount
- printed circuit
- wires
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000004048 modification Effects 0.000 claims description 7
- 238000012986 modification Methods 0.000 claims description 7
- 238000005476 soldering Methods 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 7
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第１図は本考案の一実施例の表面実装部品用プ
リント基板を示す図、第２図は第１図のプリント
基板の改造後の状態を示す図、第３図は第２図中
一の改造ワイヤの構造を示す図、第４図は第２図
中別の改造ワイヤの構造を示す図、第５図は本考
案の別の実施例の表面実装部品用プリント基板を
示す図、第６図は第５図のプリント基板の改造後
の状態を示す図、第７図は従来の表面実装部品用
プリント基板を示す図、第８図は第７図のプリン
ト基板の改造後の状態を示す図である。
図において、１０，５０は表面実装部品用プリ
ント基板、１１−１，１１−２は半田付けパツド
、１２−１，１２−２は第１の改造用パッド、１
７−１，１７−２は第１の接地用パツド、１８−
１，１８−２は配線パターン、１９−１はスルー
ホール、２０は接地パターン、２１はＰＧＡ部品
実装領域、２２はＰＧＡ部品、２３−１，２３−
２はピン端子、２５−１は第２の改造用パッド、
３０−１は第２の接地用パツド、４０，４３信号
線、４１，４４，４５は接地線、４２，４６は改
造ワイヤ、を示す。
Figure 1 is a diagram showing a printed circuit board for surface mount components according to an embodiment of the present invention, Figure 2 is a diagram showing the state of the printed circuit board in Figure 1 after modification, and Figure 3 is a diagram showing the state of the printed circuit board in Figure 2. Fig. 4 is a diagram showing the structure of a modified wire; Fig. 4 is a diagram showing the structure of another modified wire in Fig. 2; Fig. 5 is a diagram showing a printed circuit board for surface mount components according to another embodiment of the present invention; The figure shows the state of the printed circuit board in FIG. 5 after being modified, FIG. 7 shows the conventional printed circuit board for surface mount components, and FIG. 8 shows the state of the printed circuit board in FIG. 7 after being modified. It is a diagram. In the figure, 10 and 50 are printed circuit boards for surface mount components, 11-1 and 11-2 are soldering pads, 12-1 and 12-2 are first modification pads, and 1
7-1, 17-2 are first grounding pads, 18-
1, 18-2 are wiring patterns, 19-1 are through holes, 20 are ground patterns, 21 are PGA component mounting areas, 22 are PGA components, 23-1, 23-
2 is a pin terminal, 25-1 is a second modification pad,
30-1 is a second grounding pad, 40, 43 signal lines, 41, 44, 45 are grounding wires, and 42, 46 are modified wires.
Claims (1)
れる半田付けパツド１１−１と、 該半田付けパツド１１−１と導通接続して設け
てあり改造のときに改造ワイヤ４２のうちの信号
線４０が接続される改造用パッド１２−１と、 該改造用パッド１２−１に対応して設けてあり
、上記改造ワイヤ４２のうちの接地線４１が接続
される接地パターン２０と導通接続された接地用
パツド１７−１とを設けてなる構成の表面実装部
品用プリント基板。[Claims for Utility Model Registration] A soldering pad 11-1 to which a terminal 23-1 of a surface mount component 22 is soldered, and a soldering pad 11-1 that is provided in a conductive connection with the soldering pad 11-1 and is modified at the time of modification. A modification pad 12-1 to which the signal line 40 of the wires 42 is connected; and a ground provided corresponding to the modification pad 12-1 to which the ground wire 41 of the modification wires 42 is connected. A printed circuit board for surface mount components comprising a pattern 20 and a grounding pad 17-1 electrically connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17055988U JPH0289871U (en) | 1988-12-28 | 1988-12-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17055988U JPH0289871U (en) | 1988-12-28 | 1988-12-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0289871U true JPH0289871U (en) | 1990-07-17 |
Family
ID=31461614
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17055988U Pending JPH0289871U (en) | 1988-12-28 | 1988-12-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0289871U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008309146A (en) * | 2007-05-16 | 2008-12-25 | Denso Corp | Ignition device for internal combustion engine |
| JP2013102001A (en) * | 2011-11-07 | 2013-05-23 | Panasonic Corp | Wiring board and organic device using the same |
-
1988
- 1988-12-28 JP JP17055988U patent/JPH0289871U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008309146A (en) * | 2007-05-16 | 2008-12-25 | Denso Corp | Ignition device for internal combustion engine |
| JP2013102001A (en) * | 2011-11-07 | 2013-05-23 | Panasonic Corp | Wiring board and organic device using the same |
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